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SN74CBTD3861PWR
+StücklisteIC BUS SWITCH 10 X 1:1 24TSSOP
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HerstellerTexas Instruments
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Herstellerteil #SN74CBTD3861PWR
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Paket TSSOP-24
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Auf Lager6494
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | 74CBTD |
| Part Status | Active |
| Type | Bus Switch |
| Circuit | 10 x 1:1 |
| Independent Circuits | 1 |
| Voltage Supply Source | Single Supply |
| Voltage - Supply | 4.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
Übersicht
Description
The SN74CBTD3861PWR operates within a VCC range of 4V to 5.5V and is commonly used in digital logic level shifting, data bus isolation, and multiplexing applications. With 10 channels, it offers a wide bandwidth and low propagation delay, facilitating efficient signal transmission. The device is housed in a TSSOP package, offering a compact and space-saving solution for circuit designs. Its reliability and performance make it a popular choice in various communication, computing, and consumer electronics applications.
Equivalent
1. Fairchild Semiconductor: FST33861
2. NXP Semiconductors: CBTD3384 or CBTD16211
3. ON Semiconductor: NLAS3384 or NL27WZ02
These equivalents should be evaluated for compatibility in terms of electrical characteristics, package type, and pin configuration. Always verify specifications from the manufacturer to ensure they meet your design requirements.
Features
1. Low ON-State Resistance: The device ensures low resistance when conducting, minimizing signal distortion and power loss.
2. Voltage Translation: It can translate voltages from 5V to 3.3V, providing flexibility for interfacing between different logic levels.
3. Bidirectional Data Flow: Supports data flow in both directions, making it suitable for interfacing between various system components.
4. High Bandwidth: Designed to handle high-frequency signals, ideal for applications requiring fast data transfer.
5. Break-Before-Make Switching: Prevents unintended short circuits by ensuring that the new connection is established before breaking the previous one.
6. Power-Down Support: The device sustains high-impedance during power down, preventing backflow of current.
7. Compact Package: Available in a TSSOP (Thin Shrink Small Outline Package), saving board space and allowing for streamlined designs.
These features make it suitable for a variety of digital applications, including computing, networking, and telecommunications.
Pinout
Manufacturer
Application
1. Data Communication Systems: Facilitates signal routing and level translation between different voltage domains.
2. Microcontroller Interfacing: Connects low-voltage microcontrollers with higher-voltage peripherals.
3. Memory Module Interfacing: Used in environments with mixed supply voltages for efficient data handling.
4. Portable Devices: Useful in low-power applications requiring efficient signal management.
5. PC and Peripheral Equipment: Integrates into systems needing flexible, high-speed data switching.
It is valued for low ON-state resistance and minimal propagation delay, making it ideal for high-speed applications.