Abbildungen dienen nur als Referenz
IC BUFF NON-INVERT 3.6V 48-TSSOP
-
HerstellerTexas Instruments
-
Herstellerteil #SN74LVT16244BDGGR
-
Datenblatt SN74LVT16244BDGGR DataSheet
-
Auf Lager5412
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Series | 74LVT |
| Part Status | Active |
| Logic Type | Buffer, Non-Inverting |
| Number of Elements | 4 |
| Number of Bits per Element | 4 |
| Output Type | 3-State |
| Current - Output High, Low | 32mA, 64mA |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.240", 6.10mm Width) |
| Supplier Device Package | 48-TSSOP |
| Base Product Number | 74LVT16244 |
Übersicht
Description
The SN74LVT16244BDGGR features four groups of four buffers each, providing the capability to drive large bus lines or to buffer memory address registers. The 3-state outputs make it suitable for driving bus lines with minimized signal degradation. It includes input and output clamps, which help protect against overshoot and undershoot, increasing reliability.
Packaged in the TSSOP (Thin Shrink Small Outline Package) with 48 pins, it is suitable for surface-mount technology, saving board space. Common applications include data communication, electronic test equipment, and memory systems, where efficient data flow and signal integrity are crucial.
Equivalent
1. 74LVC16244A by Nexperia
2. 74ALVCH16244 by ON Semiconductor
3. 74ACT16244 by Texas Instruments
4. MC74LCX16244 by ON Semiconductor
These ICs share similar functionalities and specifications, such as voltage levels and 3-state outputs, making them suitable substitutes in many applications. Always check the datasheets for exact compatibility.
Features
1. Voltage Level: Operates with a supply voltage range of 2.7 V to 3.6 V, making it suitable for low-voltage applications.
2. Drive Capability: Offers high drive capability with outputs capable of driving up to ±12 mA, ensuring strong signal integrity over long distances.
3. 3-State Outputs: Provides three-state control, allowing for easy bus interfacing in complex systems by enabling or disabling output without affecting the signal.
4. High-Impedance State: Features a high-impedance state for both the input and output when disabled, minimizing power consumption and avoiding bus conflicts.
5. Enhanced ESD Protection: Equipped with enhanced electrostatic discharge protection, ensuring greater reliability and robustness in harsh environments.
6. Wide Operating Temperature Range: Supports an operating temperature range from -40°C to 85°C, suitable for various industrial applications.
7. Integrated Design: Available in a compact TSSOP package, it provides space efficiency in circuit design.
These features make it ideal for buffering and driving applications in computing and communication systems.
Pinout
Functionally, this device is used for signal buffering and driving applications, providing high drive capability and reducing signal degradation over long lines. It features four groups of 4-bit buffers, each with its own output enable pin, allowing for flexible control of input-to-output data transfer. The 3-state outputs permit the device to drive bus lines directly or to be used in bus-oriented systems.
In terms of operation, when the output enable (OE) input is low, the corresponding 4-bit buffer outputs reflect the data present on the inputs. When OE is high, the outputs are in a high-impedance state, effectively disconnecting them from the bus and allowing for sharing of the bus with other devices. This high-impedance state is crucial for applications involving multiple devices connected to a common bus.
Manufacturer
Application
1. Bus Interface: Enhancing signal integrity for data buses in computing and communication devices.
2. Data Communication: Used in networking equipment to manage signal flow in data-heavy environments.
3. Memory Systems: Buffering data in DRAM or SRAM interfaces for efficient memory operation.
4. Peripheral Interface: Connecting microcontrollers or processors to peripherals while minimizing signal degradation.
5. Backplane Drivers: Driving signals across long PCB traces or connectors in modular systems.
These applications benefit from its ability to drive large loads and reduce signal noise.