Abbildungen dienen nur als Referenz
TBD62783AFG
+StücklisteIC PWR SWITCH N-CHAN 1:1 18SOP
-
HerstellerToshiba Halbleiter und Speicher
-
Herstellerteil #TBD62783AFG
-
Datenblatt TBD62783AFG DataSheet
-
Paket SOIC-18
-
Auf Lager5719
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tape & Reel (TR) |
| Part Status | Active |
| Switch Type | General Purpose |
| Number of Outputs | 8 |
| Ratio - Input: Output | 1:1 |
| Output Configuration | High Side |
| Output Type | P-Channel |
| Interface | On/Off |
| Voltage - Load | 50V (Max) |
| Voltage - Supply (Vcc/Vdd) | Not Required |
| Current - Output (Max) | 500mA |
| Input Type | Non-Inverting |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 18-SOP |
Übersicht
Description
Equivalent
Features
1. High-Voltage Tolerance: Can handle higher voltage levels, suitable for driving motors, relays, or lamps.
2. Multiple Output Channels: Often includes several channels for controlling multiple loads simultaneously.
3. Darlington Transistor Array: Incorporates Darlington pairs for each channel to provide high current gain.
4. Built-in Clamp Diodes: Protects against voltage spikes from inductive loads.
5. Low Input Current: Designed to minimize the input current required, making it efficient for microcontroller interfaces.
6. Thermal Protection: May include features to prevent overheating.
7. Compact Package: Available in a small, space-efficient design for easy integration into various electronic systems.
These features make the TBD62783AFG ideal for applications requiring reliable and efficient power control, such as in automotive, industrial, and consumer electronics.
Pinout
Key features include thermal shutdown, overcurrent protection, and output clamp diodes, providing protection against overvoltage and overcurrent conditions. It is often used in automotive and industrial applications due to its reliability and efficiency in handling high currents. The package type is a surface-mount, flat package suitable for compact designs.