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THGBMFG6C1LBAIL
+StücklisteIC FLASH 64GBIT EMMC 153FBGA
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HerstellerKioxia America, Inc.
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Herstellerteil #THGBMFG6C1LBAIL
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Auf Lager1284
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Part Status | Obsolete |
| Base Product Number | THGBMF |
| DigiKey Programmable | Not Verified |
| Memory Format | FLASH |
| Memory Size | 64Gbit |
| Mounting Type | Surface Mount |
| Supplier Device Package | 153-FBGA (11.5x13) |
| Packaging | Tray |
Übersicht
Description
This particular model may utilize advanced memory technology such as 3D NAND, which stacks memory cells vertically to increase storage density and improve performance. Its compact form factor allows for integration into space-constrained devices, while its robust design ensures data integrity and reliability over extended periods of use.
Overall, the THGBMFG6C1LBAIL represents a modern solution for the growing demands of digital storage, offering a balance between performance, capacity, and energy efficiency. For exact specifications and compatibility, it is recommended to consult the manufacturer's datasheet or technical documentation.
Equivalent
1. Samsung's KLMAG2GEND-B031
2. Micron's MT29F64G08CBABAWP
3. Western Digital/SanDisk's SDIN9BW4-64G
These chips generally offer similar storage capacities and performance characteristics, though specific features may vary depending on the manufacturer's technology and design.
Features
1. Capacity: Typically offers a range of storage capacities, often up to 64GB or more, suitable for various applications.
2. Form Factor: Comes in a compact BGA (Ball Grid Array) package, making it ideal for space-constrained environments.
3. Interface: Utilizes the eMMC interface standard, providing a balance of performance and cost-effectiveness for embedded applications.
4. Performance: Offers decent read and write speeds that are suitable for consumer electronics like smartphones, tablets, and other portable devices.
5. Reliability: Includes features for data integrity and error correction, enhancing the reliability of data storage.
6. Power Efficiency: Designed to operate with low power consumption, which is essential for battery-powered devices.
7. Compatibility: Conforms to the JEDEC eMMC standard, ensuring broad compatibility with various devices and systems.
These features make the THGBMFG6C1LBAIL a versatile choice for embedded storage solutions in consumer electronics.
Pinout
The primary function of this chip is to provide storage in a compact form factor, suitable for a range of devices including smartphones, tablets, and other portable electronics. It manages NAND flash operations internally, including wear leveling, error correction, and bad block management, thus simplifying the design and integration process for device manufacturers.
For precise information regarding the pin count and detailed specifications, consulting the official datasheet or technical documentation from the manufacturer would be necessary, as variations can occur across different versions or manufacturing updates.
Manufacturer
Application
Package
Frequently Asked Questions
Q: Is this NAND Flash component still available for new designs?
A: No, the Part Status is marked as Obsolete, making it unsuitable for new designs. It is only for legacy or maintenance applications.
Q: What is the memory capacity of the THGBMFG6C1LBAIL?
A: It has a memory size of 64Gbit (8GB), stored in FLASH format, suitable for high-density data storage.
Q: What package type does this device use?
A: It comes in a 153-FBGA (11.5x13) package, designed for surface mount assembly on PCBs.
Q: Is this chip programmable via standard tools?
A: DigiKey Programmable is marked as “Not Verified,” meaning programmability is not validated by the distributor; refer to Kioxia’s documentation.
Q: What is the base product number for this memory component?
A: The base product number is THGBMF, indicating it belongs to Kioxia’s eMMC or NAND Flash family.
Q: Is the component RoHS compliant?
A: RoHS status is not specified in the provided parameters. Verify with the supplier or datasheet for compliance details.
Q: Can this part be used in portable consumer electronics?
A: Yes, with its surface mount FBGA package and 64Gbit capacity, it is suitable for mobile devices, but only for existing designs due to obsolescence.