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THGBMFG7C1LBAIL
+StücklisteIC FLASH 128GBIT MMC 153FBGA
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HerstellerKioxia America, Inc.
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Herstellerteil #THGBMFG7C1LBAIL
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Auf Lager3130
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Part Status | Obsolete |
| Base Product Number | THGBMF |
| DigiKey Programmable | Not Verified |
| Memory Format | FLASH |
| Memory Size | 128Gbit |
| Memory Interface | MMC |
| Mounting Type | Surface Mount |
| Supplier Device Package | 153-FBGA (11.5x13) |
| Packaging | Tray |
Übersicht
Description
Key features of the THGBMFG7C1LBAIL include high storage capacity, efficient data management, and enhanced performance. It supports features like the JEDEC standard interface for compatibility across various platforms and devices. The chip also includes wear leveling, bad block management, and error correction code (ECC) to ensure data integrity and longevity. Its compact form factor makes it suitable for space-constrained applications, while its low power consumption helps extend battery life in portable devices. Overall, the THGBMFG7C1LBAIL is a reliable and efficient choice for embedded storage solutions.
Equivalent
Features
1. Type: It is a NAND flash memory chip, typically used for data storage in various electronic devices.
2. Capacity: This model generally comes with a specific storage capacity, often found in eMMC configurations.
3. Technology: It utilizes advanced NAND technology, which might include 3D NAND for higher density and performance.
4. Performance: Offers fast read/write speeds suitable for mobile devices, embedded systems, and more.
5. Interface: Usually supports eMMC interface standards, providing reliable connectivity and data transfer.
6. Form Factor: Compact size, making it suitable for smartphones, tablets, and other space-constrained applications.
7. Power Efficiency: Designed to consume low power, extending battery life in portable devices.
8. Reliability: Includes error correction and wear leveling features for data integrity and longevity.
These features make the THGBMFG7C1LBAIL a versatile choice for manufacturers looking to integrate reliable flash storage into their products.
Pinout
The THGBMFG7C1LBAIL typically comes in a Ball Grid Array (BGA) package format. The pin count for this type of e-MMC device can vary, but commonly they have a pin count that ranges from 153 to 169 balls, depending on the specific design and manufacturer specifications. This specific module is aimed at providing storage solutions for applications like smartphones, tablets, and other consumer electronics that require high-capacity storage and efficient data management.
The main functions of the THGBMFG7C1LBAIL include providing non-volatile storage for data, supporting boot operations, and handling various read and write operations efficiently. It offers advantages like wear leveling, bad block management, and error correction, thus ensuring data integrity and prolonged lifespan of the storage module.
Manufacturer
Application
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Frequently Asked Questions
Q: What is the memory capacity of this Kioxia FLASH component?
A: It has a 128Gbit memory size, suitable for high-density data storage applications.
Q: What memory interface does the THGBMFG7C1LBAIL use?
A: It uses an MMC (MultiMediaCard) interface for reliable data communication.
Q: Is this component mounted on a surface or through-hole?
A: It supports Surface Mount (SMD) technology for compact PCB designs.
Q: What is the package type for this FLASH memory?
A: It comes in a 153-FBGA (Fine-pitch Ball Grid Array) package, measuring 11.5x13 mm.
Q: Is the THGBMFG7C1LBAIL still in active production?
A: No, its Part Status is marked as Obsolete, so it may not be available for new designs.
Q: What packaging format is used for delivery?
A: It is packaged in Tray format, typical for bulk handling during assembly.
Q: Can this memory be used for embedded storage in portable devices?
A: Yes, its FLASH format and MMC interface make it ideal for multimedia and embedded storage.