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THGBMHG7C1LBAIL
+StücklisteIC FLASH 128GBIT EMMC 153WFBGA
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HerstellerKioxia America, Inc.
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Herstellerteil #THGBMHG7C1LBAIL
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Paket FBGA-153
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Auf Lager1852
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | e•MMC™ |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 128Gb (16G x 8) |
| Memory Interface | eMMC |
| Clock Frequency | 52 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -25°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
Key features of the THGBMHG7C1LBAIL include its compact size, which is beneficial for devices where space is a premium, and its ability to manage data efficiently, offering improved performance and power efficiency. The e-MMC specification also supports a range of features like boot partitions, replay protected memory block (RPMB), and enhanced user data area, providing flexibility and security for system designers.
The THGBMHG7C1LBAIL is valued for its balance of performance, capacity, and cost-effectiveness, making it a popular choice among OEMs looking to enhance their products' storage capabilities without adding complexity to their designs.
Equivalent
1. Samsung's e-MMC KLM8G1WEMB-B031.
2. SanDisk's iNAND eMMC products.
3. Micron's e-MMC MTFC16GAKAEJ-4M IT.
4. Kingston's e-MMC EMMC08G-M627.
These products offer similar storage solutions and functionalities but may vary in specific features like capacity and read/write speeds.
Features
1. 3D NAND Technology: It employs BiCS FLASH™ 3D technology, offering higher density and improved performance over traditional 2D NAND.
2. Capacity: Available in various storage capacities, making it suitable for a wide range of applications from consumer electronics to enterprise solutions.
3. Performance: Enhanced read and write speeds due to its advanced architecture, beneficial for high-speed storage needs.
4. Endurance and Reliability: 3D NAND generally provides better endurance and reliability, offering longer lifespan and higher durability.
5. Power Efficiency: Designed to be power-efficient, which is crucial for battery-powered devices such as smartphones and laptops.
6. Compact Form Factor: Typically available in a small package size, allowing for integration into slim devices.
These features make the THGBMHG7C1LBAIL suitable for various applications requiring efficient and reliable data storage solutions.
Pinout
This specific model features a Ball Grid Array (BGA) package. Although the exact pin count can vary slightly depending on the exact configuration and revision, e-MMC devices like this one usually have a pin count in the range of 153 to 169 balls.
The primary functions of this memory chip are to provide non-volatile storage and manage data via a standardized interface. It includes a built-in controller, which simplifies the integration process by handling tasks such as error correction, wear leveling, and bad block management. The e-MMC interface supports multiple commands and data transfer protocols, enabling it to operate efficiently in various environments.
For precise details regarding pin layout and specific functions, refer to the manufacturer's datasheet or technical documentation for the THGBMHG7C1LBAIL.