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THGBMHG8C2LBAIL
+StücklisteIC FLASH 256GBIT EMMC 153WFBGA
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HerstellerKioxia America, Inc.
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Herstellerteil #THGBMHG8C2LBAIL
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Paket FBGA-153
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Auf Lager4371
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | e•MMC™ |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 256Gb (32G x 8) |
| Memory Interface | eMMC |
| Clock Frequency | 52 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -25°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
The THGBMHG8C2LBAIL is used in various electronic devices, such as smartphones, tablets, and other consumer electronics, where efficient data storage and retrieval are crucial. The 3D architecture of BiCS FLASH™ allows for stacking memory cells vertically, which enables a higher density of storage without increasing the physical footprint of the chip. This makes it ideal for applications that require robust storage capabilities within compact devices. The technology behind this model focuses on improving the endurance, performance, and scalability of NAND flash memory to meet growing data storage demands.
Equivalent
Features
1. 3D NAND Technology: Employs Kioxia's proprietary BiCS FLASH 3D NAND architecture, which stacks memory cells vertically to achieve higher densities and improved performance.
2. High Capacity: Offers substantial data storage capacity, making it suitable for a wide range of devices, including smartphones, tablets, and other consumer electronics.
3. Enhanced Performance: Designed to provide fast read and write speeds, helping to improve system performance and responsiveness in devices that use this memory chip.
4. Energy Efficiency: Built to consume less power, which helps extend battery life in portable devices.
5. Reliability: Incorporates advanced error correction and management features to ensure data integrity and reliability over the lifespan of the chip.
6. Compact Form Factor: Available in a compact package suitable for integration into various compact devices.
These features make the THGBMHG8C2LBAIL an ideal choice for high-performance, high-capacity, and energy-efficient applications.
Pinout
The THGBMHG8C2LBAIL specifically features a 153-ball BGA package. These pins/balls are used for various functions including power supply, ground, data input/output, clock signals, command signals, and other controls necessary for NAND flash memory operations. The exact functions of each pin would be detailed in the technical datasheet or specification document provided by the manufacturer, Toshiba. This document would also specify the arrangement and mapping of these pins/balls which are crucial for integration into electronic circuits and systems.
For precise operations, functionalities, and pin configurations, it is advisable to refer to the manufacturer's datasheet or technical reference manual for comprehensive details.
Manufacturer
Application
1. Smartphones and Tablets: Used for internal storage to manage operating systems, apps, and user data.
2. Laptops and Ultrabooks: Provides storage solutions for lightweight and efficient data access.
3. Digital Cameras: Stores high-resolution images and video files.
4. Embedded Systems: Utilized in automotive infotainment systems and IoT devices for data storage.
5. Gaming Consoles: Offers fast read/write speeds for gaming applications.
6. Wearable Devices: Compact storage in smartwatches and fitness trackers.
7. Solid-State Drives (SSDs): Contributes to faster boot times and application load speeds.
These chips are favored for their reliability, speed, and energy efficiency.