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THGBMJG6C1LBAB7
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HerstellerKIOXIA
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Herstellerteil #THGBMJG6C1LBAB7
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Datenblatt THGBMJG6C1LBAB7 DataSheet
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Spezifikationen
| Attribut | Wert |
| EU Ro HS | Compliant |
| ECCN (US) | 3A991.b.1.a |
| Part Status | Unconfirmed |
| HTS | 8542.32.00.71 |
| Automotive | Yes |
| PPAP | Unknown |
| Cell Type | NAND |
| Chip Density (bit) | 64G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Interface Type | Serial e-MMC |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Mounting Type | Surface Mount |
| Package Height | 1 |
| Package Width | 11.5 |
| Package Length | 13 |
| PCB changed | 153 |
| Package / Case | BGA |
| Supplier Device Package | FBGA |
| Pin Count | 153 |
Übersicht
Description
Key features of the THGBMJG6C1LBAB7 include high storage density, enhanced performance, and reliability suitable for a wide range of consumer electronics such as smartphones, tablets, and other portable devices. The e-MMC architecture simplifies system design by handling complex flash management tasks internally, such as wear leveling, bad block management, and error correction.
The integrated controller improves data transfer speeds and system responsiveness, making it an ideal solution for applications requiring efficient data processing and storage. The THGBMJG6C1LBAB7 aims to offer a balance of cost, performance, and ease of integration for manufacturers looking to incorporate flash memory into their products.
Equivalent
Features
1. Type: Embedded NAND Flash Memory.
2. Capacity: Typically available in different capacities, often around 8GB, but it can vary.
3. Interface: e-MMC interface, compliant with JEDEC e-MMC standard (often 4.5 or 5.0).
4. Performance: Supports high data transfer rates with features like HS200 or possibly HS400 modes, allowing for faster read/write operations.
5. Package: Commonly comes in a BGA (Ball Grid Array) package, designed for compact integration into devices.
6. Applications: Suitable for use in consumer electronics such as smartphones, tablets, and other portable devices requiring reliable and efficient storage solutions.
7. Power: Designed for low power consumption, which is essential for battery-operated devices.
8. Reliability: Incorporates error correction and wear leveling to enhance data integrity and lifespan.
Please refer to the manufacturer's datasheet for detailed specifications and confirmations, as features might slightly vary with revisions.
Pinout
While the exact pin count can vary slightly depending on the specific configuration and manufacturing variations, e-MMC devices like this generally have around 153 to 169 pins (balls). These pins serve various functions, including power supply, ground, data input/output, clock signals, command signals, and other necessary control signals.
The primary function of the THGBMJG6C1LBAB7 is to provide non-volatile storage in electronic devices. It integrates NAND flash memory with a controller to manage data storage and retrieval, offering a compact, reliable storage solution for applications such as smartphones, tablets, and other portable electronics.
For precise pin configurations and functions, referring to the manufacturer's datasheet for this specific model is recommended.