Abbildungen dienen nur als Referenz
THGBMJG6C1LBAU7
+StücklisteIC FLASH 64GBIT EMMC 153FBGA
-
HerstellerKioxia America, Inc.
-
Herstellerteil #THGBMJG6C1LBAU7
-
Paket FBGA-153
-
Auf Lager4169
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | e•MMC™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 64Gb (8G x 8) |
| Memory Interface | eMMC |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
The THGBMJG6C1LBAU7 offers a balance of performance, capacity, and power efficiency, making it suitable for applications demanding moderate storage requirements. It supports multiple NAND flash generations and is compliant with the JEDEC e-MMC standard, ensuring compatibility with a wide range of processors and chipsets.
Overall, the THGBMJG6C1LBAU7 is a versatile memory solution that provides essential features like wear leveling, bad block management, and error correction, ensuring data integrity and prolonged device life. Its integration of controller and memory simplifies design and reduces the footprint on the printed circuit board, which is beneficial for compact device designs.
Equivalent
Features
1. Type: It belongs to the e-MMC (embedded MultiMediaCard) family, which integrates NAND flash memory with a controller.
2. Capacity: Typically offers a capacity of 8GB, though variations might exist.
3. Interface: Utilizes the standard MMC interface, making it compatible with a wide range of devices.
4. Performance: Designed for efficient data storage and retrieval, offering reliable performance suitable for various applications, such as smartphones, tablets, and other consumer electronics.
5. Reliability: Incorporates advanced error correction and wear leveling algorithms to enhance data integrity and lifespan.
6. Form Factor: Compact and suitable for integration into space-constrained designs.
7. Operating Temperatures: Supports a wide operating temperature range, making it suitable for diverse environments.
These features make it an ideal choice for manufacturers looking to integrate robust memory solutions into their products.
Pinout
The primary function of the THGBMJG6C1LBAU7 is to provide storage for digital data. It integrates NAND flash memory and a controller in a single package, and its interface aligns with the JEDEC e-MMC standard, making it suitable for a wide range of applications including smartphones, tablets, and other consumer electronics that require embedded storage solutions.
Features of e-MMC like THGBMJG6C1LBAU7 generally include managed NAND with a simplified interface to the host processor, embedded error correction (ECC), wear leveling, and bad block management, which enhance the performance and reliability of the storage system. For exact pin configuration and detailed specifications, referring to the manufacturer's datasheet is recommended.
Manufacturer
Application
1. Smartphones and Tablets: For storing operating systems, applications, and user data.
2. Laptops and Ultrabooks: As a solid-state drive (SSD) component for faster boot times and data access.
3. Wearable Devices: For efficient storage in compact form factors.
4. Digital Cameras and Camcorders: To store high-resolution images and videos.
5. IoT Devices and Embedded Systems: Providing durable and efficient storage solutions.
6. Automotive Applications: Used in infotainment systems and advanced driver-assistance systems (ADAS).
These applications benefit from the high-speed data access and reliability of NAND flash memory.