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THGBMJG7C1LBAIL
+StücklisteIC FLASH 128GBIT EMMC 153FBGA
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HerstellerKioxia America, Inc.
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Herstellerteil #THGBMJG7C1LBAIL
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Paket 153-WFBGA
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Auf Lager7263
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | e•MMC™ |
| ProductStatus | Last Time Buy |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 128Gb (16G x 8) |
| MemoryInterface | eMMC |
| OperatingTemperature | -25°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 153-WFBGA |
Übersicht
Description
The key features of the THGBMJG7C1LBAIL include its compact size, efficient power consumption, and reliable performance. It typically supports high-speed data transfer rates, making it suitable for applications requiring quick read and write capabilities. Additionally, e-MMC chips like this one often incorporate error correction technologies and wear leveling to enhance data integrity and prolong the lifespan of the memory.
Overall, the THGBMJG7C1LBAIL is designed to meet the demands of modern electronic devices that require efficient and reliable data storage solutions, contributing to improved functionality and user experience.
Equivalent
1. Samsung: K9xx series NAND chips
2. Micron: MT29 series
3. Hynix: H27 series
4. SanDisk/Western Digital: SDINBxxx series
These equivalents can vary based on specific configurations like capacity and interface, so it's essential to verify compatibility with your particular application requirements.
Features
1. Type: e-MMC (embedded MultiMediaCard), which integrates NAND flash memory with a controller.
2. Capacity: Available in multiple storage capacities, often ranging from 8GB to 128GB or more.
3. Performance: Offers high-speed data transfer rates, which are crucial for efficient mobile device performance.
4. Interface: Uses the MMC interface, compatible with a wide range of processors and platforms.
5. Reliability: Incorporates advanced error correction and management features for data integrity and longevity.
6. Power Efficiency: Designed to minimize power consumption, prolonging battery life in portable devices.
7. Form Factor: Compact and suitable for space-constrained applications like smartphones, tablets, and IoT devices.
8. Temperature Range: Operates effectively within a typical commercial temperature range, making it suitable for various environments.
These features make the THGBMJG7C1LBAIL a versatile and reliable option for embedded storage solutions.
Pinout
The pin count for the THGBMJG7C1LBAIL is usually around 153 balls in its BGA package, although the exact number can vary slightly based on specific package variations.
The primary function of this chip is to provide non-volatile storage for a variety of applications, such as smartphones, tablets, and other consumer electronics. It integrates NAND flash memory and a flash memory controller into a single package, streamlining storage solutions with features like wear leveling, bad block management, and error correction. This integration aids in simplifying the design process of various devices by providing a ready-to-use storage solution.
Manufacturer
Application
1. Smartphones and Tablets: Provides reliable and efficient storage for operating systems, apps, and user data.
2. Laptops and Notebooks: Utilized in budget and mid-range devices for storage solutions.
3. Digital Cameras and Camcorders: Stores high-resolution photos and videos.
4. IoT Devices: Used in smart devices for consistent performance and durability.
5. Automotive Systems: Supports infotainment systems and navigation in vehicles.
6. Industrial Equipment: Offers robust storage for various industrial applications requiring durable memory solutions.