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TMS320C6655CZHA
+StücklisteIC DSP FIX/FLOAT POINT 625FCBGA
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HerstellerTexas Instruments
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Herstellerteil #TMS320C6655CZHA
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Paket FCBGA-625
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Auf Lager3293
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | TMS320C66x |
| Part Status | Active |
| Type | Fixed/Floating Point |
| Interface | DDR3, EBI/EMI, McBSP, I²C, SPI, UART, UPP |
| Clock Rate | 1GHz |
| Non - Volatile Memory | ROM (128kB) |
| On - Chip RAM | 2.06MB |
| Voltage - I / O | 1.0V, 1.5V, 1.8V |
| Voltage - Core | 1.00V |
| Operating Temperature | -40°C ~ 100°C (TC) |
| Mounting Type | Surface Mount |
Übersicht
Description
- Dual-core (C66x) design, each core running at 850 MHz (or 1 GHz in turbo mode).
- 1.25 MB shared memory and 32 KB L1/512 KB L2 per core.
- Supports fixed- and floating-point operations for high-speed signal processing.
- Integrated DDR3 memory controller, Ethernet, PCIe, and SRIO for connectivity.
- Low power (typically < 5W per core) for embedded applications.
Ideal for wireless base stations, medical imaging, radar, and industrial automation. The CZHA variant is a BGA package optimized for rugged environments.
For more details, refer to TI’s datasheet.
Equivalent
- TMS320C6657: Higher core count (dual-core vs. single-core).
- TMS320C6678: Multicore DSP with similar architecture.
- TMS320C6748: Lower-cost DSP with comparable peripherals.
- TMS320C6654: Lower clock speed variant.
For exact replacements, check TI's product line or parametric search tools.
Features
- Dual-core: Two 1.25 GHz C66x DSP cores for high-speed processing.
- Memory: 1 MB L2 RAM per core, 512 KB shared L2, and DDR3 support (up to 8 GB).
- Performance: Up to 40 GMACs/core (80 GMACs total) and 20 GFLOPs/core (40 GFLOPs total).
- Connectivity: SRIO (4x), Gigabit Ethernet (2x), PCIe Gen2, HyperLink, and more.
- Peripherals: UART, SPI, I²C, GPIO, and timers.
- Power: 1.8V–1.0V core voltage, ~2.5W typical power consumption.
- Applications: Wireless base stations, medical imaging, radar, and high-performance embedded computing.
Built on 28nm process, it balances power efficiency with raw processing power.
Application
1. Telecommunications – Base stations, wireless infrastructure (LTE, 5G).
2. Medical Imaging – Ultrasound, MRI signal processing.
3. Industrial Automation – Motor control, robotics, real-time monitoring.
4. Defense & Aerospace – Radar, sonar, secure communications.
5. High-Performance Computing – Embedded vision, AI acceleration.
Its high-speed processing, low power, and multicore architecture make it ideal for real-time, compute-intensive applications.
