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TMS320C6678ACYPA25
+StücklisteIC DSP FIX/FLOAT POINT 841FCBGA
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HerstellerTexas Instruments
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Herstellerteil #TMS320C6678ACYPA25
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Datenblatt TMS320C6678ACYPA25 DataSheet
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Paket FCBGA-841
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Auf Lager5039
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Bulk,Tray |
| Series | TMS320C66x |
| Part Status | Active |
| Type | Fixed/Floating Point |
| Interface | EBI/EMI, I²C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet |
| Clock Rate | 1.25GHz |
| Non - Volatile Memory | ROM (128kB) |
| On - Chip RAM | 8.5MB |
| Voltage - I / O | 1.0V, 1.5V, 1.8V |
| Voltage - Core | 1.00V |
| Operating Temperature | -40°C ~ 100°C (TC) |
| Mounting Type | Surface Mount |
Übersicht
Description
Key features:
- Multicore Shared Memory Architecture (MSMC) for efficient data sharing.
- DDR3 Memory Controller (up to 8 GB support).
- High-speed interfaces: SRIO, HyperLink, PCIe, Ethernet.
- Fixed- and floating-point processing for versatile applications.
Applications include wireless base stations, medical imaging, radar, and high-performance computing. The ACYPA25 suffix denotes its industrial temperature range (-40°C to 105°C) and 25x25mm FCBGA package.
This DSP is ideal for real-time, compute-intensive tasks requiring low latency and high throughput.
Equivalent
- TMS320C6678ACYPA: Same chip, different speed grade (1.25 GHz vs. 1.0 GHz).
- TMS320C6674: Fewer cores (4 vs. 8) but similar architecture.
- TMS320C6657: Lower-cost, dual-core alternative.
- TMS320C6672: Dual-core variant of the same family.
For exact replacements, check TI’s KeyStone I DSP portfolio or newer KeyStone II devices like the 66AK2Hx series.
Features
- Cores: 8x C66x DSP cores, each running at 1.25 GHz (25 GFLOPS/core, 160 GFLOPS total).
- Memory: 4 MB shared L2 cache, 512 KB/core L2, 32 KB L1P/L1D per core.
- Interconnect: TeraNet for high-speed core-to-core communication.
- Multicore Navigator: Manages data flow between cores/hardware accelerators.
- I/O: HyperLink (50 Gbps), PCIe Gen2 (5 Gbps/lane), SGMII Ethernet (1 Gbps), DDR3-1600 (8 GB support).
- Power: ~10 W typical, 1.0V core voltage.
- Applications: Radar, wireless base stations, medical imaging, and high-performance computing.
Packaged in a 25×25 mm FCBGA (ACYPA). Optimized for parallel processing and real-time signal processing.
Pinout
### Key Functions:
- 8x C66x DSP cores (1.25 GHz each) for high-performance processing.
- Shared memory (4MB L2, 512KB L1 per core) and DDR3 memory controller.
- High-speed interfaces:
- Serial RapidIO (SRIO), Ethernet (2x 10GbE, 1x 1GbE), PCIe Gen2.
- HyperLink for multi-chip interconnect.
- Peripherals: UART, SPI, I²C, GPIO, Timers.
Designed for wireless, medical imaging, and high-performance computing.
Application
1. Telecommunications – Base stations, wireless infrastructure (LTE, 5G).
2. Radar & Defense – Signal processing in radar, sonar, and electronic warfare.
3. Medical Imaging – Ultrasound, MRI, and CT scan processing.
4. Industrial Automation – High-speed control and machine vision.
5. Video Processing – Real-time video analytics and surveillance.
6. Aerospace – Avionics and satellite communication systems.
Its 8-core C66x DSP architecture delivers high performance for compute-intensive tasks.
