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TMS320C6713BGDP300
+StücklisteIC FLOATING-POINT DSP 272-BGA
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HerstellerTexas Instruments
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Herstellerteil #TMS320C6713BGDP300
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Paket PBGA-272
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Auf Lager2189
365 Tage Qualitätsgarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | TMS320C67x |
| Part Status | Active |
| Type | Floating Point |
| Interface | Host Interface, I²C, McASP, McBSP |
| Clock Rate | 300MHz |
| Non - Volatile Memory | External |
| On - Chip RAM | 264kB |
| Voltage - I / O | 3.30V |
| Voltage - Core | 1.40V |
| Operating Temperature | 0°C ~ 90°C (TC) |
| Mounting Type | Surface Mount |
Übersicht
Description
The TMS320C6713BGDP300 is a high-performance, floating-point DSP (Digital Signal Processor) from Texas Instruments' TMS320C6000 family. It features:
- 300 MHz clock speed (1 GFLOPS peak performance).
- VelociTI VLIW architecture for parallel processing.
- 32-bit floating-point & fixed-point support.
- On-chip memory: 264 KB RAM (64 KB L1, 256 KB L2).
- External memory interface (EMIF) for SDRAM/Flash.
- Multichannel buffered serial port (McBSP) for audio/data streaming.
- Enhanced DMA (EDMA) for efficient data transfers.
Ideal for real-time signal processing (audio, imaging, communications), it balances power efficiency with computational power. The GDP package (BGA) suits embedded applications. Development is supported by TI’s Code Composer Studio (CCS) and optimized libraries.
- 300 MHz clock speed (1 GFLOPS peak performance).
- VelociTI VLIW architecture for parallel processing.
- 32-bit floating-point & fixed-point support.
- On-chip memory: 264 KB RAM (64 KB L1, 256 KB L2).
- External memory interface (EMIF) for SDRAM/Flash.
- Multichannel buffered serial port (McBSP) for audio/data streaming.
- Enhanced DMA (EDMA) for efficient data transfers.
Ideal for real-time signal processing (audio, imaging, communications), it balances power efficiency with computational power. The GDP package (BGA) suits embedded applications. Development is supported by TI’s Code Composer Studio (CCS) and optimized libraries.
Equivalent
The TMS320C6713BGDP300 is a floating-point DSP from Texas Instruments (TI). Equivalent or similar products include:
- TMS320C6748: Enhanced floating/fixed-point DSP (higher performance).
- TMS320C6727: Lower-cost floating-point DSP (similar architecture).
- TMS320C6713: Non-"B" variant (slightly older).
- ADSP-21489 (Analog Devices): Competing floating-point DSP.
For modern alternatives, consider TI’s C6000 or C7000 series. Check TI’s website for exact replacements.
- TMS320C6748: Enhanced floating/fixed-point DSP (higher performance).
- TMS320C6727: Lower-cost floating-point DSP (similar architecture).
- TMS320C6713: Non-"B" variant (slightly older).
- ADSP-21489 (Analog Devices): Competing floating-point DSP.
For modern alternatives, consider TI’s C6000 or C7000 series. Check TI’s website for exact replacements.
Features
The TMS320C6713BGDP300 is a high-performance floating-point DSP from Texas Instruments. Key features:
- Architecture: 32-bit, 8-way VLIW, 300 MHz clock speed (1.67 ns cycle time).
- Performance: Up to 2400 MIPS/1800 MFLOPS (16-bit fixed/32-bit float).
- Memory: 264 KB RAM (64 KB L1, 256 KB L2), supports external SDRAM.
- I/O: 32-bit EMIF, 2 McBSPs, 2 Timers, I²C, HPI.
- Power: 1.2V core, 3.3V I/O, low-power design.
- Package: 272-pin BGA (GDP suffix).
- Applications: Audio, medical imaging, telecom.
Concise, high-performance DSP for real-time signal processing.
- Architecture: 32-bit, 8-way VLIW, 300 MHz clock speed (1.67 ns cycle time).
- Performance: Up to 2400 MIPS/1800 MFLOPS (16-bit fixed/32-bit float).
- Memory: 264 KB RAM (64 KB L1, 256 KB L2), supports external SDRAM.
- I/O: 32-bit EMIF, 2 McBSPs, 2 Timers, I²C, HPI.
- Power: 1.2V core, 3.3V I/O, low-power design.
- Package: 272-pin BGA (GDP suffix).
- Applications: Audio, medical imaging, telecom.
Concise, high-performance DSP for real-time signal processing.
Pinout
The TMS320C6713BGDP300 is a 300-pin BGA (Ball Grid Array) DSP from Texas Instruments.
Key Functions:
- High-Performance DSP: 32-bit floating-point, up to 300 MHz clock speed.
- Memory: 264 KB RAM, external memory interface (EMIF) for SDRAM/SRAM.
- I/O Interfaces: McBSP (Multichannel Buffered Serial Port), SPI, I²C, timers, GPIO.
- DMA & EDMA: Efficient data transfers.
- Power Management: Low-power modes.
Pin Functions:
- Power/Ground: Multiple pins for core & I/O supply.
- Clock/Reset: Clock input, PLL, reset control.
- Data/Address Bus: 32-bit EMIF for external memory.
- Serial Ports: McBSP, SPI, I²C.
- Interrupts/Control: Timers, DMA, GPIO, JTAG for debugging.
Summary: 300-pin BGA, optimized for high-speed signal processing with rich I/O and memory options.
Key Functions:
- High-Performance DSP: 32-bit floating-point, up to 300 MHz clock speed.
- Memory: 264 KB RAM, external memory interface (EMIF) for SDRAM/SRAM.
- I/O Interfaces: McBSP (Multichannel Buffered Serial Port), SPI, I²C, timers, GPIO.
- DMA & EDMA: Efficient data transfers.
- Power Management: Low-power modes.
Pin Functions:
- Power/Ground: Multiple pins for core & I/O supply.
- Clock/Reset: Clock input, PLL, reset control.
- Data/Address Bus: 32-bit EMIF for external memory.
- Serial Ports: McBSP, SPI, I²C.
- Interrupts/Control: Timers, DMA, GPIO, JTAG for debugging.
Summary: 300-pin BGA, optimized for high-speed signal processing with rich I/O and memory options.
Manufacturer
The TMS320C6713BGDP300 is manufactured by Texas Instruments (TI), a leading American semiconductor company. TI specializes in designing and producing analog and digital integrated circuits (ICs), including digital signal processors (DSPs) like the TMS320 series. The C6713B is a high-performance floating-point DSP used in applications such as audio processing, medical imaging, and telecommunications.
Founded in 1930, TI is a global technology firm headquartered in Dallas, Texas, known for innovation in electronics and embedded systems.
Founded in 1930, TI is a global technology firm headquartered in Dallas, Texas, known for innovation in electronics and embedded systems.
Application
The TMS320C6713BGDP300, a floating-point DSP from Texas Instruments, is widely used in:
1. Audio Processing – Real-time audio effects, speech recognition.
2. Medical Imaging – Ultrasound, MRI signal processing.
3. Communications – Software-defined radio (SDR), baseband processing.
4. Industrial Control – Motor control, automation.
5. Military/Aerospace – Radar, sonar, and avionics.
6. Scientific Research – High-performance computing (HPC), simulations.
Its high-speed processing (up to 300 MHz) and floating-point capabilities make it ideal for complex, real-time applications.
1. Audio Processing – Real-time audio effects, speech recognition.
2. Medical Imaging – Ultrasound, MRI signal processing.
3. Communications – Software-defined radio (SDR), baseband processing.
4. Industrial Control – Motor control, automation.
5. Military/Aerospace – Radar, sonar, and avionics.
6. Scientific Research – High-performance computing (HPC), simulations.
Its high-speed processing (up to 300 MHz) and floating-point capabilities make it ideal for complex, real-time applications.
Package
The TMS320C6713BGDP300 is packaged in a BGA (Ball Grid Array) format. Specifically, it uses a GD (Plastic BGA) package with 300 pins. This package type is designed for high-performance DSP applications, offering robust thermal and electrical performance in a compact form factor.
