Abbildungen dienen nur als Referenz
TOP258EN
+StücklisteIC OFFLINE SWITCH FLYBACK 7ESIP
-
HerstellerEnergieintegrationen
-
Herstellerteil #TOP258EN
-
Paket ESIP-7C
-
Auf Lager1759
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tube |
| Series | TOPSwitch®-HX |
| Part Status | Active |
| Output Isolation | Isolated |
| Internal Switch(s) | Yes |
| Voltage - Breakdown | 700V |
| Topology | Flyback |
| Duty Cycle | 78% |
| Frequency - Switching | 66kHz, 132kHz |
| Power (Watts) | 195 W |
| Fault Protection | Current Limiting, Over Temperature, Over Voltage |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Supplier Device Package | eSIP-7C |
Übersicht
Description
An introduction to such a course would typically cover the primary themes, goals, and learning outcomes. It would set expectations for students, outline the curriculum, and detail any prerequisites or foundational knowledge required. The course might include lectures, readings, discussions, and assessments like exams or projects. Students could expect to gain a deeper understanding of the subject matter, develop relevant skills, and apply theoretical concepts in practical contexts.
For specific information, such as the syllabus or course objectives, it's best to consult the institution offering the course or contact the instructor directly.
Equivalent
1. TOP256EN - another model in the TOPSwitch-JX family with slightly different specifications.
2. LNK306PN - from Power Integrations, suitable for lower power applications.
3. TNY278PN - from Power Integrations, a TinySwitch-III series chip for compact designs.
Always compare key parameters like voltage, current ratings, and package type for compatibility.
Features
1. Integrated Controller and High-Voltage MOSFET: Combines control circuitry with a high-voltage power MOSFET to minimize external components and simplify design.
2. Energy Efficiency: Features such as EcoSmart™ technology help meet or exceed energy efficiency standards by minimizing power consumption in standby and no-load conditions.
3. Advanced Protection Features: Includes over-temperature, overvoltage, and overcurrent protection to ensure reliability and extend the lifespan of electronic devices.
4. Flexible Operation: Supports both continuous and discontinuous conduction modes, enabling compatibility with a wide range of power supply designs.
5. Frequency Jittering: Reduces EMI, allowing for easier compliance with international standards.
6. Programmable Features: Offers versatility with programmable current limits and line under-voltage thresholds.
7. Simple Design: Requires few additional components, reducing both cost and complexity in power supply design.
These features make the TOP258EN suitable for applications like chargers, adapters, and other consumer electronics requiring efficient power solutions.
Pinout
1. DRAIN (Pins 1-3): These pins are connected internally and serve as the power MOSFET drain. They are part of the primary side of the power supply and usually connected to the high-voltage DC input.
2. CONTROL (Pin 4): This pin is used for startup and steady-state operation. It provides feedback control, startup bias current, and current limiting. The pin allows connection to an external capacitor and resistor for setting the operating frequency and current limit.
3. V (Pin 5): This is the supply pin for the internal control circuitry. It is typically connected to an external resistor and capacitor network.
4. FREQUENCY (Pin 6): This pin sets the switching frequency and can be used for frequency jitter modulation, reducing EMI issues.
5. BP/M (Pin 7): The BYPASS/MULTI-FUNCTION pin is used for setting the current limit and provides a connection point for an external bypass capacitor to stabilize internal voltage.
6. SOURCE (Pin 8): This pin is connected to the source of the internal MOSFET and is typically tied to primary-side ground.
Manufacturer
Power Integrations' products typically integrate multiple functions into a single chip, which helps reduce the size, complexity, and cost of power supply designs while improving their efficiency and performance. Their technologies are often used to enhance energy efficiency and reliability in electronic devices, aligning with global trends towards environmentally friendly and energy-saving solutions.
Overall, Power Integrations is recognized for its contributions to the development of energy-efficient semiconductor solutions and for its commitment to sustainability in the electronics industry.
Application
1. Consumer Electronics: Used in chargers, adapters, and power supplies for devices like smartphones, tablets, and laptops.
2. Industrial Electronics: Powers industrial control systems and instrumentation devices.
3. Home Appliances: Employed in appliances such as microwave ovens, refrigerators, and washing machines for efficient power management.
4. LED Lighting: Used in LED drivers for efficient power conversion and regulation.
5. Networking and Communication: Powers routers, modems, and other network equipment.
Its design focuses on high efficiency, low standby power, and reducing the overall component count in power supply designs.