Abbildungen dienen nur als Referenz
TPD4S214YFFR
+StücklisteUSB OTG COMPANION DEVICE
-
HerstellerTexas Instruments
-
Herstellerteil #TPD4S214YFFR
-
Paket DSBGA (YFF)-12
-
Auf Lager1956
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| Technology | Internal Switch |
| NumberofCircuits | 1 |
| Applications | USB OTG |
| MountingType | Surface Mount |
| Package/Case | 12-UFBGA, DSBGA |
Übersicht
Description
Key specifications include a small form factor, making it suitable for compact electronic devices, and compliance with industry-standard ESD protection levels (such as IEC 61000-4-2). The device also features a flow-through pin mapping, which simplifies PCB layout and enhances signal integrity. With a low clamping voltage and high surge capability, the TPD4S214YFFR effectively absorbs transient voltages, protecting sensitive components downstream. Overall, it is a practical solution for enhancing the reliability and durability of electronic devices that utilize USB connections.
Equivalent
1. NXP PESD5V0S4UD - 4-channel ESD protection device.
2. ON Semiconductor NUP4302MR6 - USB port protection.
3. Littelfuse SP0504BAHTG - 4-line ESD protection array.
4. STMicroelectronics USBLC6-4 - 4-line low-capacitance ESD protection.
These equivalents are chosen based on similar protection features and applications. Always verify compatibility with your specific design requirements.
Features
1. ESD Protection: It offers robust ESD protection exceeding the IEC 61000-4-2 Level 4 standard, with ±15 kV contact discharge and ±18 kV air-gap discharge.
2. Overvoltage Protection: The device includes overvoltage protection for connected circuits.
3. Ultra-Low Capacitance: With a capacitance of 0.5 pF (line to ground), it is suitable for high-speed data interfaces, minimizing signal distortion.
4. Compact Package: Available in a small 0.4 mm pitch DSBGA package, allowing for space-saving designs in compact electronics.
5. Integrated TVS Diodes: These diodes safeguard up to four data lines from voltage spikes.
6. Low Leakage Current: Helps maintain energy efficiency by minimizing power loss.
7. Wide Operating Temperature Range: Functions reliably in a range from -40°C to +85°C, suitable for various environmental conditions.
These features make the TPD4S214YFFR well-suited for protecting interfaces in mobile devices, laptops, and other portable electronics.
Pinout
Key functions include:
1. ESD Protection: Provides robust protection against ESD events that may damage sensitive electronic components. It is compliant with the IEC 61000-4-2 standard, offering contact and air-gap discharge protection.
2. Low Capacitance: Designed with low capacitance to ensure minimal impact on the signal integrity of high-speed data lines.
3. Integrated Backdrive Protection: Prevents damage from incorrect power supply connections.
The TPD4S214YFFR is suitable for applications requiring protection for multiple data lines in a small form factor, making it ideal for portable and compact electronic devices.
Manufacturer
Application
Package
FAQ
Q: What is the primary application for the TPD4S214YFFR?
A: It is designed for USB On-The-Go (OTG) applications, providing essential protection and signal conditioning for the USB data lines and VBUS.
Q: What type of package does this component use?
A: It is supplied in a compact 12-ball DSBGA (YFF) package, suitable for high-density surface-mount designs on space-constrained PCBs.
Q: How is this device shipped and handled?
A: It is available in Tape & Reel (TR) or Cut Tape (CT) packaging, compatible with standard automated pick-and-place assembly processes.
Q: What is the core function of the internal switch?
A: The integrated switch manages the connection and protection of the USB data lines, facilitating role swapping and safeguarding the host/device controller.
Q: Is this a single-channel or multi-channel device?
A: It is a single-circuit (Number of Circuits: 1) protection solution, typically protecting one USB port's data and power lines.
Q: What mounting technology should be used?
A: It is a surface-mount component. Follow the recommended reflow soldering profile for the DSBGA package to ensure reliable connections.