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TS3USB30EDGSR
+StücklisteIC USB SWITCH SGL 1X2 10MSOP
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HerstellerTexas Instruments
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Herstellerteil #TS3USB30EDGSR
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Paket VSSOP (DGS)-10
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Auf Lager7513
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| Applications | USB |
| SwitchCircuit | DPDT |
| NumberofChannels | 1 |
| On-StateResistance(Max) | 10Ohm |
| Voltage-SupplySingle(V+) | 3V ~ 4.3V |
| -3dbBandwidth | 900MHz |
| Features | Bi-Directional, USB 2.0 |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) |
Übersicht
Description
Key characteristics of the TS3USB30EDGSR include low power consumption, wide power supply range, and high bandwidth, which ensures minimal signal degradation and fast data transfer rates. It operates with a supply voltage ranging from 2.3V to 3.6V and can handle data rates up to 480 Mbps, supporting USB 2.0 full-speed and high-speed data rates. Additionally, it offers low on-resistance and crosstalk, ensuring signal integrity. The device is packaged in a small-outline package, making it suitable for space-constrained applications. Overall, the TS3USB30EDGSR is a reliable solution for efficient USB signal management in modern electronic devices.
Equivalent
1. ON Semiconductor FSAUSB30L10X - Offers similar USB 2.0 support with bidirectional high-speed signal routing.
2. Nexperia NX3L2267 - A dual DPDT switch for USB 2.0 applications.
3. Diodes Incorporated PI3USB10 - Compatible USB 2.0 high-speed switch.
4. Fairchild Semiconductor FSUSB30 - Another dual DPDT switch for USB 2.0 signals.
These alternatives provide comparable performance for USB signal switching applications.
Features
1. Switch Configuration: It is a 1:2 multiplexer/demultiplexer, enabling switching between two different data paths.
2. High-Speed Data Rates: Supports USB 2.0 data rates up to 480 Mbps, ensuring efficient data transfer.
3. Low Power Consumption: Features low power dissipation, making it suitable for battery-powered devices.
4. Wide Operating Voltage: Operates over a range of 3.0V to 3.6V, providing flexibility in design.
5. Low On-Capacitance and On-Resistance: Ensures minimal signal degradation and high signal integrity.
6. Compact Package: Available in a small footprint, making it ideal for space-constrained applications.
7. High Bandwidth: Offers high bandwidth to support fast switching between data paths.
8. Enhanced ESD Protection: Provides electrostatic discharge protection for better reliability and durability.
These features make the TS3USB30EDGSR suitable for smartphones, tablets, and other portable electronic devices requiring efficient USB data routing.
Pinout
The TS3USB30EDGSR comes in a 10-pin MSOP (Mini Small Outline Package) form factor. The primary function of this IC is to provide a 1:2 multiplexer/demultiplexer function for USB 2.0 high-speed data signals. It is designed to operate with minimal signal distortion and low power consumption.
Key features include:
- 1:2 differential USB switch
- Supports high-speed USB 2.0 data rates (480 Mbps)
- Low power consumption
- Low on-capacitance and on-resistance
- Wide operating voltage range, typically 3.0 V to 3.6 V
The TS3USB30EDGSR is optimized for fast switching, making it suitable for applications requiring quick signal path changes between different USB sources or destinations.
Manufacturer
Application
1. Consumer Electronics: Routing USB signals in devices like smartphones, tablets, laptops, and cameras.
2. Peripheral Devices: Integration in USB hubs, docking stations, and external storage devices for signal switching.
3. Communication Systems: Used in routers and modems to manage USB connectivity.
4. Automotive: Applied in infotainment systems for switching between multiple USB inputs.
5. Industrial Equipment: Facilitates USB connectivity in control systems requiring multiple I/O configurations.
Its high-speed and low-power characteristics make it suitable for maintaining signal integrity in these applications.