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W25Q256JWPIM
+StücklisteIC FLASH 256MBIT SPI/QUAD 8WSON
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HerstellerWinbond Electronics
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Herstellerteil #W25Q256JWPIM
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Datenblatt W25Q256JWPIM DataSheet
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Auf Lager1949
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Spezifikationen
| Attribut | Wert |
| Series | SpiFlash® |
| Part Status | Active |
| Base Product Number | W25Q256 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 256Mbit |
| Memory Organization | 32M x 8 |
| Memory Interface | SPI - Quad I/O, QPI, DTR |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 5ms |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (6x5) |
| Packaging | Tray |
| Access Time | 6 ns |
Übersicht
Description
The W25Q256JWPIM supports dual/quad SPI operation, allowing for faster read and write speeds. It also includes a wide temperature range suitable for various environmental conditions, enhancing its reliability in demanding applications. The chip is designed to operate with low power consumption, making it ideal for battery-powered devices. Its compact form factor and high density make it a suitable choice for applications requiring substantial storage without sacrificing space. Overall, the W25Q256JWPIM combines high performance, flexibility, and robust security features, making it a versatile solution for modern electronic systems.
Equivalent
1. Micron MT25QU256ABA
2. Macronix MX25L25645G
3. ISSI IS25LP256D
4. GigaDevice GD25Q256
These alternatives offer similar features like SPI interfaces, comparable storage capacities, and are typically used in embedded systems for code and data storage. Always verify specific parameters and compatibility before substituting.
Features
The W25Q256JWPIM offers uniform 4KB sectors, 32KB and 64KB blocks, allowing flexible erase and write options. It supports JEDEC standard and high-performance dual/quad SPI operation. The deep power-down mode reduces power consumption, making it suitable for energy-sensitive applications. Designed for reliability, the memory is rated for a minimum of 100,000 erase/write cycles per sector and a data retention period of 20 years. It is available in various packages, including WSON, SOP, and BGA, catering to different design requirements in consumer electronics, industrial, and automotive applications.
Pinout
1. CS# (Chip Select): Activates the device.
2. DO (Data Out): Outputs data from the memory.
3. WP# (Write Protect): Protects certain sectors from write operations.
4. GND (Ground): Ground reference.
5. DI (Data In): Inputs data into the memory.
6. CLK (Clock): Serial clock input for synchronizing data capture.
7. HOLD#/RESET: Can pause communication or reset the device.
8. VCC (Supply Voltage): Provides power to the device.
The W25Q256JWPIM supports standard SPI, Dual SPI, and Quad SPI operations, making it versatile for various applications such as code shadowing, storage, and data logging in embedded systems.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of the W25Q256JWPIM?
A: It has 256Mbit (256Mb) capacity organized as 32M x 8 bits, suitable for high-density code and data storage.
Q: What is the maximum clock frequency for SPI operations?
A: The device supports a maximum clock frequency of 133 MHz, enabling fast read and write operations for demanding applications.
Q: Does this memory support Quad I/O and QPI interfaces?
A: Yes, it supports SPI with Quad I/O, QPI, and DTR (Double Transfer Rate) modes for enhanced data throughput.
Q: What is the operating voltage range for this component?
A: It operates within a voltage supply range of 1.7V to 1.95V, ideal for low-power embedded designs.
Q: What is the typical write cycle time for a page or word?
A: The typical write cycle time is 5ms per word or page, ensuring efficient programming for non-volatile storage.
Q: What is the access time and packaging type?
A: The access time is 6 ns, and it comes in an 8-WSON (6x5) surface-mount package with exposed pad for thermal dissipation.