W631GU6NB-11

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W631GU6NB-11

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IC DRAM 1GBIT PAR 96VFBGA

  • HerstellerWinbond Electronics

  • Herstellerteil #W631GU6NB-11

  • Auf Lager6465

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Attribut Wert
Part Status Obsolete
Base Product Number W631GU6
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface Parallel
Clock Frequency 933 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.283V ~ 1.45V, 1.425V ~ 1.575V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 96-VFBGA
Supplier Device Package 96-VFBGA (7.5x13)
Packaging Tray
Access Time 20 ns

Übersicht

Description

The "W631GU6NB-11" likely refers to a specific type of electronic component or microchip, often used in computing or consumer electronics. It appears to be a model number or part number which can designate specifications regarding its capacity, speed, power consumption, and application use. When introducing such a component, it is crucial to outline its primary function, typical applications, and key specifications such as memory size, voltage requirements, or processing power. It might be used in a variety of devices, depending on its nature, ranging from computers and smartphones to embedded systems. Understanding its exact role, whether as a memory module, processor, or another type of chip, is essential for integration into larger systems. Without detailed context or a datasheet from the manufacturer, it is challenging to provide more precise information about its function or applications. If you are looking to use or integrate this component, consulting technical documentation or a datasheet from the manufacturer would be advisable.

Equivalent

The W631GU6NB-11 is a DDR3 SDRAM chip by Winbond. Equivalent products typically include DDR3 SDRAM chips from other manufacturers like Samsung, SK Hynix, and Micron with similar specifications such as 1Gb density, 1066 MT/s speed, and an 8-bit organization. Always verify compatibility with the manufacturer or vendor to ensure proper functionality in your specific application.

Pinout

The W631GU6NB-11 is a 512Mb DDR3 SDRAM chip manufactured by Winbond. It comes in a 96-ball FBGA (Fine-pitch Ball Grid Array) package. The primary function of this chip is to provide high-speed data storage and retrieval for computing applications, commonly used in personal computers, laptops, and other electronic devices requiring efficient memory solutions.
The device supports a data width of x16, allowing for efficient data handling. It operates based on a double data rate (DDR) architecture, where data is transferred on both the rising and falling edges of the clock signal, effectively doubling the data rate without increasing the frequency of the clock.
Key features include an 8-bit prefetch architecture, programmable read/write burst lengths, and self-refresh modes. It supports CAS latency (CL) of 11, operating at a maximum frequency of 933 MHz, providing high-speed performance. The W631GU6NB-11 is also compliant with the JEDEC standard for DDR3 SDRAM, ensuring compatibility and reliability in various systems.

Manufacturer

The W631GU6NB-11 is a DRAM memory chip manufactured by Winbond Electronics Corporation. Winbond is a Taiwanese company that specializes in the design and production of semiconductor products, particularly volatile and non-volatile memory solutions. The company is known for producing a wide range of DRAM, Flash memory, and related IC products utilized in a variety of applications across consumer electronics, computing, mobile devices, and automotive industries. Winbond's products are widely used in systems requiring reliable and high-performance memory solutions.

Application

The W631GU6NB-11 is a type of DRAM (Dynamic Random Access Memory) chip, commonly used in various electronic applications. Its primary application areas include:
1. Consumer Electronics: Used in devices like smartphones, tablets, and laptops for efficient data processing and storage.
2. Computers: Integrated into PCs and servers to improve performance by providing fast data access and temporary storage.
3. Networking Equipment: Employed in routers and switches for handling large data transfers and buffering.
4. Embedded Systems: Found in automotive electronics and IoT devices requiring reliable and speedy memory solutions.
5. Gaming Consoles: Enhances performance by speeding up game loading times and managing complex in-game processes.
These applications leverage the chip's speed and efficiency for improved device functionality.

Package

The W631GU6NB-11 is a DRAM chip produced by Winbond. It typically comes in a small outline package (SOP) which is commonly used for memory chips. For precise information about the package type, referring to the specific datasheet or product documentation from Winbond is recommended.

Frequently Asked Questions


Q: What is the memory density and organization of the W631GU6NB-11?
A: It has a 1Gbit density organized as 64M x 16, making it suitable for applications requiring high bandwidth per chip.


Q: Is this DDR3L memory compatible with standard 1.5V DDR3 slots?
A: Yes, it supports dual voltage: 1.283V~1.45V for DDR3L and 1.425V~1.575V for DDR3, offering flexible compatibility.


Q: What is the maximum operating frequency and access time?
A: The clock frequency is 933 MHz, and the access time is 20 ns, delivering high-speed data transfer for embedded systems.


Q: What is the operating temperature range for this DRAM?
A: It operates from 0°C to 95°C (TC), suitable for commercial and industrial applications with moderate thermal stress.


Q: What package type does the W631GU6NB-11 use?
A: It comes in a 96-VFBGA package (7.5x13 mm), designed for surface mount assembly in compact PCB layouts.


Q: Is the W631GU6NB-11 currently in production?
A: Its Part Status is marked as Obsolete. Please verify availability with distributor stock for legacy or replacement projects.


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