W632GU6NB11I

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W632GU6NB11I

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IC DRAM 2GBIT PAR 96VFBGA

  • HerstellerWinbond Electronics

  • Herstellerteil #W632GU6NB11I

  • Auf Lager5428

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

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Spezifikationen

Attribut Wert
Part Status Obsolete
Base Product Number W632GU6
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Clock Frequency 933 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature -40°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 96-VFBGA
Supplier Device Package 96-VFBGA (7.5x13)
Packaging Tray
Access Time 20 ns

Übersicht

Description

The code "W632GU6NB11I" appears to reference a specific product, model, or item, but without additional context, its exact meaning is unclear. It could relate to various fields such as electronics, machinery, or even a unique identifier used in a specific industry. Generally, product codes like this are used to identify particular features, specifications, or versions of a product.
If you have more context about where you encountered this code (e.g., a specific industry, product category, or manufacturer), I could provide a more detailed and relevant explanation.

Equivalent

The W632GU6NB11I is a DDR3 SDRAM memory chip. Equivalent products include:
1. W632GU6NB10I
2. W632GU6NB12I
3. MT8JSF12864HZ-1G1
4. H5TQ2G83CFR-12
5. K4B4G1646E-BCK0
Always verify pin compatibility and specifications before replacement.

Features

The W632GU6NB11I is a smart, energy-efficient appliance, typically designed for home or commercial use. Key features include:
1. Advanced Technology: Equipped with smart connectivity options like Wi-Fi or Bluetooth, allowing remote control via mobile apps.
2. Energy Efficiency: Designed to consume less power, complying with energy-saving certifications.
3. User-Friendly Interface: Often features a digital display and intuitive controls for easy operation.
4. Multiple Functions: Capable of performing various tasks, such as cooking, cooling, or heating, depending on the appliance type.
5. Durability: Built with high-quality materials to ensure longevity and reliability.
6. Compact Design: Space-saving design suitable for different settings.
7. Safety Features: Includes safety mechanisms to prevent overheating or accidental operation.
These features make the W632GU6NB11I a versatile and practical choice for users seeking modern solutions for their daily needs.

Pinout

The W632GU6NB11I is a DRAM (Dynamic Random Access Memory) chip produced by Winbond. It features a 72-pin configuration typical for SO-DIMM (Small Outline Dual In-line Memory Module) applications.
The primary function of this memory chip is to provide high-speed data storage and retrieval for computing systems. It operates at a voltage of 1.5V and typically conforms to DDR3 standards, offering various capacities and speeds, making it suitable for use in laptops and other compact computing devices. Each pin serves specific functions such as data input/output, address lines, control signals, power supply, and ground connections, facilitating communication between the DRAM and the memory controller in the system.

Manufacturer

The W632GU6NB11I is a product manufactured by Winbond Electronics Corporation. Winbond is a semiconductor company based in Taiwan that specializes in the design and production of memory chips and integrated circuits. Founded in 1987, the company focuses on providing a range of memory products, including DRAM, Flash memory, and other specialized memory solutions for various applications, such as consumer electronics, computing, automotive, and industrial sectors.
Winbond is known for its innovative technology and has established a strong presence in the global semiconductor market. They serve a diverse clientele and are involved in expanding their product offerings to meet the evolving needs of technology industries, particularly in areas like IoT (Internet of Things) and artificial intelligence. Additionally, Winbond is recognized for its commitment to quality and reliability, making it a trusted supplier for many leading companies in the electronics sector.

Application

The W632GU6NB11I is a DRAM memory chip primarily used in consumer electronics, such as smartphones, tablets, and laptops. It serves applications requiring high-speed data processing and efficient power consumption. Additionally, it is suitable for gaming devices, IoT devices, and automotive systems, where reliable memory performance is critical. The chip's specifications make it ideal for mobile computing and multimedia applications, enhancing user experience through faster load times and improved multitasking capabilities.

Package

The W632GU6NB11I is packaged in a 66-ball CSP (Chip Scale Package) format. This type of package is characterized by its small size and is typically used for space-constrained applications, providing efficient thermal and electrical performance.

Frequently Asked Questions


Q: What is the memory type and technology of the W632GU6NB11I?
A: It is a Volatile DRAM using SDRAM - DDR3L technology, optimized for low-voltage operation at 1.283V to 1.45V.


Q: What is the memory size and organization of this component?
A: It has a 2Gbit capacity organized as 128M x 16, suitable for high-density parallel memory interface applications.


Q: What is the maximum clock frequency supported?
A: It supports a clock frequency of 933 MHz, enabling fast data transfer rates for DDR3L systems.


Q: What is the operating temperature range and packaging?
A: It operates from -40°C to 95°C (TC) and comes in a 96-VFBGA (7.5x13) surface-mount tray package.


Q: Is the W632GU6NB11I still in production?
A: No, its part status is marked as Obsolete. Verify availability for new designs or consider alternative base product numbers.


Q: What is the access time and write cycle time?
A: Access time is 20 ns, and write cycle time for word/page is 15ns, balancing speed and power efficiency.


Q: What voltage supply range does this DDR3L memory require?
A: It requires a supply voltage between 1.283V and 1.45V, compliant with DDR3L low-power standards.


Q: Which application scenarios suit this component?
A: Ideal for embedded systems, industrial controllers, and networking gear needing ruggedized, low-voltage, high-speed DRAM in -40°C to 95°C environments.


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