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W971GG6SB-25

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IC DRAM 1GBIT PARALLEL 84WBGA

HerstellerWinbond Electronics
Herstellerteil #W971GG6SB-25
Auf Lager5867

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Spezifikationen

Attribut	Wert
PartStatus	Obsolete
BaseProductNumber	W971GG6
DigiKeyProgrammable	Not Verified
MemoryType	Volatile
MemoryFormat	DRAM
Technology	SDRAM - DDR2
MemorySize	1Gbit
MemoryOrganization	64M x 16
MemoryInterface	Parallel
ClockFrequency	200 MHz
WriteCycleTime-Word,Page	15ns
Voltage-Supply	1.7V ~ 1.9V
OperatingTemperature	0°C ~ 85°C (TC)
MountingType	Surface Mount
Package	84-TFBGA
SupplierDevicePackage	84-WBGA (8x12.5)
Packaging	Tray
AccessTime	57.5 ns

Übersicht

Description

The W971GG6SB-25 is a DDR3 SDRAM memory chip, commonly used in computing devices for high-speed data processing. Manufactured by Winbond Electronics Corporation, it is part of their DRAM product line. This chip features a storage capacity of 1 gigabit, organized in a 128M x 8-bit configuration. Operating at a voltage range of 1.35V to 1.5V, it offers efficient power consumption, making it suitable for portable and power-sensitive applications.
The W971GG6SB-25 supports a variety of data rates up to 1866 Mbps, thanks to its double data rate (DDR) technology, which allows data to be transferred on both the rising and falling edges of the clock signal. It is equipped with a clock frequency of up to 933 MHz and a CAS latency that varies depending on the operating speed. Other features include on-chip error correction code (ECC) for improved data integrity and a range of programmable modes for flexibility in different applications. Overall, the W971GG6SB-25 is designed to deliver reliable and fast memory performance for a wide range of electronic devices.

Equivalent

The W971GG6SB-25 is a DDR2 SDRAM chip. Equivalent products would be other 1Gb DDR2 SDRAM chips with similar specifications, such as those from manufacturers like Samsung (e.g., K4T1G164QE), Hynix (e.g., HY5PS1G1631C), Micron (e.g., MT47H128M8), and Elpida (e.g., EDE1116ACBG). Ensure compatibility in terms of speed, latency, and pin configuration when considering replacements.

Features

The W971GG6SB-25 is a DDR3 SDRAM chip produced by Winbond Electronics. Key features include:
1. Density and Organization: The chip is organized as 1G x 16, providing a total of 16Gb of memory capacity.
2. Speed and Performance: It operates at a data rate of 1600 Mbps, making it suitable for applications requiring fast data transfer.
3. Voltage: The device typically operates at a voltage range of 1.35V, which is lower than standard DDR3, offering improved power efficiency.
4. Package Type: It is available in an FBGA package, optimizing it for compact and high-density configurations in devices.
5. Temperature Range: Designed to perform in a standard commercial temperature range, it's suitable for a wide range of consumer applications.
6. Applications: Commonly used in computing and consumer electronics, it supports high-performance tasks such as video streaming, gaming, and other memory-intensive applications.
This concise feature set makes the W971GG6SB-25 a versatile choice for various high-speed memory applications.

Pinout

The W971GG6SB-25 is a DRAM chip produced by Winbond. It is a 1Gb (gigabit) DDR2 SDRAM, commonly used in various electronics for memory applications. The chip is housed in a 84-ball BGA (Ball Grid Array) package. The pin layout and functions are specific to DDR2 memory standards, which include a range of signals such as power, ground, address inputs, data inputs/outputs, and control signals for managing the DRAM operations. Key pins typically include:
- Address Pins (A0-A13, BA0-BA1): Used to specify the memory addresses.
- Data Pins (DQ0-DQ15): Used for data input and output.
- Control Pins: Such as Clock (CK, CK#), Row Address Strobe (RAS#), Column Address Strobe (CAS#), and Write Enable (WE#).
- Power Pins (VDD, VDDQ): Supply power to the chip.
- Ground Pins (VSS, VSSQ): Provide grounding.
The specific arrangement and function of each pin are detailed in the manufacturer's datasheet for the W971GG6SB-25. This concise summary provides essential information, but for engineering or design purposes, consulting the datasheet is recommended for accurate pin assignments and detailed functional descriptions.

Manufacturer

The W971GG6SB-25 is manufactured by Winbond Electronics Corporation. Winbond is a Taiwanese company that specializes in the production of semiconductor memory solutions, including dynamic random-access memory (DRAM) and non-volatile memory (NAND Flash and NOR Flash). They cater to a wide range of applications, including consumer electronics, mobile devices, automotive, and industrial products. Winbond is recognized for its innovation and development of memory products that meet the evolving needs of various industries.

Application

The W971GG6SB-25 is a DDR2 SDRAM chip typically used in applications requiring efficient memory solutions. Its primary application areas include:
1. Consumer Electronics: Utilized in devices like TVs, set-top boxes, and gaming consoles for memory management.
2. Computers and Laptops: Supports system memory in older PCs and laptops, aiding in multitasking and improved performance.
3. Networking: Employed in routers and switches for buffering and data processing tasks.
4. Industrial Equipment: Used in automation systems and control devices that require reliable memory solutions.
5. Embedded Systems: Incorporated in various electronic systems needing compact and efficient memory storage.
These applications benefit from the chip's balance of performance and power efficiency.

Package

The package type for the W971GG6SB-25 is a 96-ball Fine-Pitch Ball Grid Array (FBGA).

Frequently Asked Questions

Q: What is the memory size and organization of the W971GG6SB-25?
A: It has a 1Gbit memory size organized as 64M x 16, making it suitable for 16-bit parallel data applications.

Q: What is the maximum clock frequency supported by this DDR2 SDRAM?
A: The device supports a maximum clock frequency of 200 MHz, corresponding to DDR2-400 data rates.

Q: What voltage supply range does the W971GG6SB-25 require?
A: It operates with a supply voltage between 1.7V and 1.9V, compliant with DDR2 JEDEC standards.

Q: What is the access time and write cycle time for this component?
A: The access time is 57.5 ns, and the write cycle time for word or page is 15 ns, ensuring fast data throughput.

Q: What is the operating temperature range of this memory chip?
A: It operates from 0°C to 85°C (TC), making it suitable for commercial and industrial temperature environments.

Q: What package type does the W971GG6SB-25 come in?
A: It is packaged in an 84-TFBGA with a supplier device package of 84-WBGA (8x12.5 mm), designed for surface mount.

Q: Is this component still in active production?
A: No, the part status is listed as Obsolete. It is recommended for legacy designs or replacement inventory.