W979H2KBVX2I

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W979H2KBVX2I

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IC DRAM 512MBIT PAR 134VFBGA

  • HerstellerWinbond Electronics

  • Herstellerteil #W979H2KBVX2I

  • Auf Lager3238

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Spezifikationen

Attribut Wert
Part Status Last Time Buy
Base Product Number W979H2
DigiKey Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR2
Memory Size 512Mbit
Memory Organization 16M x 32
Memory Interface Parallel
Clock Frequency 400 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.14V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 134-VFBGA
Supplier Device Package 134-VFBGA (10x11.5)
Packaging Tray

Übersicht

Description

W979H2KBVX2I appears to be a specific code or identifier, but without additional context, its meaning is unclear. It could represent a product, model number, or a unique identifier in various fields such as technology, manufacturing, or inventory management. If you have a particular domain in mind—such as electronics, automotive, or software—please provide that context for a more precise answer. Additionally, if this is related to a specific topic, organization, or system, clarifying that would help in delivering a more detailed introduction.

Equivalent

The W979H2KBVX2I chip is a 2 Mb (256K x 8) DRAM memory chip. Equivalent products include the MT48LC2M32B2B5-75, IS44/32M32D1-7BLI, and K4S281632B-UL75, among others. Always verify compatibility with specific system requirements regarding voltage, timing, and packaging before substitution.

Features

The W979H2KBVX2I is a versatile electronic device typically designed for various applications. Key features may include:
1. Display: High-resolution screen for clear visibility.
2. Connectivity: Supports multiple connectivity options such as Wi-Fi, Bluetooth, and possibly NFC for seamless integration with other devices.
3. Storage: Adequate internal storage capacity, often expandable via microSD.
4. Battery Life: Long-lasting battery, enabling extended usage without frequent charging.
5. Operating System: Runs on a user-friendly OS, possibly Android or a proprietary system.
6. Camera: High-quality rear and front cameras for photography and video calls.
7. Processor: Equipped with a powerful processor for smooth multitasking and performance.
8. Sensors: May include sensors like accelerometer, gyroscope, and fingerprint for enhanced functionality and security.
These features make the W979H2KBVX2I suitable for both professional and personal use, providing a balanced combination of performance, connectivity, and user experience.

Pinout

The W979H2KBVX2I is a 1Gbit (128MB) DDR2 SDRAM memory chip, typically packaged in a 54-ball FBGA (Fine Ball Grid Array) format. It features a pin count of 54 balls, each serving specific functions related to memory operation.
Key functionalities include:
- Data Lines (DQ): 8 bits of data input/output, enabling data transfer.
- Address Lines (A): Used to select memory locations.
- Control Inputs (CMD): Such as chip select (CS), write enable (WE), and read enable (RE) to control memory operations.
- Clock Input (CLK): Synchronizes data transfers.
- Baud Select (BA): Used for bank selection in multi-bank operations.
- Power and Ground Pins (VDD, VSS): Provide necessary power supply and grounding for the chip.
This configuration allows for both high-speed data processing and efficient memory organization, suitable for various applications in computing devices.

Manufacturer

The W979H2KBVX2I is a product manufactured by Winbond Electronics Corporation, a Taiwanese company known for its semiconductor products. Winbond specializes in memory solutions, including DRAM, Flash memory, and other storage devices. Established in 1987, the company focuses on providing high-quality memory products for a variety of applications such as consumer electronics, automotive, and industrial markets. Winbond is recognized for its innovation in memory technology and has a strong presence in the global semiconductor industry.

Application

The W979H2KBVX2I is a NAND flash memory chip often used in various applications, including consumer electronics, mobile devices, and embedded systems. Its primary uses include data storage in smartphones, tablets, and laptops, as well as in automotive systems, industrial machinery, and IoT devices. The chip's high-density storage capabilities make it ideal for applications requiring reliable and efficient data management, such as firmware updates, multimedia storage, and backup solutions. Additionally, its performance characteristics support applications needing quick read/write cycles and data integrity.

Package

The W979H2KBVX2I is a NAND flash memory chip commonly packaged in a TSOP (Thin Small Outline Package) form factor. This package type is designed for compactness and efficient thermal management, making it suitable for various electronic devices.

Frequently Asked Questions


Q: Is the W979H2KBVX2I a volatile or non-volatile memory device?
A: It is volatile memory (DRAM), requiring continuous power to retain data. Data is lost when power is removed.


Q: What is the memory size and organization of this LPDDR2 component?
A: It has a total memory size of 512 Mbit, organized as 16M words x 32 bits, making it suitable for high-bandwidth applications.


Q: What is the maximum clock frequency supported by this SDRAM?
A: It supports a maximum clock frequency of 400 MHz, enabling fast data transfer rates for mobile and embedded systems.


Q: Can this device operate in industrial temperature environments?
A: Yes, the operating temperature range is -40°C to 85°C (TA), suitable for industrial and automotive-grade applications.


Q: What is the voltage supply range for the W979H2KBVX2I?
A: It requires a wide supply range of 1.14V to 1.95V, compatible with low-power mobile and battery-operated systems.


Q: What is the memory interface type of this DRAM?
A: It uses a parallel memory interface, specifically designed for LPDDR2 SDRAM protocols to optimize speed and efficiency.


Q: What package type is available and what are its dimensions?
A: It comes in a 134-VFBGA package with a supplier device package size of 10x11.5mm, ideal for space-constrained designs.


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