XC2S200-5FGG456I

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XC2S200-5FGG456I

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IC FPGA 284 I/O 456FBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC2S200-5FGG456I

  • Paket BGA-456

  • Auf Lager1932

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Attribut Wert
Package / Case Tray
Series Spartan®-II
Part Status Active
Number of LABs/CLBs 1176
Number of Logic Elements/Cells 5292
Total RAM Bits 57344
Number of I/O 284
Number of Gates 200000
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC2S200-5FGG456I is a specific model from the Xilinx Spartan-II series of Field Programmable Gate Arrays (FPGAs). These devices are designed to offer a balance between performance and cost-effectiveness, making them suitable for a wide range of applications, including consumer electronics, telecommunications, and industrial systems.
Key features of the XC2S200-5FGG456I include:
1. Logic Cells: It contains approximately 200,000 system gates, which translates to a significant number of logic cells for implementing complex digital circuits.
2. Speed Grade: The "-5" in the part number denotes the speed grade, indicating its timing performance characteristics within the series.
3. Package: The "FGG456" suffix indicates the package type, a Fine-Pitch Ball Grid Array (FBGA) with 456 pins, suitable for high-density applications.
4. Temperature Range: The "I" at the end signifies its industrial-grade temperature range, suitable for environments that require a broader operating temperature.
The Spartan-II series is known for its flexibility and is often used in applications that require reconfigurable logic solutions.

Equivalent

The XC2S200-5FGG456I is a Xilinx Spartan-II FPGA. Equivalent products could include other FPGAs with similar specifications from different families or manufacturers, such as:
1. Altera (Intel) Cyclone series (e.g., EP1C20)
2. Lattice Semiconductor's MachXO series
3. Microsemi (Microchip) SmartFusion or IGLOO series
When choosing alternatives, consider factors like logic cell count, I/O pins, package type, speed grade, and power consumption. Always check compatibility with your application's specific requirements.

Features

The XC2S200-5FGG456I is a member of the Xilinx Spartan-II FPGA family. Key features include:
1. Logic Cells: Approximately 200,000 system gates and 2,160 logic cells.
2. Package: FGG456, a 456-pin Fine-Pitch Ball Grid Array (FBGA) package.
3. Speed Grade: -5, indicating a specific speed and power specification.
4. Temperature Range: Industrial grade, capable of operating within a wider temperature range, typically -40°C to +85°C.
5. Embedded Multipliers: Enhances performance for DSP applications.
6. RAM Blocks: Features blocks of distributed RAM for flexible memory configurations.
7. I/O Standards: Supports a variety of I/O standards for versatile connectivity.
8. Configuration Options: Configurable via JTAG or parallel/serial PROM.
9. Power: Low power consumption suitable for cost-sensitive and low-power applications.
10. Use Cases: Ideal for high-volume applications such as consumer electronics, communications, and automotive.
These features make the XC2S200-5FGG456I suitable for a broad range of applications requiring moderate logic capacity, flexible I/O capabilities, and reliable performance in industrial environments.

Pinout

The XC2S200-5FGG456I is a member of the Xilinx Spartan-II FPGA family. It comes in a Fine-Pitch Ball Grid Array (FBGA) package with 456 pins. The primary function of this FPGA is to provide a flexible, reprogrammable logic platform that can be used for a wide range of digital applications. It includes features such as:
- 200,000 system gates
- Configurable logic blocks (CLBs) for implementing custom logic
- On-chip RAM blocks for data storage
- User input/output blocks (IOBs) for interfacing with external components
- Four Delay-Locked Loops (DLLs) for clock management
This FPGA is used in applications requiring moderate logic density and performance, offering low power consumption and a cost-effective solution. The "-5" denotes the speed grade, with lower numbers indicating faster performance, while the "I" signifies an industrial temperature range.

Manufacturer

The XC2S200-5FGG456I is manufactured by Xilinx, Inc. Xilinx is a technology company that specializes in developing and producing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and associated development software. Founded in 1984 and headquartered in San Jose, California, Xilinx is known for its pioneering role in the invention of the FPGA, which allows users to configure the hardware for specific applications after manufacturing. This flexibility makes FPGAs suitable for a wide range of applications, including communications, automotive, industrial, and consumer electronics.
Xilinx operates in the semiconductor industry and focuses on providing solutions that enable innovation across various sectors by offering adaptable and efficient hardware platforms. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices) in a move to enhance AMD's capabilities in advanced computing and expand its offerings in data centers, edge computing, and other markets. As part of AMD, Xilinx continues to contribute its expertise in adaptive computing and hardware acceleration technologies.

Application

The XC2S200-5FGG456I is a FPGA (Field-Programmable Gate Array) from the Xilinx Spartan-II family. Its application areas include digital signal processing, embedded control systems, data communication and networking, and custom digital circuit design. It's commonly used in telecommunications for implementing protocols, in consumer electronics for video and audio processing, and in industrial automation for real-time processing tasks. Its reconfigurability makes it suitable for prototyping and testing new designs, as well as for providing hardware acceleration in a variety of computational tasks. Additionally, it can be used in educational settings for teaching digital logic design and FPGA programming.

Package

The XC2S200-5FGG456I is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-II family. It comes in a Fine-Pitch Ball Grid Array (FBGA) package with 456 pins, denoted by "FGG456". The package type ensures efficient connectivity and heat dissipation, suitable for various electronic applications.

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