Abbildungen dienen nur als Referenz
XC2S200-5FGG456I
+StücklisteIC FPGA 284 I/O 456FBGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC2S200-5FGG456I
-
Paket BGA-456
-
Auf Lager1932
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-II |
| Part Status | Active |
| Number of LABs/CLBs | 1176 |
| Number of Logic Elements/Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 284 |
| Number of Gates | 200000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XC2S200-5FGG456I include:
1. Logic Cells: It contains approximately 200,000 system gates, which translates to a significant number of logic cells for implementing complex digital circuits.
2. Speed Grade: The "-5" in the part number denotes the speed grade, indicating its timing performance characteristics within the series.
3. Package: The "FGG456" suffix indicates the package type, a Fine-Pitch Ball Grid Array (FBGA) with 456 pins, suitable for high-density applications.
4. Temperature Range: The "I" at the end signifies its industrial-grade temperature range, suitable for environments that require a broader operating temperature.
The Spartan-II series is known for its flexibility and is often used in applications that require reconfigurable logic solutions.
Equivalent
1. Altera (Intel) Cyclone series (e.g., EP1C20)
2. Lattice Semiconductor's MachXO series
3. Microsemi (Microchip) SmartFusion or IGLOO series
When choosing alternatives, consider factors like logic cell count, I/O pins, package type, speed grade, and power consumption. Always check compatibility with your application's specific requirements.
Features
1. Logic Cells: Approximately 200,000 system gates and 2,160 logic cells.
2. Package: FGG456, a 456-pin Fine-Pitch Ball Grid Array (FBGA) package.
3. Speed Grade: -5, indicating a specific speed and power specification.
4. Temperature Range: Industrial grade, capable of operating within a wider temperature range, typically -40°C to +85°C.
5. Embedded Multipliers: Enhances performance for DSP applications.
6. RAM Blocks: Features blocks of distributed RAM for flexible memory configurations.
7. I/O Standards: Supports a variety of I/O standards for versatile connectivity.
8. Configuration Options: Configurable via JTAG or parallel/serial PROM.
9. Power: Low power consumption suitable for cost-sensitive and low-power applications.
10. Use Cases: Ideal for high-volume applications such as consumer electronics, communications, and automotive.
These features make the XC2S200-5FGG456I suitable for a broad range of applications requiring moderate logic capacity, flexible I/O capabilities, and reliable performance in industrial environments.
Pinout
- 200,000 system gates
- Configurable logic blocks (CLBs) for implementing custom logic
- On-chip RAM blocks for data storage
- User input/output blocks (IOBs) for interfacing with external components
- Four Delay-Locked Loops (DLLs) for clock management
This FPGA is used in applications requiring moderate logic density and performance, offering low power consumption and a cost-effective solution. The "-5" denotes the speed grade, with lower numbers indicating faster performance, while the "I" signifies an industrial temperature range.
Manufacturer
Xilinx operates in the semiconductor industry and focuses on providing solutions that enable innovation across various sectors by offering adaptable and efficient hardware platforms. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices) in a move to enhance AMD's capabilities in advanced computing and expand its offerings in data centers, edge computing, and other markets. As part of AMD, Xilinx continues to contribute its expertise in adaptive computing and hardware acceleration technologies.