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XC2S200-5PQ208I
+StücklisteIC FPGA 140 I/O 208QFP
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HerstellerAMD Xilinx
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Herstellerteil #XC2S200-5PQ208I
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Paket QFP-208
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Auf Lager6941
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-II |
| Part Status | Obsolete |
| Number of LABs/CLBs | 1176 |
| Number of Logic Elements/Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 140 |
| Number of Gates | 200000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XC2S200-5PQ208I include a 208-pin PQFP package, which facilitates easy integration onto printed circuit boards. It operates at a 5-speed grade, indicating its performance characteristics and timing capabilities. The "I" in its designation signifies that it is rated for industrial temperature ranges, making it suitable for applications in harsher environmental conditions.
The Spartan-II family is known for its efficient power consumption and reliable performance, offering a balanced blend of features and cost for designers looking to implement FPGA-based solutions. This makes the XC2S200-5PQ208I a versatile choice for both prototyping and production environments.
Equivalent
1. Altera (Intel) Cyclone series like EP1C3.
2. Lattice Semiconductor's ICE40 series.
3. Xilinx Spartan-3 series, e.g., XC3S200.
Always verify compatibility in terms of pin count, I/O standards, and package type for your specific application.
Features
1. Density and Performance: It has 200,000 system gates and offers a balance of density and performance at a low cost.
2. Logic Cells: Comprising 5,292 logic cells organized in Configurable Logic Blocks (CLBs).
3. System Gates: Up to 200K system gates for a variety of applications.
4. I/O Pins: The device provides flexible I/O options with up to 140 user I/O pins.
5. Package: Comes in a PQ208 package, a plastic quad flat package with 208 pins.
6. Speed Grade: The "-5" denotes a specific speed grade indicating performance characteristics.
7. Temperature Range: The "I" suffix indicates an industrial-grade temperature range, suitable for -40°C to +100°C.
8. Distributed RAM: Includes distributed RAM blocks for efficient storage.
9. On-chip Memory: Contains built-in RAM blocks for temporary data storage.
10. Clock Management: Provides support for clock management functions.
This FPGA is suitable for cost-sensitive and high-volume applications that require a balance of performance, system gates, and flexible I/O options.
Pinout
1. Logic Cells and Gates: It offers 200,000 system gates and has 2352 logic cells, which can be configured to perform a wide array of digital logic functions.
2. I/O Pins: The package provides a large number of I/O pins for interfacing with other hardware. The specific number of user-configurable I/O pins is part of the total 208 pins, taking into account power, ground, and configuration pins.
3. CLBs (Configurable Logic Blocks): The device contains multiple CLBs, which are the basic building blocks for creating logic circuits within the FPGA.
4. Embedded Memory: It includes distributed RAM and block RAM for implementing memory functions within the FPGA.
5. Clock Management: The FPGA has DLLs (Delay-Locked Loops) for advanced clock management and signal synchronization.
This device is suitable for a range of applications, including digital signal processing, embedded control, and communications.
Manufacturer
Application
1. Telecommunications: Used in signal processing and data routing.
2. Consumer Electronics: Employed in devices needing customizable processing.
3. Industrial Automation: Offers flexibility for control systems and robotics.
4. Automotive: Used in in-vehicle communication and infotainment systems.
5. Networking: Supports protocol implementation and data management tasks.
6. Aerospace and Defense: Provides customizable hardware solutions for secure communications and data processing.
Its reconfigurability and cost-effectiveness make it suitable for prototyping and diverse end-product applications.