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XC2VP50-6FF1152I
+StücklisteIC FPGA 692 I/O 1152FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC2VP50-6FF1152I
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Paket FBGA-1152
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Auf Lager4210
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Virtex®-II Pro |
| Part Status | Obsolete |
| Number of LABs/CLBs | 5904 |
| Number of Logic Elements/Cells | 53136 |
| Total RAM Bits | 4276224 |
| Number of I/O | 692 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key specifications include 1152-pin Fine-Pitch Ball Grid Array (FBGA) packaging, which supports efficient heat dissipation and reliable connections. The "-6" in the part number indicates performance speed grade, influencing the clock rates and power consumption. The "I" denotes industrial-grade, suitable for operating temperatures from -40°C to 100°C, making it versatile across various environmental conditions.
It also includes embedded RAM and DSP blocks, facilitating efficient data processing and storage. The XC2VP50-6FF1152I is well-suited for applications in telecommunications, networking, and advanced computing, providing both flexibility and scalability for custom designs. This FPGA empowers engineers to tailor hardware implementations, optimizing performance and functionality according to specific needs.
Equivalent
Features
1. Architecture: It utilizes the advanced Virtex-II Pro architecture, offering high performance and flexibility.
2. Logic Cells: It contains around 50,000 logic cells, providing substantial computational resources.
3. I/O Pins: The package supports numerous I/O pins, facilitating extensive connectivity options.
4. Embedded PowerPC Cores: It includes two embedded IBM PowerPC 405 processor cores, enhancing processing capabilities for complex applications.
5. Block RAM: The FPGA features a significant amount of block RAM for data storage and manipulation.
6. Clock Management: Equipped with Digital Clock Managers (DCMs) for advanced clock management and reduced clock skew.
7. IOB Flip-Flops: Supports IOB flip-flops for improved input/output operations.
8. Package Type: Comes in an FF1152 package, which is a fine-pitch ball grid array format.
9. Temperature Range: The "I" denotes an industrial temperature range, suitable for harsh environments.
These features make the XC2VP50-6FF1152I suitable for demanding applications in telecommunications, aerospace, and high-performance computing.
Pinout
Key functions of the XC2VP50-6FF1152I include:
1. Logic Cells: Provides a large number of configurable logic blocks (CLBs) for implementing complex digital circuits.
2. Embedded PowerPC Processors: Contains PowerPC 405 processor cores for integrated processing capabilities.
3. High-Speed Connectivity: Supports high-speed serial transceivers and multiple I/O standards for robust data throughput.
4. Memory: Features large blocks of RAM and distributed memory to support data storage and retrieval operations.
5. DSP Capabilities: Incorporates dedicated multipliers for digital signal processing applications.
This combination of resources makes it well-suited for applications in telecommunications, networking, automotive systems, and other areas requiring high-performance computation and data handling.
Manufacturer
Xilinx's products are used in a variety of applications, including telecommunications, data centers, automotive, aerospace, and defense industries, among others. FPGAs like the XC2VP50-6FF1152I are particularly valued for their flexibility and high performance in processing complex algorithms and handling parallel data processing, which makes them suitable for tasks that require high-speed data throughput and real-time processing capabilities.
As of 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational semiconductor company, further expanding AMD's portfolio in adaptive computing and high-performance processing solutions.