XC3S1500-4FG456I

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XC3S1500-4FG456I

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IC FPGA 333 I/O 456FBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC3S1500-4FG456I

  • Paket BBGA-456

  • Auf Lager2215

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Attribut Wert
Package / Case Tray
Series Spartan®-3
Part Status Active
Number of LABs/CLBs 3328
Number of Logic Elements/Cells 29952
Total RAM Bits 589824
Number of I/O 333
Number of Gates 1500000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC3S1500-4FG456I is part of the Xilinx Spartan-3 FPGA family, specifically designed for cost-sensitive and high-volume applications. This model offers a balance of performance, cost, and power efficiency, making it suitable for a range of applications, including consumer electronics, automotive, and industrial equipment.
Key features include:
1. Logic Cells: It contains 1,500,000 system gates, providing ample space for complex designs.
2. Package: The FG456 package indicates a Fine-Pitch Ball Grid Array (FBGA) with 456 pins, facilitating compact and high-density design implementations.
3. Speed Grade: The "-4" speed grade offers a decent performance balance with moderate power consumption.
4. Temperature Range: The "I" suffix denotes an industrial-grade temperature range, suitable for operating in environments with temperatures between -40°C and +100°C.
5. I/O and Interfaces: Offers a variety of I/O standards and interfaces, supporting high-speed data transfers and flexible connectivity.
This device excels in applications requiring a blend of versatility, cost-effectiveness, and scalability. It is supported by a robust set of development tools and resources provided by Xilinx.

Equivalent

The XC3S1500-4FG456I is a Xilinx Spartan-3 FPGA. Equivalent products can include:
1. Altera (now Intel) Cyclone II series, such as EP2C70.
2. Lattice Semiconductor's ECP series, like LFE2-70.
3. Microsemi (formerly Actel) ProASIC3 family, akin to A3P1000.
These alternatives offer similar logic densities and performance, though specific application needs and additional features should be compared for precise match.

Features

The XC3S1500-4FG456I is a member of the Xilinx Spartan-3 FPGA family, designed for high-volume, cost-sensitive applications. Key features include:
1. Logic Resources: Approximately 1.5 million system gates, with 26,624 logic cells.
2. I/O Pins: Offers up to 333 user I/O pins.
3. Configuration: Supports multiple configuration modes including JTAG and Slave Serial.
4. Speed Grade: -4 speed grade, providing a balance of performance and power.
5. Power Management: Includes advanced power management features for low-power applications.
6. Embedded Multipliers: 32 dedicated 18x18 multipliers for efficient DSP operations.
7. Block RAM: 576 Kbits of block RAM for data storage.
8. Package: Available in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package.
9. Temperature Range: Industrial temperature range, suitable for demanding environments.
10. Clock Management: Features digital clock managers (DCMs) for improved clocking.
This combination of features makes the XC3S1500-4FG456I suitable for a wide variety of applications, including communications, automotive, and consumer electronics.

Pinout

The XC3S1500-4FG456I is a member of Xilinx's Spartan-3 FPGA family. It comes in a Fine-Pitch Ball Grid Array (FBGA) package with 456 pins. This FPGA is designed for a wide range of applications, providing a balance of performance, power, and cost-effectiveness.
In terms of functionality, the XC3S1500-4FG456I offers:
1. Logic Resources: It includes 1,500,000 system gates and 33,192 logic cells.
2. Configurable I/O: It supports multiple I/O standards and provides numerous I/O pins for interfacing with other components.
3. Memory: The device has embedded Block RAM for on-chip data storage.
4. Performance: Operates at a speed grade of -4, which indicates its performance level in terms of speed.
5. Temperature Range: The "I" in the part number indicates it is designed for the industrial temperature range.
This FPGA is suitable for a variety of applications, including digital signal processing, embedded systems, and communication systems, thanks to its balance of resources and flexibility.

Manufacturer

The XC3S1500-4FG456I is a part of the Spartan-3 family of FPGAs, manufactured by Xilinx, Inc. Xilinx is a company that specializes in the development of programmable logic devices. It is well-known for its field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and associated development software.
Xilinx was founded in 1984 and has been a leader in the field of programmable logic, providing products that are used in a variety of applications, including telecommunications, data centers, aerospace and defense, automotive, industrial, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a multinational semiconductor company, further expanding its capabilities and integration into various technology sectors. As a company, Xilinx focuses on innovation and providing flexible, high-performance solutions that are integral in the development of cutting-edge technology across multiple industries.

Application

The XC3S1500-4FG456I is a member of the Xilinx Spartan-3 FPGA family. It is commonly used in applications requiring moderate logic density, cost-effectiveness, and flexibility. Key application areas include:
1. Telecommunications: Used in base stations and networking equipment for signal processing.
2. Consumer Electronics: Implemented in devices requiring configurable logic, such as digital TV and set-top boxes.
3. Industrial Automation: Serves in control systems, motor drives, and robotics.
4. Automotive: Utilized for infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Provides processing power for imaging and diagnostic equipment.
6. Data Acquisition: Used in systems for gathering and processing signals from various sensors.

Package

The XC3S1500-4FG456I is a FPGA (Field-Programmable Gate Array) from Xilinx's Spartan-3 series. It features a Fine-Pitch Ball Grid Array (FBGA) package with 456 pins. The "4" indicates the speed grade, and "I" signifies the industrial temperature range. This package type is designed for high-density and portable applications.

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