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XC3S1500-4FG456I
+StücklisteIC FPGA 333 I/O 456FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC3S1500-4FG456I
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Paket BBGA-456
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Auf Lager2215
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 3328 |
| Number of Logic Elements/Cells | 29952 |
| Total RAM Bits | 589824 |
| Number of I/O | 333 |
| Number of Gates | 1500000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
1. Logic Cells: It contains 1,500,000 system gates, providing ample space for complex designs.
2. Package: The FG456 package indicates a Fine-Pitch Ball Grid Array (FBGA) with 456 pins, facilitating compact and high-density design implementations.
3. Speed Grade: The "-4" speed grade offers a decent performance balance with moderate power consumption.
4. Temperature Range: The "I" suffix denotes an industrial-grade temperature range, suitable for operating in environments with temperatures between -40°C and +100°C.
5. I/O and Interfaces: Offers a variety of I/O standards and interfaces, supporting high-speed data transfers and flexible connectivity.
This device excels in applications requiring a blend of versatility, cost-effectiveness, and scalability. It is supported by a robust set of development tools and resources provided by Xilinx.
Equivalent
1. Altera (now Intel) Cyclone II series, such as EP2C70.
2. Lattice Semiconductor's ECP series, like LFE2-70.
3. Microsemi (formerly Actel) ProASIC3 family, akin to A3P1000.
These alternatives offer similar logic densities and performance, though specific application needs and additional features should be compared for precise match.
Features
1. Logic Resources: Approximately 1.5 million system gates, with 26,624 logic cells.
2. I/O Pins: Offers up to 333 user I/O pins.
3. Configuration: Supports multiple configuration modes including JTAG and Slave Serial.
4. Speed Grade: -4 speed grade, providing a balance of performance and power.
5. Power Management: Includes advanced power management features for low-power applications.
6. Embedded Multipliers: 32 dedicated 18x18 multipliers for efficient DSP operations.
7. Block RAM: 576 Kbits of block RAM for data storage.
8. Package: Available in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package.
9. Temperature Range: Industrial temperature range, suitable for demanding environments.
10. Clock Management: Features digital clock managers (DCMs) for improved clocking.
This combination of features makes the XC3S1500-4FG456I suitable for a wide variety of applications, including communications, automotive, and consumer electronics.
Pinout
In terms of functionality, the XC3S1500-4FG456I offers:
1. Logic Resources: It includes 1,500,000 system gates and 33,192 logic cells.
2. Configurable I/O: It supports multiple I/O standards and provides numerous I/O pins for interfacing with other components.
3. Memory: The device has embedded Block RAM for on-chip data storage.
4. Performance: Operates at a speed grade of -4, which indicates its performance level in terms of speed.
5. Temperature Range: The "I" in the part number indicates it is designed for the industrial temperature range.
This FPGA is suitable for a variety of applications, including digital signal processing, embedded systems, and communication systems, thanks to its balance of resources and flexibility.
Manufacturer
Xilinx was founded in 1984 and has been a leader in the field of programmable logic, providing products that are used in a variety of applications, including telecommunications, data centers, aerospace and defense, automotive, industrial, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a multinational semiconductor company, further expanding its capabilities and integration into various technology sectors. As a company, Xilinx focuses on innovation and providing flexible, high-performance solutions that are integral in the development of cutting-edge technology across multiple industries.
Application
1. Telecommunications: Used in base stations and networking equipment for signal processing.
2. Consumer Electronics: Implemented in devices requiring configurable logic, such as digital TV and set-top boxes.
3. Industrial Automation: Serves in control systems, motor drives, and robotics.
4. Automotive: Utilized for infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Provides processing power for imaging and diagnostic equipment.
6. Data Acquisition: Used in systems for gathering and processing signals from various sensors.