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XC3S1600E-5FGG320C
+StücklisteIC FPGA 250 I/O 320FBGA
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HerstellerAMD
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Herstellerteil #XC3S1600E-5FGG320C
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Auf Lager3771
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Spezifikationen
| Attribut | Wert |
| Series | Spartan®-3E |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Total RAM Bits | 663552 |
| Number of I/O | 250 |
| Number of Gates | 1600000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S1600 |
| Number of Logic Elements / Cells | 33192 |
| Number of LA Bs / CL Bs | 3688 |
Übersicht
Description
Key specifications include:
- Speed Grade: -5, indicating a maximum operating frequency of around 250 MHz.
- Package Type: FGG320, a Fine-Pitch Ball Grid Array with 320 balls, ensuring a compact footprint for space-constrained projects.
- I/O Pins: Up to 192 I/O pins, supporting various I/O standards for compatibility with different devices and systems.
The XC3S1600E is ideal for applications such as consumer electronics, automotive systems, and industrial control, where quick prototyping and reconfiguration are paramount. It supports a variety of design tools, including the Xilinx ISE design suite, enabling engineers to implement complex digital logic quickly and efficiently. Overall, the XC3S1600E-5FGG320C offers a balance of performance, flexibility, and cost-effectiveness for a wide range of applications.
Equivalent
Features
1. Logic Cells: Approximately 1,600 logic cells with a combination of look-up tables (LUTs) and flip-flops.
2. I/O Pins: Up to 320 user I/O pins, supporting various I/O standards.
3. Memory: Integrated block RAM (BRAM) totaling 72 Kbits, enabling efficient data storage.
4. DSP Slices: Includes dedicated DSP slices for high-performance arithmetic operations.
5. Configuration: Supports multiple configuration options, including JTAG and serial modes.
6. Speed Grade: Operates at a maximum clock frequency suitable for many applications, with a speed grade of -5.
7. Power Management: Designed for low power consumption, making it ideal for battery-operated devices.
8. Development Tools: Compatible with Xilinx development tools, enhancing design productivity.
These features make the XC3S1600E-5FGG320C suitable for a wide range of applications such as communications, automotive, and consumer electronics.
Pinout
The primary functions of the pins include:
- I/O Pins: Configurable as input, output, or bidirectional, supporting various voltage levels and signaling standards.
- Dedicated Clock Inputs: For clock signals to synchronize operations.
- Configuration Pins: Used for loading the FPGA configuration at power-up.
- Power and Ground Pins: Provide necessary power supply and ground connections.
- JTAG Pins: For boundary scan testing and in-system programming.
The XC3S1600E offers a balance of performance, flexibility, and ease of use, making it suitable for a wide range of applications.
Manufacturer
Founded in 1984, Xilinx pioneered the FPGA technology, offering products that allow designers to create custom hardware solutions for various applications across industries such as telecommunications, automotive, aerospace, defense, and consumer electronics. The XC3S1600E-5FGG320C specifically belongs to the Spartan-3E family of FPGAs, known for their cost-efficiency and low power consumption, making them suitable for a wide range of applications, including embedded systems and digital signal processing.
Xilinx's influence extends into software and development tools, providing comprehensive support for system design and integration, thus enabling engineers to innovate rapidly and efficiently. The company's acquisition by AMD in 2020 has further strengthened its position in the semiconductor industry, enhancing its capabilities in high-performance computing and artificial intelligence applications.
Application
1. Embedded Systems: For real-time processing and control in consumer electronics.
2. Communications: In data processing for networking equipment and protocols.
3. Automotive: For advanced driver assistance systems (ADAS) and infotainment.
4. Industrial Automation: In robotic controls and automation systems.
5. Medical Devices: For imaging and diagnostic equipment.
6. Military and Aerospace: In signal processing and secure communications.
Its versatility and performance make it suitable for diverse applications requiring customization and parallel processing capabilities.