XC3S200A-4FTG256I

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XC3S200A-4FTG256I

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IC FPGA 195 I/O 256FTBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC3S200A-4FTG256I

  • Paket BGA-256

  • Auf Lager6990

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Attribut Wert
Package / Case Tray
Series Spartan®-3A
Part Status Active
Number of LABs/CLBs 448
Number of Logic Elements/Cells 4032
Total RAM Bits 294912
Number of I/O 195
Number of Gates 200000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC3S200A-4FTG256I is a member of the Xilinx Spartan-3A family of FPGAs, designed for cost-sensitive high-volume applications. It offers a balance of performance, low power consumption, and cost-effectiveness. This model features 200,000 system gates, making it suitable for various applications, including digital signal processing, embedded control, and communication systems.
The "-4" in the part number indicates a speed grade, with lower numbers typically denoting higher performance. The FTG256 package refers to a Fine-Pitch Thin Ball Grid Array with 256 pins, providing a compact and efficient solution for high-density circuit designs. The "I" at the end signifies an industrial temperature range, ensuring reliable operation in harsh environments.
Key features include abundant I/O options, block RAM, and support for multiple I/O standards. The device is programmable using Xilinx’s ISE Design Suite, allowing for custom logic design and implementation. Overall, the XC3S200A-4FTG256I is a versatile FPGA suitable for a range of industrial and commercial applications.

Equivalent

The XC3S200A-4FTG256I is a member of Xilinx's Spartan-3A FPGA family. Equivalent products can include FPGAs with similar logic cell counts, I/O capabilities, and package types from other manufacturers. Possible equivalents are:
1. Altera (now Intel) Cyclone III EP3C25 series.
2. Lattice Semiconductor's MachXO2 family.
3. Microsemi (now Microchip) IGLOO or ProASIC3 series.
Always check specific specifications like logic resources, I/O pins, and power requirements to ensure compatibility.

Features

The XC3S200A-4FTG256I is part of Xilinx's Spartan-3A FPGA family. Key features include:
1. Logic Cells: 200,000 system gates.
2. I/O Pins: 195 available user I/O pins.
3. Performance: -4 speed grade.
4. Package: FTG256, a fine-pitch ball grid array (BGA) with 256 pins.
5. Temperature Range: Industrial grade, supporting operation from -40°C to +100°C.
6. Voltage: Core voltage of 1.2V with flexible I/O standards supporting 3.3V, 2.5V, and 1.5V.
7. Embedded Multipliers: 12 dedicated 18x18 multipliers for efficient DSP operations.
8. Block RAM: 360 Kbits of fast block RAM.
9. Configuration: Supports JTAG and various configuration modes including Master Serial/SPI.
This FPGA is ideal for cost-sensitive applications requiring moderate logic and I/O capabilities, such as automotive, industrial, and consumer electronics applications. It provides a good balance of performance, power efficiency, and cost-effectiveness.

Pinout

The XC3S200A-4FTG256I is a part of the Xilinx Spartan-3A FPGA family. It comes in a 256-pin Fine-Pitch Thin Ball Grid Array (FTG256) package. This FPGA is designed for cost-sensitive and high-volume applications and includes features like low power consumption and high performance.
The device offers 200,000 system gates and contains a variety of functional features distributed across its pins. These pins are used for:
1. I/O Functions: Many pins serve as general-purpose I/O (GPIO) that can be configured for different voltage standards and protocols.
2. Power and Ground: Several pins are dedicated to power (VCCINT, VCCAUX, VCCO) and ground (GND) connections.
3. Configuration: Pins allow for configuration via JTAG, SPI, or other standard interfaces.
4. Clock Inputs: Special pins are designated for clock inputs to drive the FPGA's logic.
5. Dedicated Functions: Some pins are used for specific functionalities like configuration done, program, and reset signals.
This device is suitable for applications requiring a balance between cost and performance.

Manufacturer

The XC3S200A-4FTG256I is manufactured by Xilinx, Inc. Xilinx is a technology company known for its development and production of programmable logic devices. It specializes in field-programmable gate arrays (FPGAs), which are integrated circuits designed to be configured by the customer or designer after manufacturing. Xilinx's products are widely used in various applications, including telecommunications, data centers, automotive, aerospace, and defense, because they offer flexibility and the ability to be reprogrammed to meet specific application needs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices) to expand its capabilities in adaptive computing.

Application

The XC3S200A-4FTG256I is a Spartan-3A FPGA from Xilinx, suitable for a variety of applications. Its primary uses include digital signal processing, embedded control systems, communications, and consumer electronics. It is also employed in industrial automation, automotive systems, and test and measurement equipment. The FPGA's reconfigurability and cost-effectiveness make it ideal for prototyping and custom hardware development. Additionally, its low power consumption and robust performance are beneficial for portable and battery-operated devices.

Package

The XC3S200A-4FTG256I is a Spartan-3A FPGA from Xilinx, featuring a 256-pin Fine-Pitch Thin Ball Grid Array (FTG256) package. It is designed for industrial temperature range applications.

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