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XC3S200A-4FTG256I
+StücklisteIC FPGA 195 I/O 256FTBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC3S200A-4FTG256I
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Paket BGA-256
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Auf Lager6990
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-3A |
| Part Status | Active |
| Number of LABs/CLBs | 448 |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of I/O | 195 |
| Number of Gates | 200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The "-4" in the part number indicates a speed grade, with lower numbers typically denoting higher performance. The FTG256 package refers to a Fine-Pitch Thin Ball Grid Array with 256 pins, providing a compact and efficient solution for high-density circuit designs. The "I" at the end signifies an industrial temperature range, ensuring reliable operation in harsh environments.
Key features include abundant I/O options, block RAM, and support for multiple I/O standards. The device is programmable using Xilinx’s ISE Design Suite, allowing for custom logic design and implementation. Overall, the XC3S200A-4FTG256I is a versatile FPGA suitable for a range of industrial and commercial applications.
Equivalent
1. Altera (now Intel) Cyclone III EP3C25 series.
2. Lattice Semiconductor's MachXO2 family.
3. Microsemi (now Microchip) IGLOO or ProASIC3 series.
Always check specific specifications like logic resources, I/O pins, and power requirements to ensure compatibility.
Features
1. Logic Cells: 200,000 system gates.
2. I/O Pins: 195 available user I/O pins.
3. Performance: -4 speed grade.
4. Package: FTG256, a fine-pitch ball grid array (BGA) with 256 pins.
5. Temperature Range: Industrial grade, supporting operation from -40°C to +100°C.
6. Voltage: Core voltage of 1.2V with flexible I/O standards supporting 3.3V, 2.5V, and 1.5V.
7. Embedded Multipliers: 12 dedicated 18x18 multipliers for efficient DSP operations.
8. Block RAM: 360 Kbits of fast block RAM.
9. Configuration: Supports JTAG and various configuration modes including Master Serial/SPI.
This FPGA is ideal for cost-sensitive applications requiring moderate logic and I/O capabilities, such as automotive, industrial, and consumer electronics applications. It provides a good balance of performance, power efficiency, and cost-effectiveness.
Pinout
The device offers 200,000 system gates and contains a variety of functional features distributed across its pins. These pins are used for:
1. I/O Functions: Many pins serve as general-purpose I/O (GPIO) that can be configured for different voltage standards and protocols.
2. Power and Ground: Several pins are dedicated to power (VCCINT, VCCAUX, VCCO) and ground (GND) connections.
3. Configuration: Pins allow for configuration via JTAG, SPI, or other standard interfaces.
4. Clock Inputs: Special pins are designated for clock inputs to drive the FPGA's logic.
5. Dedicated Functions: Some pins are used for specific functionalities like configuration done, program, and reset signals.
This device is suitable for applications requiring a balance between cost and performance.