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XC3S250E-4FTG256C
+StücklisteIC FPGA 172 I/O 256FTBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC3S250E-4FTG256C
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Paket FBGA-256
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Auf Lager2195
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 612 |
| NumberofLogicElements/Cells | 5508 |
| TotalRAMBits | 221184 |
| NumberofI/O | 172 |
| NumberofGates | 250000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
Key characteristics include 5,508 logic cells, 12 dedicated multipliers for efficient processing, and 216 Kbits of block RAM for data storage. It supports a range of I/O standards and configurations, enabling flexible connectivity options for different peripherals and systems. With a speed grade of -4, the XC3S250E-4FTG256C offers moderate performance suitable for many standard applications.
This FPGA is ideal for applications such as consumer electronics, communication devices, and industrial automation. It supports various development tools and environments, making it accessible for both beginners and experienced designers to implement complex digital systems with ease.
Equivalent
Features
1. Logic Cells: Contains approximately 250,000 system gates and 5,508 logic cells for implementing complex logic designs.
2. Configurable I/O Pins: Provides 195 I/O pins with support for multiple I/O standards, allowing for versatile interfacing.
3. Memory: Incorporates 12 Block RAMs, each 18 Kb, resulting in a total of 216 Kb of embedded memory.
4. Clock Management: Equipped with four Digital Clock Managers (DCMs) for advanced clock signal manipulation and phase shifting.
5. Speed Grade: Rated at -4 speed grade, indicating its performance level.
6. Packaging: Comes in a 256-pin FTG (Fine-Pitch Thin Ball Grid Array) package.
7. Voltage: Operates at a core voltage of 1.2V with I/O standards supporting 1.2V to 3.3V.
8. Applications: Suitable for applications like consumer electronics, automotive, and communications due to its cost-effectiveness and flexibility.
These features make the XC3S250E-4FTG256C an attractive choice for implementing a broad range of digital designs.
Pinout
- Pin Count: The device has 256 pins.
- Functionality: The XC3S250E is designed for low-cost, high-volume applications and offers a range of features suitable for a variety of designs. It includes configurable logic blocks (CLBs), embedded Block RAM, digital clock managers (DCMs), and various I/O options. It supports multiple I/O standards, making it versatile for different applications. The device can be used for digital signal processing, data processing, and interfacing tasks.
Overall, the XC3S250E-4FTG256C is a cost-effective FPGA that provides flexibility and functionality for a wide array of electronic designs.
Application
1. Digital Signal Processing (DSP): Ideal for implementing DSP algorithms in communications and multimedia.
2. Embedded Systems: Used for developing custom embedded processors and peripherals.
3. Communications: Supports protocols and data processing in networking equipment.
4. Consumer Electronics: Applied in devices requiring customization and rapid prototyping.
5. Industrial Automation: Facilitates control systems and interface logic.
6. Automotive Applications: Used in in-vehicle networking and infotainment systems.
7. Educational and Research: Suitable for academic projects and FPGA learning platforms.
Its versatility makes it suitable for rapid prototyping and low-volume production.