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XC3S400-4FTG256C
+StücklisteIC FPGA 173 I/O 256FTBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC3S400-4FTG256C
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Paket FBGA-256
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Auf Lager5793
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 896 |
| NumberofLogicElements/Cells | 8064 |
| TotalRAMBits | 294912 |
| NumberofI/O | 173 |
| NumberofGates | 400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
Key attributes of the XC3S400-4FTG256C include its ability to support a wide array of digital logic designs, making it suitable for applications in consumer electronics, automotive systems, and telecommunications. The FPGA is equipped with embedded multipliers, block RAM, and digital clock managers (DCMs) to facilitate dynamic and flexible design implementation. It is often used in projects requiring cost-effective reprogrammable logic solutions.
Equivalent
1. Lattice ECP2 family, such as the LFE2-20E-6FN256C.
2. Intel (Altera) Cyclone II series, like the EP2C35F484C6.
3. Microsemi (Actel) ProASIC3 series, such as the A3P400-FG256.
These alternatives offer comparable logic densities and I/O capabilities, but exact equivalency depends on the specific application requirements.
Features
1. Logic Cells: It contains approximately 400,000 system gates and 8,064 logic cells.
2. I/O Pins: Offers 173 user I/O pins, providing extensive connectivity options.
3. Package: Available in a 256-pin Fine-Pitch Thin Ball Grid Array (FTG256) package.
4. Speed Grade: The "-4" indicates a specific speed grade, affecting the maximum frequency and performance characteristics.
5. Memory: Features 360 Kbits of block RAM, suitable for data storage and processing tasks.
6. Power: Operates at a core voltage of 1.2V with I/O standards supporting 3.3V and other levels.
7. Clock Management: Equipped with four Digital Clock Managers (DCMs) for advanced clock management and signal synchronization.
8. Applications: Ideal for cost-sensitive applications like wireless communication, automotive, and consumer electronics.
These features make it suitable for various digital circuit implementations, balancing performance and cost-effectiveness.
Pinout
Key functions and characteristics include:
- Logic Cells: The XC3S400 device contains approximately 400,000 system gates.
- I/O Pins: The device supports multiple I/O standards and contains configurable I/O blocks, enabling it to interface with various voltages and signaling standards.
- Programmable Logic: Features Configurable Logic Blocks (CLBs) consisting of slices, each with Look-Up Tables (LUTs) and flip-flops, allowing for flexible logic designs.
- Block RAM: Includes dedicated block RAM for data storage applications.
- Clock Management: Provides Digital Clock Managers (DCMs) for clock signal management and manipulation.
- Connectivity: Suitable for a wide range of applications such as communications, consumer electronics, automotive, and industrial control systems due to its versatility and reconfigurable nature.
The XC3S400-4FTG256C offers a good combination of features for various medium-sized FPGA applications.
Manufacturer
Application
1. Consumer Electronics: Used in portable devices, digital cameras, and home appliances for signal processing and control.
2. Communications: Utilized in networking equipment for data routing and signal processing.
3. Automotive: Supports infotainment systems and driver assistance technologies.
4. Industrial Automation: Applied in robotics, motor control, and sensor interfacing.
5. Medical Devices: Used in imaging and diagnostic equipment for processing and control functions.
6. Aerospace and Defense: Employed in radar, avionics, and communication systems.
Its versatility, cost-effectiveness, and low power consumption make it suitable for these diverse applications.