Abbildungen dienen nur als Referenz
XC3S4000-4FG676I
+StücklisteIC FPGA 489 I/O 676FCBGA
-
HerstellerAMD
-
Herstellerteil #XC3S4000-4FG676I
-
Auf Lager4259
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Series | Spartan®-3 |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 62208 |
| Total RAM Bits | 1769472 |
| Number of I/O | 489 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Base Product Number | XC3S4000 |
| Number of LA Bs / CL Bs | 6912 |
| Number of Gates | 4000000 |
Übersicht
Description
This FPGA is well-suited for applications requiring a large number of gates, such as digital signal processing, telecommunications, and data management. It includes up to 784 user I/Os, block RAM, and support for numerous I/O standards, making it versatile for various design requirements. Additionally, the Spartan-3 family emphasizes cost-effectiveness without compromising on performance, making it an attractive choice for developers seeking a reliable FPGA solution in budget-constrained projects.
The XC3S4000-4FG676I supports Xilinx design tools like ISE and Vivado, facilitating efficient project development and deployment.
Equivalent
Features
1. Logic Cells: Contains approximately 4,000,000 system gates.
2. Configurable Logic Blocks (CLBs): Provides flexible logic implementation.
3. I/O Blocks: 532 I/O pins with support for multiple I/O standards.
4. Memory: Includes 1,728 Kbits of block RAM and distributed RAM capability.
5. Performance: Offers a system clock rate up to 400 MHz.
6. Package: Available in a 676-pin Fine-Pitch Ball Grid Array (FBGA).
7. Temperature Range: Industrial grade, suitable for temperatures between -40°C and 100°C.
8. Power Management: Features dynamic power management and low static power consumption.
9. Built-in Multipliers: Equipped with dedicated 18x18-bit multipliers for arithmetic operations.
10. Configuration Options: Supports various configuration methods, including JTAG, serial, and parallel modes.
The XC3S4000-4FG676I is ideal for applications requiring a balance of performance, cost, and flexibility, such as automotive, consumer electronics, and communication systems.
Pinout
Key functionalities include:
1. Logic Resources: The XC3S4000 has a large number of logic cells, enabling complex digital designs.
2. I/O Capabilities: It supports a versatile array of input/output standards, making it adaptable to different signaling requirements.
3. Memory: Integrated block RAM resources are available for data storage and processing.
4. Clock Management: Features such as DCMs (Digital Clock Managers) allow for flexible clock signal generation and management.
5. Embedded Multiplier Blocks: Useful for digital signal processing applications, enhancing performance for tasks like filtering and modulation.
These features make the XC3S4000 suitable for a variety of applications, including consumer electronics, industrial control systems, and communication devices.
Manufacturer
Xilinx was founded in 1984 and has been a leader in the FPGA market, providing advanced and flexible solutions that enable rapid product development and innovation. Their products are used across various industries for tasks that require high performance and parallel processing capabilities. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry, which further expanded its reach and capabilities in the computing and AI sectors. Xilinx’s solutions are pivotal in areas such as data centers, wireless communications, and embedded systems, making it a significant entity in the tech landscape.
Application
1. Telecommunications: Used for signal processing, protocol conversion, and network infrastructure.
2. Automotive: Employed in advanced driver-assistance systems (ADAS) and infotainment.
3. Consumer Electronics: Supports digital video processing and display technologies.
4. Industrial Automation: Utilized in control systems, motor drives, and robotics.
5. Medical Devices: Applied in imaging systems and diagnostic equipment.
6. Aerospace and Defense: Used for radar systems, avionics, and electronic warfare.
Its programmability and reconfigurability make it suitable for diverse and evolving technological needs.