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IC FPGA 489 I/O 676FBGA
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HerstellerAMD
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Herstellerteil #XC3S4000-4FGG676C
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Auf Lager2349
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Series | Spartan®-3 |
| Part Status | Obsolete |
| Base Product Number | XC3S4000 |
| Digi Key Programmable | Not Verified |
| Number of LA Bs / CL Bs | 6912 |
| Number of Logic Elements / Cells | 62208 |
| Total RAM Bits | 1769472 |
| Number of I/O | 489 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Packaging | Tray |
| Number of Gates | 4000000 |
Übersicht
Description
Key features include:
1. Logic Cells: It contains a substantial number of logic cells, making it suitable for complex designs.
2. I/O Pins: With numerous I/O pins, it facilitates extensive connectivity and interfacing with other components.
3. Clock Management: Offers digital clock managers (DCMs) for advanced clocking capabilities.
4. Memory: Includes distributed RAM and block RAM for efficient data storage and retrieval.
5. Speed Grade: The "-4" denotes its speed grade, balancing performance and power consumption.
6. Package Type: The "FGG676" refers to the package type, a fine-pitch ball grid array, ensuring a compact footprint.
Overall, the XC3S4000-4FGG676C is a versatile FPGA suitable for a variety of applications requiring moderate complexity and cost-efficiency.
Equivalent
Features
1. Logic Resources: It offers approximately 4 million system gates and 62,208 logic cells.
2. Memory: The device includes 1,728 Kbits of block RAM.
3. I/O Pins: There are 633 I/O pins available, suitable for a wide range of interface standards.
4. Performance: Operates at a speed grade of -4, providing an optimal balance between power and performance.
5. Package: Available in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins.
6. Power Management: Supports various power-saving options, making it efficient for portable and low-power applications.
7. Configuration: Supports multiple configuration modes including JTAG and SPI for flexibility in design.
These features make the XC3S4000-4FGG676C suitable for diverse applications, from consumer electronics to industrial systems, where cost efficiency and reliable performance are essential.
Pinout
Key functions and features of the XC3S4000-4FGG676C include:
1. Logic Gates: It provides about 4 million system gates, suitable for complex digital designs.
2. Configurable Logic Blocks (CLBs): Used for implementing logic functions.
3. I/O Blocks: Supports a wide range of I/O standards, as well as differential signaling.
4. Embedded Multipliers: Useful for DSP applications.
5. Block RAM: Includes block RAM for data storage and processing.
6. Digital Clock Managers (DCMs): For clock management and distribution.
7. Power Management: Efficient power use for various applications.
These features make the XC3S4000-4FGG676C a versatile choice for implementing high-performance, cost-effective digital circuits.
Manufacturer
Application
1. Embedded Systems: Used for prototyping and developing custom logic in embedded designs.
2. Communication Systems: Facilitates data processing and signal management in communication devices.
3. Consumer Electronics: Supports functions in devices such as TVs and gaming consoles.
4. Automotive: Provides processing power for in-vehicle infotainment and advanced driver-assistance systems.
5. Industrial Automation: Enables control logic and data processing in robotics and manufacturing equipment.
6. Aerospace and Defense: Used in applications requiring high reliability and performance, such as radar and satellite systems.