XC3S4000-4FGG676C

Abbildungen dienen nur als Referenz

XC3S4000-4FGG676C

+Stückliste

IC FPGA 489 I/O 676FBGA

  • HerstellerAMD

  • Herstellerteil #XC3S4000-4FGG676C

  • Auf Lager2349

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Series Spartan®-3
Part Status Obsolete
Base Product Number XC3S4000
Digi Key Programmable Not Verified
Number of LA Bs / CL Bs 6912
Number of Logic Elements / Cells 62208
Total RAM Bits 1769472
Number of I/O 489
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Packaging Tray
Number of Gates 4000000

Übersicht

Description

The XC3S4000-4FGG676C is a model from the Xilinx Spartan-3 FPGA family, known for its balance of cost, performance, and power efficiency. This specific FPGA is designed for high-volume, cost-sensitive applications such as consumer electronics, automotive systems, and communication devices.
Key features include:
1. Logic Cells: It contains a substantial number of logic cells, making it suitable for complex designs.
2. I/O Pins: With numerous I/O pins, it facilitates extensive connectivity and interfacing with other components.
3. Clock Management: Offers digital clock managers (DCMs) for advanced clocking capabilities.
4. Memory: Includes distributed RAM and block RAM for efficient data storage and retrieval.
5. Speed Grade: The "-4" denotes its speed grade, balancing performance and power consumption.
6. Package Type: The "FGG676" refers to the package type, a fine-pitch ball grid array, ensuring a compact footprint.
Overall, the XC3S4000-4FGG676C is a versatile FPGA suitable for a variety of applications requiring moderate complexity and cost-efficiency.

Equivalent

The XC3S4000-4FGG676C is a Xilinx Spartan-3 FPGA. Equivalent products could include devices from similar families or competitors, such as Altera (now Intel) Cyclone series, Lattice Semiconductor's ECP series, or Microsemi's (now Microchip) IGLOO or ProASIC3 series. Specific models would depend on matching key specifications like logic cell count, I/O count, and performance characteristics. Always verify compatibility with your specific design needs.

Features

The XC3S4000-4FGG676C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family, designed for cost-sensitive, high-volume applications. Key features include:
1. Logic Resources: It offers approximately 4 million system gates and 62,208 logic cells.
2. Memory: The device includes 1,728 Kbits of block RAM.
3. I/O Pins: There are 633 I/O pins available, suitable for a wide range of interface standards.
4. Performance: Operates at a speed grade of -4, providing an optimal balance between power and performance.
5. Package: Available in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins.
6. Power Management: Supports various power-saving options, making it efficient for portable and low-power applications.
7. Configuration: Supports multiple configuration modes including JTAG and SPI for flexibility in design.
These features make the XC3S4000-4FGG676C suitable for diverse applications, from consumer electronics to industrial systems, where cost efficiency and reliable performance are essential.

Pinout

The XC3S4000-4FGG676C is a member of the Xilinx Spartan-3 FPGA family. It comes in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. This FPGA is designed for a variety of applications, including communications, consumer electronics, automotive, and industrial systems.
Key functions and features of the XC3S4000-4FGG676C include:
1. Logic Gates: It provides about 4 million system gates, suitable for complex digital designs.
2. Configurable Logic Blocks (CLBs): Used for implementing logic functions.
3. I/O Blocks: Supports a wide range of I/O standards, as well as differential signaling.
4. Embedded Multipliers: Useful for DSP applications.
5. Block RAM: Includes block RAM for data storage and processing.
6. Digital Clock Managers (DCMs): For clock management and distribution.
7. Power Management: Efficient power use for various applications.
These features make the XC3S4000-4FGG676C a versatile choice for implementing high-performance, cost-effective digital circuits.

Manufacturer

The XC3S4000-4FGG676C is manufactured by Xilinx, Inc., a company that specializes in the development and production of programmable logic devices. Xilinx is known for its field-programmable gate arrays (FPGAs), which are integrated circuits designed to be configured by the customer or designer after manufacturing. The company plays a significant role in the semiconductor industry, providing hardware solutions that cater to a wide range of applications, including communications, data centers, industrial, automotive, and aerospace. Xilinx’s FPGAs are widely used for their flexibility, allowing developers to create custom hardware functionalities to meet specific needs. In 2020, Xilinx was acquired by AMD, a leading company in high-performance computing, graphics, and visualization technologies, further expanding its reach and capabilities.

Application

The XC3S4000-4FGG676C is a Xilinx Spartan-3 FPGA used in various applications due to its flexibility and cost-effectiveness. Common application areas include:
1. Embedded Systems: Used for prototyping and developing custom logic in embedded designs.
2. Communication Systems: Facilitates data processing and signal management in communication devices.
3. Consumer Electronics: Supports functions in devices such as TVs and gaming consoles.
4. Automotive: Provides processing power for in-vehicle infotainment and advanced driver-assistance systems.
5. Industrial Automation: Enables control logic and data processing in robotics and manufacturing equipment.
6. Aerospace and Defense: Used in applications requiring high reliability and performance, such as radar and satellite systems.

Package

The XC3S4000-4FGG676C is a FPGA (Field-Programmable Gate Array) from Xilinx's Spartan-3 series. It features a fine-pitch ball grid array (FBGA) package with 676 pins. This specific model is designed for high-density, cost-sensitive applications and is part of the Spartan-3 family optimized for high-performance logic integration.