XC3S4000-5FG676C

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XC3S4000-5FG676C

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IC FPGA 489 I/O 676FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC3S4000-5FG676C

  • Paket FBGA-676

  • Auf Lager5156

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Attribut Wert
Package / Case Bulk
Series Spartan®-3
Part Status Active
Number of LABs/CLBs 6912
Number of Logic Elements/Cells 62208
Total RAM Bits 1769472
Number of I/O 489
Number of Gates 4000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)

Übersicht

Description

The XC3S4000-5FG676C is a member of Xilinx's Spartan-3 FPGA family, designed for cost-sensitive applications. It features approximately 4 million system gates, offering a balance between performance and cost-efficiency. The device is built on a 90nm process technology, ensuring low power consumption and high performance. It includes 676 pins in a Fine-Pitch Ball Grid Array (FG676) package, which provides ample I/O flexibility.
This FPGA is equipped with a variety of resources, including multiple Digital Clock Managers (DCMs) for precise clock management, abundant RAM blocks for data storage, and a high number of configurable logic blocks (CLBs) that allow for extensive customization and logic implementation. The -5 speed grade indicates its operational speed, providing a good balance between power consumption and processing speed.
The XC3S4000-5FG676C is ideal for applications ranging from consumer electronics to telecommunications and industrial automation, where cost-effectiveness and moderate performance are required. Its architecture supports various design tools and development environments, making it a versatile choice for engineers and developers.

Equivalent

The XC3S4000-5FG676C is a Xilinx Spartan-3 FPGA. Equivalent products might include:
1. Altera Cyclone II series (e.g., EP2C70).
2. Lattice ECP2 series (e.g., LFE2-70).
3. Microsemi (formerly Actel) ProASIC3 series (e.g., A3P4000).
These alternatives share similar logic capacity and features, but always check specific requirements, such as I/O count, power, and package type, to ensure compatibility.

Features

The XC3S4000-5FG676C is a member of the Xilinx Spartan-3 FPGA family, offering a good balance of performance, features, and cost-effectiveness. Key features include:
1. Logic Cells: Approximately 4,000,000 system gates, translating to about 62,208 logic cells.
2. I/O Pins: 489 user I/O pins, suitable for complex interfacing needs.
3. Speed Grade: The "-5" in the part number indicates a mid-range speed grade, offering moderate performance in the Spartan-3 family.
4. Package: FG676, a fine-pitch ball grid array (BGA) with 676 pins.
5. Embedded Multipliers: 96 dedicated multipliers for efficient DSP applications.
6. Block RAM: 1,728 Kbits of dual-port RAM for flexible data storage.
7. Power: Designed for low power consumption, making it suitable for power-sensitive applications.
8. Configuration: Supports multiple configuration modes, including JTAG and Slave Serial.
These features make it suitable for a wide range of applications, including communications, automotive, industrial, and consumer electronics.

Pinout

The XC3S4000-5FG676C is a member of the Xilinx Spartan-3 FPGA family. It comes in a FG676 package, which denotes a Fine-Pitch Ball Grid Array (FBGA) with 676 pins. The device offers a range of configurable logic blocks (CLBs), input/output blocks (IOBs), and other embedded features, making it suitable for various digital designs and applications.
Key features include:
- Total Pin Count: 676 pins.
- Logic Resources: Offers about 4 million system gates.
- I/O Pins: Supports up to 633 user I/O pins (the exact number depends on configuration and usage).
- Embedded Features: Includes multipliers, block RAM, and support for multiple I/O standards.
These features make it suitable for applications requiring a high degree of flexibility, such as digital signal processing, embedded systems, and custom hardware accelerators. The -5 speed grade indicates a mid-range performance specification within the Spartan-3 family.

Manufacturer

The XC3S4000-5FG676C is manufactured by Xilinx, Inc. Xilinx is a semiconductor company known for designing and developing programmable logic devices, notably Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and related software. Founded in 1984 and headquartered in San Jose, California, Xilinx has been a pioneer in the field of programmable logic, providing technology that enables designers to customize semiconductor chips post-manufacturing.
FPGAs like the XC3S4000-5FG676C are used in various applications across industries, including telecommunications, automotive, aerospace, defense, and consumer electronics, due to their flexibility, reprogrammability, and ability to deliver high performance. Xilinx's products are integral to the development and deployment of innovative technologies and systems, allowing for rapid prototyping and iterative design processes.
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a leading global semiconductor company, further expanding its reach and resources in the industry. The acquisition was completed in 2022, positioning AMD and Xilinx to leverage their combined strengths in high-performance and adaptive computing solutions.

Application

The XC3S4000-5FG676C is a field-programmable gate array (FPGA) from the Xilinx Spartan-3 family. It is commonly used in applications requiring high-performance digital signal processing, customizable logic, and prototyping. Key application areas include telecommunications infrastructure, such as base stations and network equipment, industrial automation systems, automotive electronics, aerospace and defense systems, and consumer electronics. It is also suitable for use in ASIC prototyping, image and video processing, and any application requiring adaptable hardware configurations. Its balance of cost, performance, and power efficiency makes it ideal for both commercial and high-volume consumer applications.

Package

The XC3S4000-5FG676C is a field-programmable gate array (FPGA) from Xilinx, part of the Spartan-3 series. It comes in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. This package type is suitable for applications requiring a balance of performance and cost-efficiency, offering a large number of logic gates and versatile I/O options.

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