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XC3S700A-4FGG484I
+StücklisteIC FPGA 372 I/O 484FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC3S700A-4FGG484I
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Paket FCBGA-484
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Auf Lager6292
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-3A |
| Part Status | Active |
| Number of LABs/CLBs | 1472 |
| Number of Logic Elements/Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of I/O | 372 |
| Number of Gates | 700000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
- Low-cost, high-performance FPGA for embedded applications.
- Integrated DSP blocks (16 multipliers) for arithmetic operations.
- Multi-voltage support (1.2V core, 3.3V/2.5V I/O).
- On-chip clock management (DCM & PLL).
- Non-volatile configuration (supports SPI flash).
Common uses: Industrial control, communications, automotive, and consumer electronics.
The -4FGG484I suffix indicates:
- -4: Speed grade.
- FGG484: FBGA package with 484 pins.
- I: Industrial temperature range (-40°C to +100°C).
A cost-effective choice for mid-range FPGA designs.
Equivalent
1. Spartan-3E (XC3S700E) – Similar logic capacity but different features.
2. Spartan-6 (XC6SLX75) – Newer, higher performance, but requires migration.
3. Lattice ECP3 (LFE3-70EA) – Comparable FPGA from Lattice Semiconductor.
4. Altera Cyclone III (EP3C40) – Alternative from Intel (formerly Altera).
Check pin compatibility and features before substitution.
Pinout
- 484-pin Fine-Pitch Ball Grid Array (FBGA) package.
- Key functions:
- 6,822 logic cells, 360Kb block RAM, 8 DSP slices.
- 326 user I/O pins (supports LVCMOS, LVTTL, HSTL, and SSTL standards).
- 4 digital clock managers (DCMs) and 8 global clocks.
- Interfaces: SPI, I²C, MultiBoot support.
- -4 speed grade (moderate performance).
Designed for cost-sensitive, high-volume applications.
Application
1. Embedded Systems – For control and interfacing.
2. Industrial Automation – Motor control, PLCs, and sensors.
3. Communications – Signal processing and protocol bridging.
4. Consumer Electronics – Display controllers and multimedia devices.
5. Automotive – Infotainment and driver assistance systems.
6. Medical Devices – Portable diagnostic equipment.
Its low cost, moderate logic density (700K gates), and 484-pin BGA package make it suitable for cost-sensitive, mid-complexity designs.