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XC4VLX25-11FFG668C
+StücklisteIC FPGA 448 I/O 668FCBGA
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HerstellerAMD
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Herstellerteil #XC4VLX25-11FFG668C
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Auf Lager3049
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Spezifikationen
| Attribut | Wert |
| Series | Virtex®-4 LX |
| Part Status | Active |
| Base Product Number | XC4VLX25 |
| Digi Key Programmable | Not Verified |
| Number of LA Bs / CL Bs | 2688 |
| Number of Logic Elements / Cells | 24192 |
| Total RAM Bits | 1327104 |
| Number of I/O | 448 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 668-BBGA, FCBGA |
| Supplier Device Package | 668-FCBGA (27x27) |
| Packaging | Tray |
Übersicht
Description
Key features include:
- Architecture: It has a rich set of resources, including DSP slices, block RAMs, and configurable I/O.
- Power Efficiency: Designed for lower power consumption, it is ideal for portable and energy-sensitive applications.
- Flexibility: As a reprogrammable device, it allows designers to implement changes and updates post-manufacturing, facilitating iterative development and design optimization.
- Applications: Commonly used in communications, automotive, aerospace, and industrial applications, where adaptability and performance are critical.
Overall, the XC4VLX25-11FFG668C is a versatile solution for engineers looking to develop innovative electronic systems.
Equivalent
Features
1. Logic Cells: It has approximately 25,000 logic cells, allowing for complex designs.
2. High Performance: Supports high-speed operation with a maximum clock frequency of around 550 MHz.
3. Configurable I/O: Offers up to 84 user-configurable I/O pins with support for various voltage levels.
4. Embedded Memory: Includes up to 1.5 Mb of block RAM for efficient data storage and processing.
5. Digital Signal Processing (DSP): Features dedicated DSP slices suitable for high-performance arithmetic operations.
6. Power Management: Designed with power efficiency in mind, supporting various power-saving modes.
7. Flexible Configuration: Can be configured via JTAG or serial interfaces, allowing for easy updates.
8. Packages: Comes in a 668-ball Fine Pitch Ball Grid Array (FBGA) package, suitable for dense applications.
These features make it ideal for applications in telecommunications, automotive, and industrial automation.
Pinout
The primary functions of this FPGA include digital signal processing, high-performance computing, and flexible hardware design, enabling users to implement complex algorithms and data paths. It features a variety of I/O standards, multiple dedicated clock management resources, and high-speed serial transceivers, making it suitable for a wide range of applications in telecommunications, automotive, aerospace, and industrial systems.
Additionally, it offers a combination of logic resources, including configurable logic blocks (CLBs), block RAM, and digital signal processing (DSP) slices, allowing for efficient data manipulation and processing tasks.
Manufacturer
Founded in 1984, Xilinx was a pioneer in the FPGA market and has played a significant role in the development of adaptive computing technologies. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), which further expanded its capabilities in high-performance computing and adaptive systems. The company focuses on innovation, providing high-performance and energy-efficient solutions for a wide range of industries that require flexibility and scalability in their electronic designs.