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XC6SLX100-2FGG484C
+StücklisteIC FPGA 326 I/O 484FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX100-2FGG484C
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Paket BGA-484
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Auf Lager4805
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 7911 |
| Number of Logic Elements/Cells | 101261 |
| Total RAM Bits | 4939776 |
| Number of I/O | 326 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
Key features include:
1. Logic Cells: It contains approximately 101,261 logic cells, providing ample resources for complex designs.
2. Package: The FGG484 package signifies a Fine-Pitch Ball Grid Array (FBGA) with 484 pins, ensuring a compact form factor for space-constrained applications.
3. Speed Grade: The "-2" denotes a specific speed grade, reflecting the performance capabilities in terms of timing and power efficiency.
4. Temperature Range: The "C" suffix indicates a commercial temperature range, which supports operating temperatures from 0°C to 85°C.
5. Connectivity: It supports a variety of I/O standards and offers embedded memory, DSP slices, and clock management features.
6. Power Efficiency: The architecture is optimized for low power consumption, crucial for portable and battery-powered devices.
Overall, the XC6SLX100-2FGG484C is well-suited for developers seeking an efficient, high-performance FPGA for diverse industrial applications.
Equivalent
Features
1. Logic Cells: 101,261 logic cells with efficient logic slice utilization.
2. Memory: Up to 4.8 Mbits of block RAM, useful for data storage and buffering.
3. DSP Functionality: Contains 180 DSP slices, enhancing digital signal processing capabilities.
4. I/O Pins: Offers 338 user I/Os for extensive connectivity options.
5. Clock Management: Equipped with advanced clock management tiles (CMTs) that include phase-locked loops (PLLs) for better clock distribution.
6. Power Efficiency: Designed to maximize performance per watt, making it suitable for power-sensitive applications.
7. Package: Comes in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package.
8. Speed Grade: -2 speed grade, indicating its balance between performance and power consumption.
These features make the XC6SLX100-2FGG484C suitable for applications such as communications, automotive, consumer electronics, and industrial control systems.
Pinout
Key functions and features include:
1. Logic Resources: The device provides a significant amount of configurable logic blocks, suitable for implementing a variety of digital circuits.
2. I/O Resources: It features numerous I/O pins that can be configured for different standards, making it versatile for interfacing with other devices.
3. Memory: Integrated block RAM and distributed RAM allow for efficient data storage and retrieval.
4. DSP Slices: These are specialized for high-speed arithmetic operations, beneficial for signal processing tasks.
5. Clock Management: Includes Digital Clock Managers (DCMs) and PLLs for flexible clock signal manipulation.
6. Power Efficiency: Designed with power optimization features to reduce overall consumption.
This FPGA is ideal for applications requiring a balance of resources, performance, and cost-effectiveness.