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XC6SLX100-2FGG484I
+StücklisteIC FPGA 326 I/O 484FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX100-2FGG484I
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Paket FCBGA-484
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Auf Lager1679
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 7911 |
| Number of Logic Elements/Cells | 101261 |
| Total RAM Bits | 4939776 |
| Number of I/O | 326 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package, the part is suitable for applications requiring compact design and high pin count connectivity. It supports various I/O standards and integrates multiple features like DSP slices, block RAM, and high-speed serial connectivity, making it versatile for digital signal processing and embedded systems.
The "-2" speed grade indicates moderate performance, suitable for many standard applications. The "I" suffix signifies that this model is intended for industrial temperature ranges, ensuring reliability in harsher environments. The XC6SLX100-2FGG484I is ideal for applications requiring a combination of performance, flexibility, and cost-effectiveness.
Equivalent
1. Lattice ECP5 series, such as LFE5UM-85F-8BG381C
2. Intel (Altera) Cyclone IV series, such as EP4CE115F29C7
3. Microsemi (Microchip) IGLOO2 series, such as M2GL090T-1FGG484I
These alternatives offer similar FPGA capabilities in terms of logic elements and IO pin count, although specifics may vary.
Features
1. Logic Cells: 101,261 logic cells provide ample capacity for complex designs.
2. Slices: 15,822 slices, each containing four 6-input LUTs and eight flip-flops.
3. RAM: 4,824 Kbits of block RAM for data storage and buffering.
4. DSP Slices: 180 DSP slices for efficient implementation of complex algorithms.
5. I/O Pins: 338 I/O pins for flexible connectivity options.
6. Packages: Comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.
7. Operating Temperature: Industrial-grade temperature range (-40°C to +100°C).
8. Power Management: Features numerous power management options to optimize power usage.
9. Clock Management: 6 clock management tiles (CMTs), each with a phase-locked loop (PLL).
10. Connectivity: Supports various connectivity standards, including PCI Express and Gigabit Ethernet.
These features make the XC6SLX100-2FGG484I suitable for diverse applications, including consumer electronics, industrial automation, and automotive systems.
Pinout
The primary function of the XC6SLX100-2FGG484I is to provide a flexible, programmable logic platform. It is used in a variety of applications including digital signal processing, control systems, and communications. The device features include:
- Logic Resources: It has a large number of configurable logic blocks (CLBs) for implementing custom logic functions.
- Memory: It includes distributed RAM and block RAM for data storage and processing.
- DSP Slices: Offers dedicated DSP slices for high-speed arithmetic operations.
- I/O: Provides multiple I/O standards with flexible pin configurations.
- Clock Management: Includes digital clock managers (DCMs) for clock synthesis and management.
Overall, the XC6SLX100-2FGG484I is a versatile FPGA ideal for applications that require a balance of cost, performance, and power efficiency.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a global semiconductor company, in a deal that was completed in February 2022. This acquisition has allowed AMD to broaden its product portfolio and enhance its capabilities in data center, gaming, and embedded markets by leveraging Xilinx's expertise in FPGAs and adaptive computing solutions.
Application
1. Embedded Systems: Acts as a reconfigurable hardware platform for various embedded applications.
2. Digital Signal Processing: Handles complex calculations required in DSP applications efficiently.
3. Communications: Used in networking equipment for packet processing and protocol implementations.
4. Industrial Automation: Provides control and interfaces in industrial systems.
5. Consumer Electronics: Supports high-speed data transfer and processing in devices.
6. Automotive: Assists in advanced driver-assistance systems (ADAS) and infotainment systems.
7. Prototyping: Rapid development and testing of new products and algorithms.
These applications leverage the FPGA's balance of logic resources, I/O capabilities, and performance.