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IC FPGA 338 I/O 484FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX150-2FGG484I
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Paket FCBGA-484
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Auf Lager4334
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 11519 |
| Number of Logic Elements/Cells | 147443 |
| Total RAM Bits | 4939776 |
| Number of I/O | 338 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XC6SLX150 include a large number of configurable logic blocks (CLBs), dedicated DSP slices for efficient signal processing, and abundant I/O options, making it versatile for various applications. The "-2" in its designation specifies its speed grade, which influences performance characteristics such as maximum clock speed.
The Spartan-6 series is widely used in applications requiring low power and cost-effective solutions like telecommunications, automotive, industrial, and consumer electronics. Its architecture supports various interfaces and connectivity standards, making it adaptable for complex designs in embedded systems. With robust documentation and support from Xilinx, this FPGA offers flexibility for developers and engineers designing custom digital circuits.
Equivalent
1. Intel Cyclone IV E FPGA series (e.g., EP4CE150)
2. Lattice ECP3 FPGA series (e.g., LFE3-150)
3. Microsemi (now part of Microchip) IGLOO2 FPGA series (e.g., M2GL150)
These alternatives vary in features and performance, so it's essential to verify compatibility with specific application requirements.
Features
1. Logic Resources: It contains approximately 147,443 logic cells, providing extensive capabilities for complex designs.
2. Memory: Equipped with 4,812 Kbits of block RAM for efficient data storage and retrieval.
3. DSP Slices: Includes 180 DSP slices for high-performance arithmetic operations, suitable for signal processing tasks.
4. I/O Pins: Supports up to 338 I/O pins, facilitating a wide range of connectivity options.
5. Clock Management: Features 6 clock management tiles, each with a phase-locked loop (PLL) for precise clocking.
6. Configuration: Supports multiple configuration modes including JTAG, serial, and parallel for flexibility in programming.
7. Power: Designed for low power consumption, making it suitable for energy-sensitive applications.
8. Package: Comes in a FGG484 package with a -40°C to 100°C industrial temperature range, ensuring reliability in harsh environments.
These features make it suitable for applications in communications, industrial, automotive, and consumer electronics.
Pinout
1. General-Purpose I/O (GPIO): These pins are used for digital input and output operations.
2. Power and Ground Pins: Dedicated pins provide power to the FPGA core and I/O banks.
3. Configuration Pins: These are used for configuring the FPGA, including JTAG and other configuration interfaces.
4. Dedicated Clock Pins: Used for external clock inputs to drive the FPGA's internal clock networks.
5. Multi-Gigabit Transceivers (MGTs): Provide high-speed serial communication capabilities.
6. Differential Signaling Pins: Support for standards like LVDS for high-speed differential signaling.
7. Memory Interface Pins: Support for connecting external memory devices, such as SDRAM.
The XC6SLX150-2FGG484I is suitable for a range of applications requiring moderate logic resources, such as communication systems, consumer electronics, and other embedded systems.
Manufacturer
Xilinx has been a pioneer in the FPGA industry and has contributed significantly to the development and advancement of programmable logic technology. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a prominent semiconductor company recognized for its central processing units (CPUs), graphics processing units (GPUs), and other semiconductor products. This acquisition aimed to enhance the capabilities and product offerings of both companies in the semiconductor market, combining Xilinx's expertise in programmable logic with AMD's strengths in high-performance computing and graphics.
Application
1. Embedded Systems: Used in control systems and custom logic designs.
2. Communication Systems: Employed for signal processing, data routing, and protocol bridging in telecommunications equipment.
3. Industrial Automation: Utilized in control systems for machinery and robotics.
4. Consumer Electronics: Applied in devices requiring custom processing capabilities.
5. Medical Devices: Supports data acquisition and processing in diagnostic equipment.
6. Aerospace and Defense: Implemented in rugged environments for secure data processing tasks.
These applications leverage the device's programmable logic capabilities and I/O flexibility.