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XC6SLX25-2FTG256I
+StücklisteIC FPGA 186 I/O 256FTBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX25-2FTG256I
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Paket FBGA-256
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Auf Lager1645
365 Tage Qualitätsgarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 1879 |
| Number of Logic Elements/Cells | 24051 |
| Total RAM Bits | 958464 |
| Number of I/O | 186 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
This FPGA is equipped with 936 Kbits of block RAM, 38 Digital Signal Processing (DSP) slices for computational tasks, and multiple I/O standards support, enhancing its versatility for various communication protocols. The Spartan-6 series focuses on optimizing power consumption while maintaining flexibility, making the XC6SLX25-2FTG256I ideal for applications in automotive, consumer electronics, and industrial automation.
Additionally, the Spartan-6 family supports advanced power management features and integrated memory controllers, providing a robust platform for efficient system design.
Equivalent
1. Lattice MachXO2 series FPGAs, such as the LCMXO2-4000 family.
2. Intel (Altera) Cyclone IV series, like the EP4CE22 family.
3. Microchip (Microsemi) IGLOO2 series, for low power applications.
These alternatives should be verified for specific requirements like logic cells, I/O count, and package type. Always consult datasheets for precise compatibility.
Features
1. Logic Cells: Approximately 24,051 logic cells for various applications.
2. Slices: Utilizes 3,758 logic slices, each containing four 6-input LUTs and eight flip-flops.
3. Block RAM: 936 Kbits of block RAM for data storage and buffering.
4. DSP Slices: 38 DSP slices for efficient implementation of complex algorithms like filters and decoders.
5. Clock Management: 4 CMTs (Clock Management Tiles) with mixed-mode clock managers (MMCMs) for advanced clocking.
6. I/O Pins: Supports 186 user I/O pins with diverse I/O standards.
7. Power: Low power consumption with a core voltage of 1.2V.
8. Package: Available in a 256-ball fine-pitch thin BGA package.
9. Temperature Range: Industrial-grade with a temperature range from -40°C to +100°C.
10. Design Tools: Compatible with Xilinx ISE Design Suite for design and implementation.
These features make it suitable for a wide range of applications including communications, automotive, consumer electronics, and industrial systems.
Pinout
Key functions of the pins include:
1. I/O Pins: For input/output operations, allowing the FPGA to interface with other components and systems.
2. Power Supply Pins: Provide the necessary power to the FPGA, including VCCINT for core voltage, VCCAUX for auxiliary functions, and VCCO for I/O banks.
3. Ground Pins: Dedicated pins for grounding, essential for stable FPGA operation.
4. Configuration Pins: Used for setting up and programming the FPGA, which might include JTAG interface pins for debugging and configuration.
5. Clock Pins: For clock input and management, critical for synchronous operation of the FPGA.
These functions enable the XC6SLX25-2FTG256I to be flexible and applicable in a wide range of digital applications, including data processing, signal processing, and embedded systems.
Manufacturer
Application
1. Embedded Systems: Used in custom hardware accelerators and controllers.
2. Telecommunications: Plays a role in signal processing, networking, and communication protocols.
3. Consumer Electronics: Supports multimedia and connectivity functions in devices.
4. Automotive: Used in infotainment systems and advanced driver-assistance systems (ADAS).
5. Industrial Automation: Facilitates real-time processing for control systems.
6. Medical Devices: Assists in imaging and diagnostic equipment.
7. Data Acquisition: Used in data logging and sensor interfacing tasks.
These applications leverage the FPGA's flexibility, I/O capabilities, and processing power.