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XC6SLX25-3CSG324C
+StücklisteIC FPGA 226 I/O 324CSBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX25-3CSG324C
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Paket 324-LFBGA
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Auf Lager7746
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1879 |
| NumberofLogicElements/Cells | 24051 |
| TotalRAMBits | 958464 |
| NumberofI/O | 226 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Übersicht
Description
Key characteristics include its 324-ball, fine-pitch ball grid array (FBGA) package, which provides a compact form factor. The device is equipped with approximately 24,051 logic cells, making it suitable for a wide range of applications, including consumer electronics, automotive, and communication systems.
The XC6SLX25-3CSG324C supports multiple I/O standards and offers integrated DSP slices, block RAM, and clock management features. Its low-power consumption and efficient design make it ideal for applications where heat dissipation and energy efficiency are crucial.
Overall, the XC6SLX25-3CSG324C is a versatile FPGA that provides developers with flexibility and ample resources for implementing complex logic designs in cost-sensitive projects.
Equivalent
1. Lattice ECP3-25 series
2. Intel (Altera) Cyclone IV EP4CE22
3. Microsemi (Microchip) IGLOO2 M2GL025
It's important to verify specific requirements like power consumption, I/O count, and package type when considering alternatives.
Features
1. Logic Resources: Approximately 24,051 logic cells.
2. Memory: 936 Kbits of block RAM.
3. DSP Slices: 38 DSP48A1 slices for signal processing applications.
4. Clock Management: Four Clock Management Tiles (CMTs), each with a Phase-Locked Loop (PLL) and two Digital Clock Managers (DCMs).
5. I/O: 218 user I/Os with support for various I/O standards including LVTTL, LVCMOS, PCI, and more.
6. Communication: Integrated support for various protocols, including PCI Express and Gigabit Ethernet.
7. Configuration: Supports multiple configuration modes like JTAG and SPI.
8. Package: Offered in a 324-ball grid array (BGA) package.
9. Operating Temperature: Commercial grade with a range of 0°C to 85°C.
10. Power: Optimized for low-power applications.
The XC6SLX25-3CSG324C is suitable for applications requiring high performance and flexibility, such as communications, automotive, and consumer electronics.
Pinout
Key features include:
1. Logic Resources: It contains 24,051 logic cells, which consist of configurable logic blocks (CLBs) that enable the creation of complex digital circuits.
2. Memory: The device offers 936 Kbits of Block RAM, which can be used for temporary data storage and buffering.
3. DSP Slices: There are 38 DSP slices available for signal processing applications.
4. I/O Options: The FPGA supports a range of I/O standards and includes dedicated resources for high-speed connectivity.
Overall, the XC6SLX25-3CSG324C is suitable for applications requiring a balance of performance, capacity, and power efficiency.
Manufacturer
Application
1. Consumer Electronics: Enhancing multimedia processing and connectivity in products like TVs and set-top boxes.
2. Industrial Automation: Enabling efficient control systems and signal processing in manufacturing environments.
3. Communications: Supporting protocols and data processing in networking equipment.
4. Automotive: Used in infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Implementing real-time processing in diagnostic and imaging equipment.
6. Aerospace and Defense: Providing robust solutions for avionics and defense systems.
These applications leverage the FPGA's programmable nature for custom logic implementation and scalability.