Abbildungen dienen nur als Referenz
XC6SLX25-N3CSG324I
+StücklisteIC FPGA 226 I/O 324CSBGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC6SLX25-N3CSG324I
-
Paket CSBGA-324
-
Auf Lager5044
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 1879 |
| Number of Logic Elements/Cells | 24051 |
| Total RAM Bits | 958464 |
| Number of I/O | 226 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XC6SLX25-N3CSG324I include 24,051 logic cells, 936 Kbits of block RAM, and up to 576 user I/O pins. It operates within an industrial temperature range and is housed in a 324-ball fine-pitch ball grid array (FBGA) package. This FPGA offers a balance of performance, power efficiency, and flexibility, making it suitable for applications like automotive systems, communications, consumer electronics, and industrial control.
The '-N3' in the part number indicates a specific speed grade, which affects the maximum clock frequency and performance of the device. The Spartan-6 family supports various design tools and IP cores, facilitating efficient development cycles and reduced time-to-market for engineers and developers.
Equivalent
- Intel's Cyclone IV series (e.g., EP4CE22)
- Lattice's ECP3 series (e.g., LFE3-17EA)
These alternatives offer similar logic density and I/O options, but differences in architecture, toolchain, and feature set should be considered when selecting a substitute.
Features
The Spartan-6 family is known for its low-cost, efficient performance and ease of use in applications such as automotive, consumer electronics, and industrial control systems. The XC6SLX25-N3CSG324I package is designed in a 324-ball fine-pitch ball grid array (FBGA), providing a compact and robust solution for space-constrained applications. Additionally, it supports advanced features like integrated memory controllers, high-speed serial connectivity, and power management systems, making it suitable for diverse applications that require flexible and configurable logic solutions.
Pinout
The functions of these pins include:
1. I/O Pins: Used for general-purpose input and output. These can be configured for a wide range of applications.
2. Power and Ground Pins: Provide necessary power and grounding for the device's operation.
3. Configuration Pins: Used to configure the FPGA, typically through JTAG or other configuration protocols.
4. Clock Pins: Dedicated pins to receive and manage clock signals for synchronous operations.
5. Special Function Pins: These may include pins for differential signals, memory interfaces, or other specific functionalities.
This FPGA is used in applications requiring moderate logic density, high-performance logic, and low power consumption, typical of many industrial, automotive, and consumer applications.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices (AMD) in a transaction that was completed in 2022. AMD is a leading multinational semiconductor company that develops computer processors and related technologies for business and consumer markets. The acquisition allowed AMD to broaden its portfolio and capabilities in high-performance computing, expanding its reach into markets where Xilinx's products are prevalent.
Application
1. Consumer Electronics: Used in HDTVs and set-top boxes for video processing.
2. Automotive: Supports infotainment systems and driver assistance functions.
3. Embedded Systems: Integral in hardware acceleration tasks.
4. Communications: Used in networking equipment for protocol bridging and data processing.
5. Industrial: Employed in motor control and industrial automation systems.
6. Medical Devices: Facilitates image processing and diagnostic equipment.
7. Test and Measurement: Assists in developing flexible and efficient testing instruments.
These applications leverage the FPGA's programmable logic, DSP capabilities, and high I/O counts.