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XC6SLX45-2CSG484I
+StücklisteIC FPGA 320 I/O 484CSBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX45-2CSG484I
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Paket CSBGA-484
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Auf Lager3647
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 3411 |
| Number of Logic Elements/Cells | 43661 |
| Total RAM Bits | 2138112 |
| Number of I/O | 320 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XC6SLX45-2CSG484I include:
1. Logic Cells: It contains around 43,661 logic cells, providing ample resources for complex designs.
2. I/O Pins: The device supports a high number of I/O configurations, enhancing versatility for different interface requirements.
3. DSP Slices: It incorporates DSP slices for efficient processing in signal processing applications.
4. Memory: The FPGA includes block RAM to support data buffering and storage.
5. Power and Performance: It offers a balance of power efficiency and performance, with a speed grade of -2.
6. Package: The CSG484 package includes 484 pins in a BGA (Ball Grid Array) format.
7. Temperature Range: The device is industrial-grade, suitable for operation in extended temperature ranges.
Overall, the XC6SLX45-2CSG484I is designed for applications requiring high performance at a lower cost and power consumption.
Equivalent
1. Intel (formerly Altera) Cyclone IV FPGA series.
2. Lattice Semiconductor's ECP3 series.
3. Microsemi (formerly Actel) SmartFusion2 or IGLOO2 FPGAs.
These alternatives might offer similar logic cell counts, I/O capabilities, and performance metrics, but specifics can vary, so it’s essential to compare based on the exact application requirements.
Features
1. Logic Cells: It comprises approximately 43,661 logic cells, which provide the necessary resources for implementing complex digital circuits.
2. Configurable Logic Blocks (CLBs): These blocks are used for logic synthesis and offer flexibility in design implementation.
3. Memory: It has 2,088 Kbits of block RAM for data storage and buffering.
4. DSP Slices: Includes 58 DSP slices which are useful for implementing high-speed arithmetic operations, such as those needed in signal processing.
5. I/Os: Provides 316 I/O pins for interfacing with other components and devices.
6. Clock Management: Features multiple DCMs (Digital Clock Managers) and PLLs (Phase-Locked Loops) for advanced clock signal control.
7. Power: Optimized for low power consumption, making it suitable for battery-powered and energy-efficient applications.
8. Temperature Range: The "-2I" designation indicates it is rated for industrial temperature ranges, suitable for operating in harsh environments.
9. Packaging: Offered in a CSG484 package.
This FPGA is ideal for a variety of applications, including consumer electronics, automotive, industrial control, and telecommunications.
Pinout
1. I/O Pins: These pins can be configured for various input and output standards and are used for interfacing with other devices.
2. Power and Ground Pins: Essential for supplying power to the FPGA and providing a ground connection.
3. Clock Pins: Used for clock input to provide timing signals for synchronous operations within the FPGA.
4. Configuration Pins: These are used for configuring the FPGA during the initialization process.
5. Dedicated Pins: Include JTAG interface pins for programming and debugging purposes.
6. Special-Purpose Pins: May include pins for specific functions such as reset or enable.
The detailed pin assignments and configurations can be found in the product's datasheet provided by Xilinx.
Manufacturer
Application
1. Embedded Systems: Used in control systems and IoT devices requiring adaptable processing capabilities.
2. Communications: Supports data processing and protocol bridging in networking equipment.
3. Industrial Automation: Facilitates real-time processing in robotics and machine control.
4. Consumer Electronics: Employed in applications needing customizable processing, like video and audio devices.
5. Medical Devices: Enhances processing in diagnostic equipment.
6. Automotive: Used in infotainment and advanced driver-assistance systems (ADAS) for flexible processing.
Its low power consumption and high-performance features make it suitable for cost-sensitive and space-constrained applications.