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XC6SLX75-2FGG676I
+StücklisteIC FPGA 408 I/O 676FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX75-2FGG676I
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Paket BGA-676
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Auf Lager5396
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 408 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The "-2" in the part number indicates the speed grade, with lower numbers signifying higher performance. This FPGA is designed to operate in the industrial temperature range, as denoted by the "I" at the end of the part number, making it suitable for applications requiring robust environmental performance.
The Spartan-6 series is known for delivering excellent power efficiency, enhanced DSP capabilities, and abundant I/O options, making the XC6SLX75-2FGG676I suitable for a wide range of applications including communications, automotive, industrial, and consumer electronics, where cost and performance are crucial.
Equivalent
1. Altera (now Intel) Cyclone IV FPGAs (e.g., EP4CE75).
2. Lattice ECP3 series (e.g., LFE3-70EA).
3. Microsemi (now Microchip) IGLOO or SmartFusion series with comparable capabilities.
Ensure to compare specific features like I/O count, memory, and performance to find a suitable equivalent.
Features
1. Logic Cells: It has approximately 74,880 logic cells, making it suitable for moderate complexity designs.
2. I/O Pins: The FPGA comes with 396 I/O pins, providing flexibility for interfacing with various peripherals.
3. Memory: It includes 3,096 Kbits of block RAM for efficient data storage and processing.
4. DSP Slices: The device contains 132 DSP slices, useful for high-performance signal processing applications.
5. Clock Management: It features 6 CMTs (Clock Management Tiles), each with one PLL and two DCMs for robust clock management.
6. Power Efficiency: Built on a 45nm process technology, it offers improved power efficiency.
7. Temperature Range: The "-2" speed grade indicates a balance between performance and power, and the "I" signifies an industrial-grade temperature range, suitable for harsh environments.
8. Package: It is housed in a FGG676 package, which is a fine-pitch ball grid array.
These features make it a versatile choice for various applications, including communications, automotive, and industrial systems.
Pinout
The XC6SLX75-2FGG676I offers a variety of functions, including:
1. Logic Resources: It is equipped with 11,662 logic slices, each with four 6-input LUTs and eight flip-flops, enabling complex combinational and sequential logic designs.
2. Memory: It includes 2,520 Kbits of Block RAM, allowing for storage of data and quick access.
3. DSP Slices: Equipped with 132 DSP slices, it is capable of efficient signal processing tasks.
4. I/O Pins: The device supports numerous I/O standards and has multiple I/O pins for interfacing with other components and systems.
5. Clock Management: It features advanced clock management capabilities, including PLLs for frequency synthesis and clock distribution.
This FPGA is ideal for applications requiring robust processing capabilities with a moderate pin count.
Manufacturer
Application
1. Industrial Automation: Used for control systems, robotics, and machine vision.
2. Consumer Electronics: Supports high-definition video processing and image enhancement.
3. Telecommunications: Facilitates data processing, signal routing, and communication systems.
4. Automotive: Employed in infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Supports imaging systems and diagnostic equipment.
6. Aerospace and Defense: Used in radar systems, avionics, and secure communications.
Its reconfigurable architecture allows for customization across various applications, providing flexibility and scalability.