XC6SLX75-3CSG484I

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XC6SLX75-3CSG484I

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IC FPGA 328 I/O 484CSBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC6SLX75-3CSG484I

  • Paket CSBGA-484

  • Auf Lager4334

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Spartan®-6 LX
Part Status Active
Number of LABs/CLBs 5831
Number of Logic Elements/Cells 74637
Total RAM Bits 3170304
Number of I/O 328
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC6SLX75-3CSG484I is a member of the Xilinx Spartan-6 FPGA family, designed to provide high-performance logic solutions. This specific model is encapsulated in a 484-ball grid array package and is geared toward industrial applications, as indicated by the "I" in its part number, which denotes an industrial-grade temperature range.
Key features of the XC6SLX75-3CSG484I include up to 74,376 logic cells, 4,656 slices, and 132 DSP slices, making it capable of handling complex processing tasks. It also integrates features like block RAM, DCM (Digital Clock Manager), and PLL (Phase-Locked Loop) for clock management, enhancing the control over timing and synchronization in designs.
The device is designed for low-power operation, which is crucial for energy-sensitive applications, and it supports a wide range of I/O standards to facilitate interoperability with various peripherals and components. The Spartan-6 family is known for its balance of performance, cost, and power efficiency, making it suitable for applications in communications, automotive, consumer electronics, and industrial control systems.

Equivalent

The XC6SLX75-3CSG484I is a Xilinx Spartan-6 FPGA. Equivalent products can include other FPGAs with similar logic capacity and performance from different manufacturers. Some alternatives are:
1. Altera (now Intel) Cyclone IV E series, like EP4CE75.
2. Lattice ECP3 series, such as LFE3-70EA.
3. Microsemi (Microchip) IGLOO2 or SmartFusion2 families, depending on specific feature needs.
When selecting an equivalent, consider factors like logic cells, I/O configurations, and power consumption.

Features

The XC6SLX75-3CSG484I is a member of the Xilinx Spartan-6 FPGA family, designed for low-cost, low-power applications. Key features include:
1. Logic Cells: It has 74,637 logic cells, supporting complex designs.
2. I/O Pins: The device provides up to 332 user I/O pins.
3. Package: Comes in a CSG484 package, a compact 484-pin ball grid array.
4. Memory: Includes 3,768 Kbits of block RAM for data storage.
5. Performance: Operates at a speed grade of -3, indicating a balance between speed and power consumption.
6. Power: Supports low-power applications with various power-saving features.
7. DSP Slices: Contains 132 DSP slices for efficient signal processing tasks.
8. Temperature Range: Suitable for industrial applications, operating within a temperature range of -40°C to 100°C.
9. Clock Management: Features 6 clock management tiles, each with phase-locked loops (PLLs).
10. Advanced Features: Supports high-speed serial communication and integrated memory controllers.
These features make it suitable for a wide range of applications, including consumer electronics, automotive systems, and industrial control.

Pinout

The XC6SLX75-3CSG484I is a part of the Xilinx Spartan-6 FPGA family. It features 484 pins in a Fine-Pitch Ball Grid Array (FBGA) package. The functions of the pins include:
1. Power and Ground Pins: These provide power supply and grounding to the FPGA.
2. I/O Pins: Used for general-purpose input and output operations, they support a variety of I/O standards.
3. Configuration Pins: Used for programming the FPGA, including pins for JTAG and other configuration methods.
4. Dedicated Clock Pins: For clock input and clock management.
5. Global Clock Network Pins: Help in distributing clock signals across the FPGA efficiently.
6. Special Function Pins: Include reset, mode select, and other control functions.
7. Multi-Gigabit Transceiver Pins: Designed for high-speed serial communication, if applicable.
The XC6SLX75 is designed for applications requiring a balance of performance and cost-effectiveness, suitable for applications in consumer electronics, industrial control, and communication systems.

Manufacturer

The XC6SLX75-3CSG484I is manufactured by Xilinx, Inc. Xilinx is a technology company that specializes in the development of programmable logic devices. They are well-known for their field-programmable gate arrays (FPGAs), which are integrated circuits designed to be configured by the customer or designer after manufacturing. FPGAs are used in a variety of applications, including telecommunications, automotive, aerospace, industrial, and consumer electronics. Xilinx's products are utilized in systems that require high-performance computing, signal processing, and adaptable hardware solutions. The company was founded in 1984 and has been a leader in the semiconductor industry, particularly in the development of reconfigurable computing technologies. Note that Xilinx was acquired by Advanced Micro Devices, Inc. (AMD) in February 2022, but it continues to operate as a brand under the AMD umbrella.

Application

The XC6SLX75-3CSG484I is a Xilinx Spartan-6 FPGA, which is used in various application areas due to its balance of cost, performance, and power efficiency. Common applications include:
1. Digital Signal Processing (DSP): Suitable for applications requiring signal filtering, modulation, and data conversion.
2. Embedded Systems: Used in system-on-chip designs for industrial automation, consumer electronics, and medical devices.
3. Communication Systems: Ideal for implementing protocols and interfaces in networking and telecommunications.
4. Automotive: Applied in infotainment systems and advanced driver-assistance systems (ADAS).
5. Prototyping and Development: Utilized in designing and testing new digital designs and algorithms.
These uses benefit from its programmable logic, memory, and DSP slices.

Package

The XC6SLX75-3CSG484I is a Xilinx Spartan-6 FPGA, and it comes in a CSG484 package type. The CSG484 refers to a 484-ball Fine-Pitch Ball Grid Array (FBGA), which is a type of surface-mount packaging used for integrated circuits, providing a compact and high-performance solution.

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