XC6SLX75-3FGG484C

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XC6SLX75-3FGG484C

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IC FPGA 280 I/O 484FBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC6SLX75-3FGG484C

  • Paket BGA-484

  • Auf Lager2494

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Spartan®-6 LX
Part Status Active
Number of LABs/CLBs 5831
Number of Logic Elements/Cells 74637
Total RAM Bits 3170304
Number of I/O 280
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)

Übersicht

Equivalent

The XC6SLX75-3FGG484C is a Spartan-6 FPGA. Equivalent alternatives include:
- Lattice ECP5 (e.g., LFE5UM-85F-8BG381C)
- Intel (Altera) Cyclone IV (e.g., EP4CE75F23C8N)
- Microsemi (Microchip) SmartFusion2 (e.g., M2S090-FGG484)
These offer similar logic capacity (~75K LUTs) and package compatibility (484-pin BGA). Choose based on power, performance, and ecosystem preferences.

Pinout

The XC6SLX75-3FGG484C is a Spartan-6 FPGA with the following key details:
- Pin Count: 484 (Fine-pitch Ball Grid Array, FGG484 package)
- Core Logic: 74,637 logic cells, optimized for cost-sensitive applications.
- I/O Pins: 296 user I/Os (supports multiple standards: LVCMOS, LVDS, etc.).
- Speed Grade: -3 (moderate performance).
- Features:
- DSP slices, block RAM (2,268 Kb), clock management (DCM, PLL).
- Supports PCIe, Gigabit Ethernet, and other high-speed interfaces.
Primary Use: Embedded systems, industrial control, communications, and consumer electronics.

Manufacturer

The XC6SLX75-3FGG484C is a Spartan-6 series FPGA (Field-Programmable Gate Array) manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and adaptive computing solutions. Known for innovation in reconfigurable hardware, Xilinx serves industries like telecommunications, automotive, aerospace, and data centers.
The XC6SLX75-3FGG484C is a mid-range FPGA with 74,637 logic cells, designed for cost-sensitive, high-performance applications. The "FGG484" denotes a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.

Application

The XC6SLX75-3FGG484C, a Spartan-6 FPGA, is used in:
- Embedded Systems: For control and interfacing in industrial, automotive, and consumer electronics.
- Communications: In networking, signal processing, and protocol bridging.
- Medical Devices: For real-time data acquisition and processing.
- Military/Aerospace: In rugged, high-reliability applications.
- Video & Imaging: For HD video processing and camera interfaces.
- IoT & Edge Computing: Enabling low-power, high-performance edge processing.
Its balance of cost, power efficiency, and performance makes it ideal for mid-range FPGA applications.

Package

The XC6SLX75-3FGG484C is a Spartan-6 FPGA from Xilinx. It comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package (FGG484). The "FGG" denotes the package type (Flip-Chip Fine-Pitch BGA), and "484" indicates the pin count. This package is designed for high-density, high-performance applications with a compact footprint.

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