Abbildungen dienen nur als Referenz
XC6SLX75-3FGG676C
+StücklisteIC FPGA 408 I/O 676FBGA
-
HerstellerAMD
-
Herstellerteil #XC6SLX75-3FGG676C
-
Auf Lager2997
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Base Product Number | XC6SLX75 |
| Digi Key Programmable | Not Verified |
| Number of LA Bs / CL Bs | 5831 |
| Number of Logic Elements / Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 408 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Packaging | Tray |
Übersicht
Description
The Spartan-6 family is built on a 45nm process technology, which enhances its power efficiency and performance capabilities. The XC6SLX75-3FGG676C is designed to support a wide range of applications, including consumer electronics, automotive, industrial, and communications. Key features include a high number of I/O pins, efficient DSP slices, and built-in memory blocks, which facilitate complex signal processing and data handling tasks.
Its low power consumption, combined with robust performance, makes it suitable for cost-sensitive applications requiring advanced processing capabilities. Additionally, it supports Xilinx's development tools, enabling easy integration and design flexibility for developers and engineers.
Equivalent
1. Intel (Altera) Cyclone IV EP4CE75 - Comparable in logic cells and performance.
2. Lattice ECP3 LFE3-70EA - Similar in logic capacity and I/O features.
3. Microsemi (Microchip) IGLOO2 M2GL090 - Offers similar logic resources and performance.
When selecting an equivalent FPGA, consider factors such as logic capacity, I/O count, power consumption, and specific application needs.
Features
1. Logic Resources: Contains 74,637 logic cells, offering a balance of performance and cost-effectiveness for a variety of applications.
2. Block RAM: Equipped with 3,096 Kbits of block RAM, providing ample storage for data and applications.
3. DSP Slices: Offers 132 DSP slices, enhancing performance for signal processing tasks.
4. I/O Pins: Supports up to 396 user I/Os, suitable for extensive peripheral interfacing.
5. Clock Management: Includes 12 clock management tiles, each with a phase-locked loop (PLL) for robust clock signal handling.
6. Power Consumption: Designed for low-power operation, ideal for battery-powered and energy-sensitive applications.
7. Package: Encased in a 676-pin Fine-Pitch Ball Grid Array (FBGA), ensuring reliable performance in a compact form factor.
8. Speed Grade: Operates at a -3 speed grade, denoting high performance within the Spartan-6 family.
Overall, the XC6SLX75-3FGG676C is versatile for various applications, from consumer electronics to industrial automation.
Pinout
The primary functions of the XC6SLX75 include:
1. Logic Functions: It supports a wide range of digital logic functions, offering thousands of programmable logic cells.
2. I/O Functions: The device provides numerous general-purpose I/O pins, with support for various I/O standards, making it versatile for different interfacing needs.
3. Memory: It includes block RAMs for storing data and configurations.
4. DSP Functions: The FPGA features dedicated DSP slices for efficient digital signal processing tasks.
5. Clock Management: It offers clock management tiles for synthesizing, distributing, and managing clock signals.
These features make the XC6SLX75 suitable for applications in communications, automotive, consumer electronics, and more.
Manufacturer
FPGAs like the Spartan-6 series are used in a wide range of applications, from consumer electronics to telecommunications and aerospace, due to their flexibility and capability to be configured by the customer or designer after manufacturing. Xilinx has been a major player in this sector, competing with other companies such as Intel (which acquired Altera, another major FPGA manufacturer). In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a leading semiconductor company, which further expanded AMD's offerings in the field of high-performance and adaptive computing.
Application
1. Embedded Systems: For implementing custom logic and interfacing with microcontrollers.
2. Communications: Used in telecommunications for protocol bridging, data processing, and signal interfacing.
3. Consumer Electronics: Applied in devices for video and audio processing.
4. Industrial Automation: Utilized for control systems, data acquisition, and motor control.
5. Automotive: Supports infotainment systems and advanced driver-assistance systems (ADAS).
6. Medical Devices: Employed for imaging and diagnostic equipment.
Its flexibility and cost-effectiveness make it suitable for a broad range of applications.