XC6SLX75-3FGG676C

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XC6SLX75-3FGG676C

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IC FPGA 408 I/O 676FBGA

  • HerstellerAMD

  • Herstellerteil #XC6SLX75-3FGG676C

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Attribut Wert
Series Spartan®-6 LX
Part Status Active
Base Product Number XC6SLX75
Digi Key Programmable Not Verified
Number of LA Bs / CL Bs 5831
Number of Logic Elements / Cells 74637
Total RAM Bits 3170304
Number of I/O 408
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Packaging Tray

Übersicht

Description

The XC6SLX75-3FGG676C is a member of the Xilinx Spartan-6 FPGA family, known for offering an optimal balance between cost, performance, and power efficiency. This specific model features 74,376 logic cells and is housed in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. It operates with a speed grade of -3, indicating a faster performance compared to lower-grade variants.
The Spartan-6 family is built on a 45nm process technology, which enhances its power efficiency and performance capabilities. The XC6SLX75-3FGG676C is designed to support a wide range of applications, including consumer electronics, automotive, industrial, and communications. Key features include a high number of I/O pins, efficient DSP slices, and built-in memory blocks, which facilitate complex signal processing and data handling tasks.
Its low power consumption, combined with robust performance, makes it suitable for cost-sensitive applications requiring advanced processing capabilities. Additionally, it supports Xilinx's development tools, enabling easy integration and design flexibility for developers and engineers.

Equivalent

The XC6SLX75-3FGG676C is a Xilinx Spartan-6 FPGA. Equivalent products could include:
1. Intel (Altera) Cyclone IV EP4CE75 - Comparable in logic cells and performance.
2. Lattice ECP3 LFE3-70EA - Similar in logic capacity and I/O features.
3. Microsemi (Microchip) IGLOO2 M2GL090 - Offers similar logic resources and performance.
When selecting an equivalent FPGA, consider factors such as logic capacity, I/O count, power consumption, and specific application needs.

Features

The XC6SLX75-3FGG676C is a member of the Xilinx Spartan-6 FPGA family, known for its cost-effective, low-power consumption and high-performance capabilities. Key features include:
1. Logic Resources: Contains 74,637 logic cells, offering a balance of performance and cost-effectiveness for a variety of applications.
2. Block RAM: Equipped with 3,096 Kbits of block RAM, providing ample storage for data and applications.
3. DSP Slices: Offers 132 DSP slices, enhancing performance for signal processing tasks.
4. I/O Pins: Supports up to 396 user I/Os, suitable for extensive peripheral interfacing.
5. Clock Management: Includes 12 clock management tiles, each with a phase-locked loop (PLL) for robust clock signal handling.
6. Power Consumption: Designed for low-power operation, ideal for battery-powered and energy-sensitive applications.
7. Package: Encased in a 676-pin Fine-Pitch Ball Grid Array (FBGA), ensuring reliable performance in a compact form factor.
8. Speed Grade: Operates at a -3 speed grade, denoting high performance within the Spartan-6 family.
Overall, the XC6SLX75-3FGG676C is versatile for various applications, from consumer electronics to industrial automation.

Pinout

The XC6SLX75-3FGG676C is a member of the Xilinx Spartan-6 FPGA family. It comes in an FGG676 package, which means it has a Fine-Pitch Ball Grid Array (FBGA) with 676 pins. This FPGA is designed for a variety of applications, providing a balance between cost, performance, and power consumption. It is typically used in applications requiring moderate logic density, connectivity, and signal processing capabilities.
The primary functions of the XC6SLX75 include:
1. Logic Functions: It supports a wide range of digital logic functions, offering thousands of programmable logic cells.
2. I/O Functions: The device provides numerous general-purpose I/O pins, with support for various I/O standards, making it versatile for different interfacing needs.
3. Memory: It includes block RAMs for storing data and configurations.
4. DSP Functions: The FPGA features dedicated DSP slices for efficient digital signal processing tasks.
5. Clock Management: It offers clock management tiles for synthesizing, distributing, and managing clock signals.
These features make the XC6SLX75 suitable for applications in communications, automotive, consumer electronics, and more.

Manufacturer

The XC6SLX75-3FGG676C is a part of the Spartan-6 FPGA (Field-Programmable Gate Array) family, and it is manufactured by Xilinx, Inc. Xilinx is a company that specializes in the development and production of programmable logic devices and associated software. Founded in 1984 and based in San Jose, California, Xilinx is known for its innovation in the field of programmable logic and was instrumental in the development of the FPGA technology.
FPGAs like the Spartan-6 series are used in a wide range of applications, from consumer electronics to telecommunications and aerospace, due to their flexibility and capability to be configured by the customer or designer after manufacturing. Xilinx has been a major player in this sector, competing with other companies such as Intel (which acquired Altera, another major FPGA manufacturer). In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a leading semiconductor company, which further expanded AMD's offerings in the field of high-performance and adaptive computing.

Application

The XC6SLX75-3FGG676C is a Spartan-6 FPGA from Xilinx, commonly used in various applications due to its balance of performance and cost. Key areas include:
1. Embedded Systems: For implementing custom logic and interfacing with microcontrollers.
2. Communications: Used in telecommunications for protocol bridging, data processing, and signal interfacing.
3. Consumer Electronics: Applied in devices for video and audio processing.
4. Industrial Automation: Utilized for control systems, data acquisition, and motor control.
5. Automotive: Supports infotainment systems and advanced driver-assistance systems (ADAS).
6. Medical Devices: Employed for imaging and diagnostic equipment.
Its flexibility and cost-effectiveness make it suitable for a broad range of applications.

Package

The XC6SLX75-3FGG676C is a Spartan-6 FPGA from Xilinx, featuring an FGG676 package type. This corresponds to a Fine-Pitch Ball Grid Array (FBGA) with 676 balls, offering a compact and efficient form factor suitable for high-density applications.

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