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IC FPGA 268 I/O 484FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC6SLX75T-2FGG484C
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Paket BBGA-484
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Auf Lager2657
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-6 LXT |
| Part Status | Active |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 268 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
Key features include:
1. Logic Cells: It contains around 74,637 logic cells, which offer a robust platform for implementing complex digital circuits.
2. Memory: The device includes abundant block RAM, useful for creating small memory arrays within the FPGA.
3. DSP Slices: It incorporates DSP slices, enhancing its ability to perform high-speed arithmetic operations, ideal for signal processing applications.
4. I/O Pins: The package includes 484 pins, providing flexibility in connecting to other components.
5. Power Efficiency: Designed to operate with optimal power consumption, making it suitable for both power-sensitive and high-performance applications.
6. Clock Management: Features advanced clock management capabilities to support high-speed designs.
The XC6SLX75T-2FGG484C is widely used in communications, automotive, industrial, and consumer electronics applications.
Equivalent
1. Altera Cyclone IV series, such as the EP4CE75.
2. Lattice ECP3 series, like the LFE3-70.
3. Microsemi/Microchip SmartFusion2 series, such as the M2S060.
These alternatives are from different manufacturers and may have variations in performance, power consumption, and features, so it's important to compare specifications based on your application needs.
Features
1. Logic Cells: It offers 74,637 logic cells, ideal for various digital logic applications.
2. Slices: Comprises 11,662 slices, each containing four 6-input LUTs and eight flip-flops.
3. Memory: Includes 3,096 Kbits of block RAM for data storage.
4. DSP Slices: Contains 132 DSP slices, supporting high-performance signal processing.
5. I/O Pins: Provides up to 338 I/O pins for interfacing with external components.
6. Clock Management: Equipped with 6 clock management tiles, each with phase-locked loops (PLLs).
7. Connectivity: Supports a variety of standards including PCI Express and GTP transceivers.
8. Power: Operates at a core voltage of 1.2V, with advanced power management features.
9. Package: Comes in a 484-ball fine-pitch ball grid array (FBGA).
These specifications make the XC6SLX75T-2FGG484C suitable for applications requiring moderate logic density and DSP capabilities, such as telecommunications, consumer electronics, and industrial automation.
Pinout
Key functions and features include:
1. Logic Resources: As part of the Spartan-6 family, it provides a mix of logic cells, block RAM, and DSP slices, suitable for digital signal processing, data processing, and control applications.
2. I/O Capabilities: The FPGA supports a variety of I/O standards and features high-speed connectivity options, which can be used for interfacing with other digital devices.
3. Power Management: It offers efficient power management features, making it suitable for power-sensitive applications.
4. Clock Management: The device includes clock management capabilities to manage complex timing requirements.
5. Configuration: It supports multiple configuration modes, making it flexible for various design and deployment scenarios.
Overall, the XC6SLX75T-2FGG484C is versatile, supporting complex designs while maintaining a cost-effective profile.