Abbildungen dienen nur als Referenz
XC6SLX9-2CSG324I
+StücklisteIC FPGA 200 I/O 324CSBGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC6SLX9-2CSG324I
-
Paket BGA-324
-
Auf Lager4850
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 715 |
| NumberofLogicElements/Cells | 9152 |
| TotalRAMBits | 589824 |
| NumberofI/O | 200 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Übersicht
Description
- Logic Cells: 9,152
- DSP Slices: 16
- Block RAM: 576 Kb
- I/O Pins: 232 (supports LVCMOS, LVDS, and other standards)
- Speed Grade: -2 (moderate performance)
- Package: 324-ball CSG324 (0.8mm pitch, RoHS-compliant)
It operates at 1.2V core voltage with low static power, making it suitable for embedded systems, industrial control, and consumer electronics. The Spartan-6 architecture balances performance and cost, offering integrated memory controllers, PCIe support, and flexible I/O.
Applications:
- Embedded processing
- Motor control
- Display interfaces
- Communication bridging
Requires Xilinx's ISE Design Suite or Vivado (with limitations) for development. Ideal for projects needing a compact, reliable FPGA with moderate logic density.
Equivalent
1. Lattice ECP5 (e.g., LFE5U-25F-6BG256C) – Lower power, smaller footprint.
2. Intel (Altera) Cyclone IV (e.g., EP4CE6E22C8N) – Comparable logic density.
3. Microsemi (Microchip) IGLOO2 (e.g., M2GL005-VFG256) – Low-power FPGA.
For pin-compatible replacements, consider other Spartan-6 variants like XC6SLX16-2CSG324I (higher density). Verify specs for exact compatibility.
Features
- Logic Cells: 9,152
- DSP Slices: 16 (18x18 multipliers)
- Block RAM: 576 Kb (32 x 18 Kb)
- Clock Management: 4 DCMs, 2 PLLs
- I/O Pins: 232 (supports LVCMOS, LVDS, HSTL, SSTL)
- Max Speed Grade: -2 (performance-optimized)
- Package: CSG324 (324-ball BGA, 0.8mm pitch)
- Operating Temp: Industrial (-40°C to +100°C)
- Power: 1.2V core, 2.5V/3.3V I/O
- Transceivers: None (Spartan-6 LX lacks GTP/GTX)
Ideal for cost-sensitive, low-power designs like embedded control, industrial, and consumer applications.
Pinout
- Pin count: 324 (CSG324 package).
- Key functions:
- User I/O: Up to 232 general-purpose I/Os (varies by configuration).
- Power pins: Multiple for core (VCCINT), I/O banks (VCCO), and auxiliary (VCCAUX).
- Configuration pins: JTAG (TDI, TDO, TMS, TCK), SPI, or SelectMAP.
- Clock inputs: Differential/single-ended via global/regional clock pins.
- Special functions: Dedicated pins for DDR memory, differential signaling (LVDS), and analog (VREF).
This FPGA is optimized for low-cost, low-power applications with moderate logic density (~9K logic cells).
Manufacturer
Xilinx (AMD) is a leading semiconductor company specializing in programmable logic devices (FPGAs, SoCs) and adaptive computing solutions. Known for innovation in reconfigurable hardware, Xilinx serves industries like telecommunications, automotive, aerospace, and data centers.
The Spartan-6 family is a cost-optimized FPGA line, balancing performance and power efficiency for embedded applications. The XC6SLX9-2CSG324I features 9,152 logic cells and a 324-pin CSG package.
Application
- Embedded Systems – Industrial control, automation.
- Consumer Electronics – Displays, smart devices.
- Communications – Basic networking, protocol bridging.
- Automotive – Infotainment, driver assistance.
- Medical Devices – Portable diagnostic equipment.
- IoT & Edge Computing – Sensor processing, data aggregation.
Its small form factor, low power, and moderate logic capacity make it ideal for compact, efficient designs.