XC6SLX9-3FTG256C

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XC6SLX9-3FTG256C

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IC FPGA 186 I/O 256FTBGA

  • HerstellerAMD

  • Herstellerteil #XC6SLX9-3FTG256C

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Attribut Wert
Series Spartan®-6 LX
Part Status Active
Base Product Number XC6SLX9
Digi Key Programmable Not Verified
Number of LA Bs / CL Bs 715
Number of Logic Elements / Cells 9152
Total RAM Bits 589824
Number of I/O 186
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Packaging Tray

Übersicht

Description

The XC6SLX9-3FTG256C is a part of the Xilinx Spartan-6 FPGA family, designed for various digital processing applications. It features a robust architecture that offers a balance between performance, cost, and power efficiency, making it suitable for consumer, automotive, and industrial applications.
Key specifications include:
1. Logic Cells: It contains approximately 9,152 logic cells, which are used for implementing custom digital circuits.

2. Memory: The FPGA is equipped with various memory resources, including block RAM to store data and perform complex computations.
3. DSP Slices: The device features dedicated DSP (Digital Signal Processing) slices for efficient mathematical operations, making it well-suited for signal processing tasks.
4. I/O Options: It provides flexible I/O standards and supports a diverse range of interfacing options.
5. Package: The FTG256C designation indicates the package type, which is a fine-pitch ball grid array, suitable for compact and dense PCB designs.
Overall, the XC6SLX9-3FTG256C is an efficient solution for applications requiring moderate logic density with substantial flexibility and performance.

Equivalent

The XC6SLX9-3FTG256C is a Xilinx Spartan-6 FPGA. Equivalent products from other manufacturers may include:
1. Intel Cyclone IV series (e.g., EP4CE10F17C8N)
2. Lattice ECP3 series (e.g., LFE3-17EA-7FN484C)
3. Microsemi (now Microchip) IGLOO2 series (e.g., M2GL010-TQ144)
These alternatives offer similar features in terms of logic elements and I/O capabilities but may differ in terms of power consumption and specific functionalities. Always compare datasheets for compatibility and specific requirements.

Features

The XC6SLX9-3FTG256C is a member of the Xilinx Spartan-6 FPGA family, known for its cost-effectiveness and performance efficiency. Key features include:
1. Logic Cells: Approximately 9,152 logic cells.
2. Slices: Contains about 1,430 slices, each with four 6-input LUTs and eight flip-flops.
3. Memory: Offers up to 32 Kbits of block RAM.
4. Clock Management: Equipped with 4 clock management tiles, each containing a phase-locked loop (PLL).
5. I/Os: Provides up to 186 I/O pins, supporting various I/O standards.
6. Performance: Supports a maximum operating frequency of about 800 MHz.
7. Power: Designed to optimize power efficiency, suitable for low-power applications.
8. Package: Comes in a 256-ball fine-pitch ball grid array (FTG256).
9. Applications: Ideal for applications in communications, automotive, consumer electronics, and industrial sectors.
These features make the XC6SLX9-3FTG256C suitable for a diverse range of applications that require a balance of performance and cost.

Pinout

The XC6SLX9-3FTG256C is a part of the Xilinx Spartan-6 FPGA family. It comes in a 256-pin Fine-Pitch Thin Quad Flat Pack (FTQFP) package. This FPGA is designed to provide a cost-effective solution for applications requiring high performance and low power consumption.
Functions include:
1. Logic Cells: The FPGA contains approximately 9,152 logic cells, providing configurable logic blocks (CLBs) for various digital logic designs.
2. I/O Pins: It features multiple I/O pins for interfacing with external devices and peripherals.
3. DSP Slices: Includes DSP slices for efficient processing of computationally intensive tasks.
4. Memory: Contains block RAM for data storage and FIFO configurations.
5. Clock Management: Offers clock management features such as Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs).
6. Configuration: Supports various configuration modes including JTAG and SPI.
The XC6SLX9-3FTG256C is suitable for a wide range of applications, including telecommunications, automotive, consumer electronics, and industrial control systems.

Manufacturer

The XC6SLX9-3FTG256C is manufactured by Xilinx, Inc. Xilinx is a company that specializes in the production of programmable logic devices, most notably Field-Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs). Founded in 1984 and headquartered in San Jose, California, Xilinx played a pioneering role in the development of FPGAs, which are integrated circuits that can be configured by a customer or a designer after manufacturing—hence "field-programmable."
Xilinx's products are widely used in various industries, including telecommunications, automotive, aerospace, defense, and consumer electronics, due to their flexibility and efficiency in handling complex processing tasks. In addition to FPGAs, Xilinx also offers design software and IP cores to aid in the development of custom applications.
As of 2020, Xilinx became a part of Advanced Micro Devices, Inc. (AMD) after a significant acquisition. This merger expanded AMD's capabilities in the data center and embedded solutions markets, enhancing its portfolio with Xilinx's established expertise in adaptive computing.

Application

The XC6SLX9-3FTG256C is a part of Xilinx's Spartan-6 FPGA family, which is commonly used in applications requiring low power consumption and cost-effectiveness. Key application areas include digital signal processing (DSP), embedded systems, industrial automation, telecommunications infrastructure, consumer electronics, and automotive systems. These FPGAs are particularly suitable for applications like motor control, video processing, and data acquisition due to their balance of performance and efficiency. Additionally, their flexibility makes them ideal for prototyping and developing custom hardware solutions in various industries.

Package

The XC6SLX9-3FTG256C is a Spartan-6 FPGA from Xilinx. It comes in a FTG256 package type, which is a Fine-Pitch Ball Grid Array (FBGA) with 256 balls. This package is designed for efficient heat dissipation and reliable connectivity in compact applications.

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