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XC6SLX9-3FTG256I
+StücklisteIC FPGA 186 I/O 256FTBGA
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HerstellerAMD
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Herstellerteil #XC6SLX9-3FTG256I
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Auf Lager5209
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Spezifikationen
| Attribut | Wert |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Total RAM Bits | 589824 |
| Number of I/O | 186 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | XC6SLX9 |
| Number of Logic Elements / Cells | 9152 |
| Number of LA Bs / CL Bs | 715 |
Übersicht
Description
The "FTG" in the part number indicates a fine-pitch ball grid array (FBGA) package with 256 balls. The device supports various features like DSP slices, block RAM, and configurable logic blocks, making it suitable for a range of applications, including consumer electronics, automotive, and industrial control.
Additionally, it offers enhanced security features and a rich set of development tools, such as the Xilinx ISE Design Suite, to aid in the design and implementation of complex digital circuits. The XC6SLX9-3FTG256I is ideal for users seeking a balance of performance, power efficiency, and cost-effectiveness in their FPGA designs.
Equivalent
1. Lattice ECP5 series (e.g., LFE5UM-25F-6MG281C)
2. Intel/Altera Cyclone IV (e.g., EP4CE15F23C7)
3. Microsemi SmartFusion (e.g., M2S010-1FGG484)
4. Xilinx Artix-7 (e.g., XC7A6T-1FTG256C)
These alternatives may vary in specifications, so ensure to check compatibility for your specific application.
Features
- Logic Cells: 9,152 logic cells with support for up to 27,648 flip-flops.
- Memory: Includes 576 Kbits of block RAM.
- I/O: Up to 2,000 I/O pins with support for various I/O standards.
- DSP Slices: 18 DSP slices for high-performance digital signal processing.
- Configuration: Supports multiple configuration options, including JTAG and SPI.
- Power: Offers low static and dynamic power consumption.
- Clock Management: Integrated Digital Clock Manager (DCM) and Phase-Locked Loop (PLL).
- Package: Available in a 256-ball FGPA package (FTG256).
- Performance: Operates with a maximum clock frequency of up to 100 MHz.
This FPGA is ideal for applications in communications, automotive, industrial, and consumer electronics.
Pinout
The XC6SLX9 includes resources such as configurable logic blocks (CLBs), digital signal processing (DSP) slices, block RAM, and support for multiple I/O protocols. Additionally, it offers capabilities for interfacing with high-speed serial transceivers and provides flexibility for implementing custom digital logic and processing tasks. The FPGA is commonly used in applications such as communications, automotive, industrial control, and consumer electronics.
Manufacturer
In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor industry. The XC6SLX9-3FTG256I is part of the Spartan-6 FPGA family, which is designed for low-power applications and cost-sensitive markets, making it suitable for a range of embedded and consumer applications. Xilinx focuses on innovation in programmable devices, providing hardware and software solutions that enable engineers to create customizable and efficient designs.
Application
1. Embedded Systems: Ideal for low-power designs in consumer electronics.
2. Motor Control: Used in automation and robotics for precise motor control applications.
3. Signal Processing: Suitable for real-time data processing in telecommunications and audio/video systems.
4. Industrial Automation: Employed in control systems and monitoring applications.
5. Medical Devices: Utilized in imaging and diagnostic equipment for processing tasks.
6. Prototyping: Serves as a platform for developing and testing custom digital circuits.
Its versatility and low power consumption make it valuable across these fields.