Abbildungen dienen nur als Referenz
XC7A100T-2FGG484I
+StücklisteIC FPGA 285 I/O 484FBGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC7A100T-2FGG484I
-
Paket FCBGA-484
-
Auf Lager1678
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 7925 |
| Number of Logic Elements/Cells | 101440 |
| Total RAM Bits | 4976640 |
| Number of I/O | 285 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The XC7A100T features approximately 101,440 logic cells, offering significant flexibility for implementing complex designs. It is equipped with DSP slices, block RAM, and clock management resources, enhancing its capabilities in signal processing tasks. This FPGA is part of Xilinx's cost-optimized series, offering a balance between performance and cost, making it ideal for applications requiring efficient processing and flexibility.
Equivalent
Features
1. Logic Cells: Approximately 101,440 logic cells.
2. CLB Flip-Flops: Around 126,800.
3. Block RAM: Features around 4,860 Kb of block RAM.
4. DSP Slices: Contains 240 DSP slices.
5. I/O Pins: Supports up to 285 user I/O pins.
6. Clock Management: Includes 6 clock management tiles, each with a mixed-mode clock manager (MMCM) and a phase-locked loop (PLL).
7. Performance Grade: Speed grade -2, indicating a balance between power consumption and performance.
8. Package: FGG484, a fine-pitch ball grid array with 484 pins.
9. Temperature Range: Industrial grade, supporting -40°C to +100°C.
10. Power Efficiency: Designed for low power consumption with advanced process technology.
The Artix-7 family targets applications such as communications, automotive, and industrial systems, offering a good balance of performance and cost.
Pinout
Key functions of the XC7A100T-2FGG484I include:
1. Programmable Logic: It features approximately 101,440 logic cells, suitable for various digital circuit designs.
2. DSP Slices: Contains 240 DSP slices for signal processing tasks.
3. Memory: Includes 4,860 Kbits of block RAM for data storage.
4. I/O Capability: Offers 285 general-purpose I/O pins for interfacing with other components.
5. Low Power: Designed for low power consumption, making it efficient for portable and embedded applications.
6. High Performance: Provides high-speed connectivity and performance for a range of applications, including communications, automotive, and industrial control.
This model provides a balance of high performance and low power, making it suitable for a variety of applications that require flexible hardware acceleration and processing capabilities.
Manufacturer
Application
1. Communications: Used for wireless infrastructure, gigabit passive optical networks (GPON), and data center networks.
2. Broadcast and Pro AV: Suitable for video processing, encoding, and transmission.
3. Industrial: Employed in motor control, machine vision, and industrial networking.
4. Automotive: Utilized in driver assistance systems and infotainment.
5. Consumer Electronics: Applied in next-generation displays and set-top boxes.
These applications leverage the FPGA's capabilities in digital signal processing, logic integration, and adaptability.